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    • 5. 发明授权
    • Multilayer wiring structure for memory circuit
    • 存储电路的多层布线结构
    • US07863751B2
    • 2011-01-04
    • US12171650
    • 2008-07-11
    • Satoru Takase
    • Satoru Takase
    • H01L29/40
    • H01L27/24
    • A semiconductor integrated circuit device includes: a semiconductor substrate, on which diffusion layers are formed; and multilayered wirings stacked above the semiconductor substrate to be connected to the diffusion layers via contact plugs, wherein a first wring and a second wiring formed thereabove are connected to the diffusion layers via first contact plug(s) and second contact plugs, respectively, and the number of the second contact plugs arrayed in parallel is set to be greater than that of the first contact plug(s).
    • 一种半导体集成电路器件,包括:形成有扩散层的半导体衬底; 以及层叠在半导体衬底上方的多层布线,以通过接触插塞连接到扩散层,其中形成在其上的第一布线和第二布线分别经由第一接触插塞和第二接触插塞连接到扩散层,并且 排列成并联的第二接触插塞的数量被设定为大于第一接触插塞的数量。
    • 6. 发明授权
    • Systems and methods for data transfers between memory cells
    • 存储单元之间数据传输的系统和方法
    • US07808854B2
    • 2010-10-05
    • US12033198
    • 2008-02-19
    • Satoru Takase
    • Satoru Takase
    • G11C7/00
    • G11C7/08G11C7/065G11C7/1048G11C7/18G11C11/4091G11C11/4096G11C11/4097
    • Systems and methods for reducing the latency of data transfers between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. In one embodiment, a memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifiers, a second-level sense amplifier and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct data transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) to the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier.) The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic.
    • 通过使数据能够在存储器系统中的读出放大器之间直接传输来减少存储器单元之间的数据传输的延迟的系统和方法。 在一个实施例中,存储器系统使用具有一对第一电平读出放大器,第二电平读出放大器和用于读出放大器的控制逻辑的常规DRAM存储器结构。 每个读出放大器被配置为选择性地耦合到数据线。 在直接数据传输模式中,控制逻辑产生控制信号,使得读出放大器将数据从第一级读出放大器(源读出放大器)的第一级传输到第二级读出放大器, 第一级读出放大器(目标读出放大器)中的第二级。这些读出放大器的结构是常规的,并且系统的操作由修改的控制逻辑实现。
    • 7. 发明申请
    • Systems and Methods for Data Transfers Between Memory Cells
    • 记忆单元之间数据传输的系统和方法
    • US20090207679A1
    • 2009-08-20
    • US12033198
    • 2008-02-19
    • Satoru Takase
    • Satoru Takase
    • G11C7/08
    • G11C7/08G11C7/065G11C7/1048G11C7/18G11C11/4091G11C11/4096G11C11/4097
    • Systems and methods for reducing the latency of data transfers between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. In one embodiment, a memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifiers, a second-level sense amplifier and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct data transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) to the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier.) The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic.
    • 通过使数据能够在存储器系统中的读出放大器之间直接传输来减少存储器单元之间的数据传输的延迟的系统和方法。 在一个实施例中,存储器系统使用具有一对第一电平读出放大器,第二电平读出放大器和用于读出放大器的控制逻辑的常规DRAM存储器结构。 每个读出放大器被配置为选择性地耦合到数据线。 在直接数据传输模式中,控制逻辑产生控制信号,使得读出放大器将数据从第一级读出放大器(源读出放大器)的第一级传输到第二级读出放大器, 第一级读出放大器(目标读出放大器)中的第二级。这些读出放大器的结构是常规的,并且系统的操作由修改的控制逻辑实现。
    • 8. 发明授权
    • Systems and methods for improving memory reliability
    • 提高内存可靠性的系统和方法
    • US07573735B2
    • 2009-08-11
    • US11530271
    • 2006-09-08
    • Satoru TakaseTakehito Sasaki
    • Satoru TakaseTakehito Sasaki
    • G11C11/00
    • G11C11/413G11C5/143G11C5/147
    • Systems and methods for reducing instability and writability problems arising from relative variations between voltages at which memory cells and logic components that access the memory cells operate by inhibiting memory accesses when the voltages are not within an acceptable operating range. One embodiment comprises a pipelined processor having logic components which receive power at a first voltage and a set of SRAM cells which receive power at a second voltage. A critical condition detector is configured to monitor the first and second voltages and to determine whether the ratio of these voltages is within an acceptable range. When the voltages are not within the acceptable range, an exception is generated, and an exception handler stalls the processor pipeline to inhibit accesses to the SRAM cells. When the voltages return to the acceptable range, the exception handler resumes the pipeline and completes handling of the exception.
    • 用于减少由电压之间的相对变化引起的不稳定性和可编写性问题的系统和方法,其中存储单元和访问存储器单元的逻辑组件通过在电压不在可接受的工作范围内时禁止存储器访问而工作。 一个实施例包括流水线处理器,其具有在第一电压处接收功率的逻辑部件和以第二电压接收功率的一组SRAM单元。 临界条件检测器被配置为监视第一和第二电压并且确定这些电压的比率是否在可接受的范围内。 当电压不在可接受范围内时,产生异常,异常处理程序使处理器流水线停止以禁止对SRAM单元的访问。 当电压返回到可接受的范围时,异常处理程序将恢复流水线并完成异常的处理。
    • 9. 发明申请
    • Systems and Methods for Determining Variations in Voltages Applied to an Integrated Circuit Chip
    • 确定应用于集成电路芯片的电压变化的系统和方法
    • US20080249727A1
    • 2008-10-09
    • US11696381
    • 2007-04-04
    • Satoru Takase
    • Satoru Takase
    • G01R19/00
    • G01R31/3012G01R31/3004
    • Systems and methods for determining local voltages provided by a power distribution network to an integrated circuit chip by applying an external voltage to a power distribution network, firing a set of current sources distributed across the chip and measuring local voltages on the chip. The current sources may, for example, comprise a clock tree carrying a free-running clock signal, or multiple individual current source structures. The voltages may be measured, for instance, by units comprising voltage controlled oscillators (VCO's) coupled to counters which determine the corresponding oscillation frequencies and registers which store the resulting oscillation counts. The measured voltages may be used to identify non-uniformities in the voltage applied across the chip, as well as to determine local differences in the resistance of the power distribution network.
    • 通过向配电网络施加外部电压来确定由配电网络向集成电路芯片提供的局部电压的系统和方法,点燃分布在芯片上的一组电流源并测量芯片上的局部电压。 电流源可以例如包括携带自由运行时钟信号的时钟树,或多个单独的电流源结构。 电压可以例如通过耦合到确定相应振荡频率的计数器的压控振荡器(VCO)和存储所得到的振荡计数的寄存器的单元来测量。 测量的电压可用于识别施加在芯片上的电压中的不均匀性,以及确定配电网络的电阻的局部差异。
    • 10. 发明申请
    • System and method for configuring conductors within an integrated circuit to reduce impedance variation caused by connection bumps
    • 用于在集成电路内配置导体以减少由连接凸起引起的阻抗变化的系统和方法
    • US20060267706A1
    • 2006-11-30
    • US11137296
    • 2005-05-25
    • Satoru Takase
    • Satoru Takase
    • H01P5/02
    • H01L23/64H01L23/5286H01L2924/0002H01L2924/3011H01P5/02H01L2924/00
    • Systems and methods for improved semiconductor device performance are disclosed. In particular, presented are improved semiconductor systems and methods for configuring conductors to reduce impedance variation caused by proximity and/or density and/or operation of connection-bumps. The invention includes adding impedance-reducing conductive features which add no additional functionality to the semiconductor device. The added features may be arranged in areas of sparse connection-bump density. Impedance-reducing conductive features may include metal lines added between functional metal lines, where placement between adjacent functional lines may vary. Impedance-reducing conductive features may be added to any one or combination of conductive layers, and added features may act upon any one or combination of functional features. Further, added features may be electrically active and responsive to semiconductor device operation. Also, methods for determining connection-bump density, which methods may be automated.
    • 公开了用于改善半导体器件性能的系统和方法。 具体地,提出了改进的半导体系统和用于配置导体以减少由接近和/或密度和/或连接凸块的操作引起的阻抗变化的方法。 本发明包括增加阻抗减小的导电特征,其不对半导体器件增加额外的功能。 附加的特征可以布置在稀疏连接 - 凸起密度的区域中。 阻抗减小的导电特征可以包括在功能金属线之间添加的金属线,其中相邻功能线之间的放置可以变化。 阻抗减小的导电特征可以被添加到导电层的任何一个或组合,并且附加的特征可以作用于功能特征的任何一个或组合。 此外,附加的特征可以是电活动的并且响应于半导体器件操作。 另外,用于确定连接凸块密度的方法,哪些方法可以是自动化的。