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1. 发明授权

US5650498A Water-soluble azo compound in the form of granules having a spherical shape and process for producing the same 失效
标题翻译：具有球形形状的颗粒形式的水溶性偶氮化合物及其制备方法
公开(公告)号：US5650498A
公开(公告)日：1997-07-22
申请号：US325510
申请日：1994-10-19
申请人： Hideo Amo , Masaya Kajimoto , Akihiko Goto
发明人： Hideo Amo , Masaya Kajimoto , Akihiko Goto
IPC分类号： C07D247/00 , B01J2/00 , C07C245/02 , C07C255/65 , C07C257/14 , C07C257/16 , C07D229/00 , C09B67/00 , C07C245/00
CPC分类号： B01J2/00 , C09B67/0095
摘要： The present invention provides a process for producing a spherical granule of a water-soluble azo compound, which comprises dispersing a water-soluble azo compound in a water-insoluble solvent and then add dropwise water or a hydrophilic solvent dissolving the water-soluble azo compound with stirring to granulate the water-soluble azo compound in the solution, and produce the spherical granule of the water-soluble azo compound.
摘要翻译：本发明提供了一种制备水溶性偶氮化合物的球形颗粒的方法，其包括将水溶性偶氮化合物分散在水不溶性溶剂中，然后滴加水或溶解水溶性偶氮化合物的亲水溶剂搅拌，将溶液中的水溶性偶氮化合物颗粒化，制成水溶性偶氮化合物的球形颗粒。

2. 发明授权

US6010823A Resist compositions for plating 失效
标题翻译：电镀抗蚀组合物
公开(公告)号：US6010823A
公开(公告)日：2000-01-04
申请号：US813985
申请日：1997-03-10
申请人： Akihiko Goto , Yoshitaka Ono
发明人： Akihiko Goto , Yoshitaka Ono
IPC分类号： G03F7/032 , G03F7/038 , H05K3/18 , G03C1/73
CPC分类号： G03F7/0388 , G03F7/032 , G03F7/0385 , H05K3/184
摘要： A resist composition for plating comprises a partial-acrylated, uncured novolac type epoxy resin as a photosensitive resin ingredient and an imidazole curing agent as a curing agent, wherein the imidazole curing agent is liquid at 25.degree. C. or the composition contains an acrylic ester polymer having a molecular weight of 500-5000. By using such a resist composition can be provided a printed wiring board having excellent conduction reliability and heat cycle property.
摘要翻译：电镀抗蚀剂组合物包含作为感光性树脂成分的部分丙烯酸酯化的未固化的酚醛清漆型环氧树脂和作为固化剂的咪唑固化剂，其中咪唑固化剂在25℃下为液体，或者该组合物含有丙烯酸酯聚合物的分子量为500-5000。通过使用这种抗蚀剂组合物，可以提供具有优异的导电可靠性和热循环特性的印刷线路板。

3. 发明授权

US4614079A Automatic packaging system 失效
标题翻译：自动包装系统
公开(公告)号：US4614079A
公开(公告)日：1986-09-30
申请号：US634628
申请日：1984-07-26
申请人： Keizo Ida , Akihiko Goto
发明人： Keizo Ida , Akihiko Goto
IPC分类号： B65B3/02 , B65B43/34
CPC分类号： B65B3/025 , B65B3/02
摘要： An automatic packaging system comprising a container fabricating mechanism for forming a tubular structure from laminated paper capable of heat sealing, marking folding guidelines for forming rectangular-prism-shaped containers, cutting individual pouched containers from the tubular structure, and shaping one end of each pouched container, and a packaging mechanism for filling the shaped containers with a filling material and sealing the openings of the containers. The container fabricating mechanism includes a rotating mandrel mechanism formed of a plurality of radially arranged pairs of forming plates to receive the cut pouched containers. The packaging mechanism includes an endless conveyor mechanism for feeding the containers processed by the container fabricating mechanism, and a deflating mechanism for removing air from the top inside spaces of the containers filled with the filling material, a lug folding/heat-sealing mechanism for heat-sealing the openings of the containers immediately after deflation and then folding and heat-sealing the heat-sealed portions flat.
摘要翻译：一种自动包装系统，包括用于从能够热封的层压纸形成管状结构的容器制造机构，标记用于形成矩形棱柱形容器的折叠指南，从管状结构切割单个袋装容器，以及将每个袋装的一端容器和用于用填充材料填充成形容器并密封容器的开口的包装机构。容器制造机构包括由多个径向排列的成对板对形成的旋转心轴机构，以容纳切割的袋状容器。包装机构包括用于供给由容器制造机构处理的容器的循环输送机构，以及用于从填充有填充材料的容器的顶部内部空间除去空气的放气机构，用于加热的凸耳折叠/热封机构 - 在放气后立即封闭容器的开口，然后将热封部分折叠并热封。

4. 发明授权

US06873167B2 Connection box, system, and method for evaluating a DUT board 失效
标题翻译：用于评估DUT板的连接盒，系统和方法
公开(公告)号：US06873167B2
公开(公告)日：2005-03-29
申请号：US10279519
申请日：2002-10-24
申请人： Akihiko Goto , Yuko Iwasaki , Tsuyoshi Tanaka , Koji Tokuno
发明人： Akihiko Goto , Yuko Iwasaki , Tsuyoshi Tanaka , Koji Tokuno
IPC分类号： G01R31/26 , G01R31/04 , G01R31/28 , H01R31/00 , H01R43/00 , G01R31/02
CPC分类号： H01R31/005 , G01R31/2851 , G01R31/2889 , H01R2201/20
摘要： An evaluation device and method for DUT boards and probe cards which increase the reproducibility of the measured values and decrease the abrasion of pads in evaluation tests. A connection box is provided with contact pins, mounting mechanisms used to mount the DUT boards, and a plurality of connectors which feed signals from the contact pins to the outside.
摘要翻译：一种用于DUT板和探针卡的评估装置和方法，其在评估测试中增加测量值的重现性并减少垫的磨损。连接盒设置有接触针，用于安装DUT板的安装机构，以及将接触针的信号馈送到外部的多个连接器。

5. 发明授权

US4728556A Electrostatic recording medium 失效
标题翻译：静电记录介质
公开(公告)号：US4728556A
公开(公告)日：1988-03-01
申请号：US892325
申请日：1986-08-04
申请人： Takao Igawa , Susumu Nemoto , Mitsuru Maeda , Akihiko Goto , Taeko Maeda
发明人： Takao Igawa , Susumu Nemoto , Mitsuru Maeda , Akihiko Goto , Taeko Maeda
IPC分类号： G03G5/02 , B32B5/28 , B32B27/06
CPC分类号： G03G5/0217 , G03G5/0205 , G03G5/0214 , Y10T428/25 , Y10T428/31692 , Y10T428/31895
摘要： An electrostatic recording medium is disclosed, which comprises a substrate, an electroconductive layer, and a recording layer which are successively overlaid on the substrate, with the surface of the recording layer being studded with at least one component selected from the group consisting of a polymeric electrolyte, an inorganic salt and a surface active agent.
摘要翻译：公开了一种静电记录介质，其包括依次覆盖在基板上的基板，导电层和记录层，记录层的表面上镶嵌有至少一种选自聚合物电解质，无机盐和表面活性剂。

6. 发明申请

US20060255821A1 Interface assembly and dry gas enclosing apparatus using same 失效
标题翻译：接口组件和使用其的干燥气体封闭装置
公开(公告)号：US20060255821A1
公开(公告)日：2006-11-16
申请号：US11407479
申请日：2006-04-20
申请人： Akihiko Goto
发明人： Akihiko Goto
IPC分类号： G01R31/02
CPC分类号： G01R31/2889
摘要： An interface assembly provided at a test head, for connecting a probe card to the test head. The interface assembly includes an interface comprising an interface body and a coaxial connector supported by the interface body, and a casing for enclosing a dry gas that is introduced between the test head and the probe card and leaks into the test head through a gap formed by the interface (20) in a state where the coaxial connector is engaged with a mating coaxial connector provided at the probe card. An interface assembly provided at a test head, for connecting a probe card to the test head, the interface assembly comprising: an interface comprising an interface body and a coaxial connector supported by the interface body; and a cover member provided at the interface, for enclosing a dry gas that is introduced between the test head and the probe card and leaks into the test head through a gap formed by the interface in a state where the coaxial connector is engaged with a mating coaxial connector provided at the probe card.
摘要翻译：设置在测试头的接口组件，用于将探针卡连接到测试头。所述接口组件包括接口主体和由所述接口体支撑的同轴连接器的接口，以及用于封闭干燥气体的壳体，所述干燥气体被引入到所述测试头和所述探针卡之间，并通过由所述测试头形成的间隙而泄漏到所述测试头中所述接口（20）处于所述同轴连接器与设置在所述探针卡处的配合同轴连接器接合的状态。一种接口组件，设置在测试头处，用于将探针卡连接到测试头，所述接口组件包括：接口，包括接口主体和由所述接口体支撑的同轴连接器; 以及设置在界面处的盖构件，用于封闭引入测试头和探针卡之间的干燥气体，并且在同轴连接器与配合物接合的状态下通过由界面形成的间隙而泄漏到测试头中同轴连接器设置在探针卡上。

7. 发明授权

US06563567B1 Method and apparatus for illuminating a surface using a projection imaging apparatus 失效
公开(公告)号：US06563567B1
公开(公告)日：2003-05-13
申请号：US09540874
申请日：2000-03-31
申请人： Hideki Komatsuda , Osamu Tanitsu , Akihiko Goto , Nobumichi Kanayamaya , Masato Shibuya , Tetsuo Takahashi
发明人： Hideki Komatsuda , Osamu Tanitsu , Akihiko Goto , Nobumichi Kanayamaya , Masato Shibuya , Tetsuo Takahashi
IPC分类号： G03B2772
CPC分类号： G03F7/70075 , G03F7/701 , G03F7/70108 , G03F7/70158 , G03F7/70183 , G03F7/7025
摘要： A method and illumination optical system forms a modified illumination configuration on an optical integrator so that a secondary light source having a desired modified illumination configuration is formed and light loss is minimized. A light beam shape changing element that diffuses illumination in a plurality of directions, and an angular light beam forming element that forms a plurality of light source images operate together to create a modified illumination configuration on the optical integrator. Since the secondary light source has a desired modified illumination configuration, an aperture stop used to restrict the size and/or shape of the secondary light source blocks only a small amount of illumination, or can be eliminated altogether. It is possible to alter the annular ratio and outer diameter of an annular or quadrupole modified illumination configuration by changing the magnification of a zoom optical system positioned between the light beam shape changing element and the angular light beam forming element. Furthermore, by changing the focal length of a zoom optical system (which is positioned upstream of the optical integrator), it is possible to change the outer diameter of the annular or quadrupole secondary light source without changing the annular ratio thereof.

8. 发明授权

US06217987B1 Solder resist composition and printed circuit boards 失效
标题翻译：阻焊剂组合物和印刷电路板
公开(公告)号：US06217987B1
公开(公告)日：2001-04-17
申请号：US08931364
申请日：1997-09-16
申请人： Yoshitaka Ono , Akihiko Goto , Ayao Niki , Motoo Asai
发明人： Yoshitaka Ono , Akihiko Goto , Ayao Niki , Motoo Asai
IPC分类号： B32B300
CPC分类号： H05K3/244 , G03F7/032 , G03F7/0388 , H05K1/112 , H05K3/184 , H05K3/28 , H05K3/287 , H05K3/3457 , H05K3/384 , H05K3/4644 , H05K2201/09472 , H05K2201/09509 , H05K2203/0307 , H05K2203/0392 , H05K2203/072 , Y10S428/901 , Y10T428/24917
摘要： A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa·s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.
摘要翻译：阻焊剂组合物包含酚醛清漆型环氧树脂的丙烯酸酯和咪唑固化剂，并且用乙二醇醚型溶剂调节粘度为0.5-10Pa·s。通过使用这种阻焊剂组合物形成印刷电路板。

9. 发明授权

US08476572B2 Optical receiver circuit 有权
标题翻译：光接收电路
公开(公告)号：US08476572B2
公开(公告)日：2013-07-02
申请号：US12987116
申请日：2011-01-08
申请人： Shougo Matsuda , Hiroyuki Yoshioka , Ryuichi Satomura , Hideyuki Takahashi , Akihiko Goto
发明人： Shougo Matsuda , Hiroyuki Yoshioka , Ryuichi Satomura , Hideyuki Takahashi , Akihiko Goto
IPC分类号： H03F3/08 , H01J43/00 , H01J43/30 , H04B10/06
CPC分类号： H03F3/087
摘要： An optical receiver circuit is configured as follows: a preamplifier and a reference voltage generating circuit are connected with a first ground potential wiring and a first power supply wiring, which are used in common, and are formed in a first region where elements are formed on a substrate to which the potential of the first ground potential wiring is supplied; a main amplifier is connected with a second ground potential wiring and a second power supply wiring, which are separated from the first ground potential wiring and the first power supply wiring, and is formed in a second region where elements are formed on the substrate to which the potential of the second ground potential wiring is supplied; and a substrate supply interval where a first substrate supply position at which the potential of the first ground potential wiring is supplied and a second substrate supply position at which the potential of the second ground potential wiring is supplied are closest to each other is large to an extent where a substrate permeability characteristic, in which noise is fully attenuated in an alternating current (AC) manner, is obtained.
摘要翻译：光接收器电路如下构成：前置放大器和参考电压产生电路与第一地电位布线和第一电源布线相连，共同使用，并形成在形成元件的第一区域中提供第一接地电位布线的电位的基板; 主放大器与与第一接地电位布线和第一电源布线分离的第二接地电位布线和第二电源布线连接，并且形成在第二区域中，元件形成在基板上提供第二地电位布线的电位; 以及提供第一接地电位布线的电位的第一基板供给位置和供给第二接地电位布线的电位的第二基板供给位置彼此最接近的基板供给间隔大到其中以交流（AC）方式完全衰减噪声的衬底磁导率特性的程度。

10. 发明申请

US20060238210A1 Interface and semiconductor testing apparatus using same 审中-公开
标题翻译：接口和半导体测试装置使用相同
公开(公告)号：US20060238210A1
公开(公告)日：2006-10-26
申请号：US11399190
申请日：2006-04-06
申请人： Akihiko Goto
发明人： Akihiko Goto
IPC分类号： G01R31/02
CPC分类号： G01R31/2889
摘要： An interface (100) provided at a test head (13), for connecting a probe card (10) to the test head (13). Me interface includes an interface body (1), a coaxial connector (2) supported by the interface body (1), and an impelling mechanism (3) supported by the interface body (1) and impelling the probe card (10) in the direction of disjoining the coaxial connector (2) and a mating coaxial connector (15) provided at the probe card (10) in a state where the joining is implemented.
摘要翻译：设置在测试头（13）处的用于将探针卡（10）连接到测试头（13）的接口（100）。 Me接口包括接口主体（1），由接口体（1）支撑的同轴连接器（2）和由接口体（1）支撑并且将探针卡（10）推入的接口体（1）的推进机构（3）在实现接合的状态下分离设置在探针卡（10）处的同轴连接器（2）和配合同轴连接器（15）的方向。

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