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1. 发明授权

US5692940A Sheet material for laminate of printed circuit and laminate for printed circuit using the same 失效
标题翻译：用于印刷电路层压板和用于印刷电路的层压板的片材
公开(公告)号：US5692940A
公开(公告)日：1997-12-02
申请号：US676180
申请日：1996-07-15
申请人： Hidenori Kinbara , Mitsuru Nozaki , Masanobu Mizoguchi , Koji Kimura , Naohiko Shimono
发明人： Hidenori Kinbara , Mitsuru Nozaki , Masanobu Mizoguchi , Koji Kimura , Naohiko Shimono
IPC分类号： C08J5/04 , C08J5/24 , D04H1/42 , D04H1/46 , D04H1/48 , D04H1/58 , D04H1/64 , D04H13/00 , H05K1/03 , B32B5/06 , B32B9/00 , B32B27/06 , B32B31/00
CPC分类号： C08J5/046 , B32B5/28 , C08J5/24 , D04H1/435 , D04H1/48 , D04H1/49 , D04H1/587 , D04H1/64 , H05K1/0366 , H05K2201/0141 , H05K2201/0145 , H05K2201/0278 , H05K2201/0293 , H05K2203/1105 , Y10S428/901 , Y10T428/31 , Y10T428/31786 , Y10T442/689
摘要： A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.
摘要翻译： PCT No.PCT / JP95 / 02328 Sec。 371日期：1996年7月15日 102（e）日期1996年7月15日PCT提交1995年11月15日PCT公布。公开号WO96 / 15306 日期：1996年5月23日一种层叠体用基材，其为主要由液晶聚酯纤维构成的无纺布，并进行（1）缠结处理，（2）加热处理以赋予热固性树脂和（3）表面改性处理，以及含有至少一种通过用热固性树脂浸渍基材而制备的预浸料并进行干燥的层压体。本发明的基材具有低介电常数，轻质，吸湿性低，并且具有良好的热固性树脂浸渍性能和对热固性树脂的良好粘附性。

2. 发明授权

US5186880A Process for producing cyanate ester resin cure product 失效
标题翻译：生产氰酸酯树脂固化产品的方法
公开(公告)号：US5186880A
公开(公告)日：1993-02-16
申请号：US547207
申请日：1990-07-03
申请人： Morio Gaku , Mitsuru Nozaki
发明人： Morio Gaku , Mitsuru Nozaki
IPC分类号： C08K5/17 , C08G73/06 , C08K5/56 , C08L79/04
CPC分类号： C08G73/0655
摘要： The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.

3. 发明授权

US4764327A Process of producing plastic-molded printed circuit boards 失效
标题翻译：生产塑料印刷电路板的工艺
公开(公告)号：US4764327A
公开(公告)日：1988-08-16
申请号：US3344
申请日：1987-01-14
申请人： Mitsuru Nozaki , Hirokatsu Nakamura
发明人： Mitsuru Nozaki , Hirokatsu Nakamura
IPC分类号： B29C33/40 , C08K3/08 , C08L79/08 , H05K3/00
CPC分类号： H05K3/0014 , B29C33/40 , C08K3/08 , C08L79/08 , H05K2201/09118
摘要： A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that(a) the mold I is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the hard pin mold III is fixed to the movable side metal platen in this order, or(b) the hard pin mold III is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the mold I is fixed to the movable side metal platen in this order.
摘要翻译：一种通过注射成型耐热塑料来形成塑料模制印刷电路板的方法，以形成具有许多穿孔的塑料模制件，并在模制件上形成导电层，该方法包括使用所获得的用于注模的模具模制耐热塑料通过制备由至少具有熔融树脂入口并形成用于安装模具部件的空间的固定侧金属压板组成的注塑成型模具，如果需要，具有熔融树脂入口的汽提金属压板连接到固定侧金属压板并形成用于安装模具部件的空间和形成用于安装模具部件的空间的可动侧金属压板; 并且组装由模具I构成的一对模具，该模具具有用于空腔的凹部，模具II具有用于穿过用于形成孔的硬销的穿孔，并且如果需要，还需要一个空腔的凹部，所述模具由固化树脂组合物形成或金属和固化树脂组合物的复合物，以及具有用于形成孔的硬销的硬销模具III，其以（a）模具I固定在固定侧金属压板上，模具II为固定到剥离金属压板上，硬销模具III依次固定到可动侧金属压板上，或者（b）硬销模具III固定到固定侧金属压板上，模具II固定到剥离金属压板，并且模具I按此顺序固定到可移动侧金属压板。

4. 发明授权

US07192651B2 Resin composition and prepreg for laminate and metal-clad laminate 有权
标题翻译：树脂组合物和层压板和覆金属层压板的预浸料
公开(公告)号：US07192651B2
公开(公告)日：2007-03-20
申请号：US10919265
申请日：2004-08-17
申请人： Daisuke Ohno , Kenji Ishii , Yasumasa Norisue , Michio Nawata , Yoshinori Kondo , Mitsuru Nozaki , Seiji Shika
发明人： Daisuke Ohno , Kenji Ishii , Yasumasa Norisue , Michio Nawata , Yoshinori Kondo , Mitsuru Nozaki , Seiji Shika
IPC分类号： B32B15/08 , C08F16/12 , C07C43/215
CPC分类号： C08G65/485 , C08L71/12 , H05K1/0326 , Y10S428/901 , Y10T428/31678 , Y10T428/31692 , Y10T428/31855 , C08L2666/02
摘要： A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
摘要翻译：含有至少10重量％的由式（1）表示的乙烯基化合物的层压体用树脂组合物和使用该树脂组合物的预浸料坯和覆金属层压板。

5. 发明申请

US20060093824A1 Resin composition and its use 审中-公开
标题翻译：树脂组合物及其用途
公开(公告)号：US20060093824A1
公开(公告)日：2006-05-04
申请号：US11251934
申请日：2005-10-18
申请人： Mitsuru Nozaki
发明人： Mitsuru Nozaki
IPC分类号： C08K5/34 , B32B9/04
CPC分类号： B32B15/14 , B32B15/08 , B32B15/20 , B32B27/28 , B32B2307/204 , B32B2307/306 , B32B2307/714 , B32B2457/08 , C08K5/3415 , H05K1/0353 , Y10T428/31504 , Y10T428/31721 , C08L79/00
摘要： A thermosetting resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule, a bismaleimide (b) represented by the formula (1) wherein each of R1, R2, R3, and R4 is independently an alkyl group having 3 or less carbon atoms, and a bismaleimide (c) represented by the formula (2), a copper-clad laminate comprising the above thermosetting resin composition and a printed wiring board comprising the above copper-clad laminate.
摘要翻译：含有每分子具有至少两个氰酸酯基的氰酸酯树脂（a）的热固性树脂组合物，由式（1）表示的双马来酰亚胺（b），其中R 1，R 2， 2，R 3和R 4独立地为具有3个以下碳原子的烷基和由式（2）表示的双马来酰亚胺（c）），包含上述热固性树脂组合物的覆铜层压板和包含上述覆铜层压板的印刷线路板。

6. 发明申请

US20120189859A1 RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD 审中-公开
标题翻译：树脂复合电解铜箔，铜箔层压板和印刷线
公开(公告)号：US20120189859A1
公开(公告)日：2012-07-26
申请号：US13386751
申请日：2010-06-25
申请人： Mitsuru Nozaki , Akihiro Nomoto , Norikatsu Akiyama , Eiji Nagata , Masashi Yano
发明人： Mitsuru Nozaki , Akihiro Nomoto , Norikatsu Akiyama , Eiji Nagata , Masashi Yano
IPC分类号： B32B15/08
CPC分类号： H05K1/09 , B32B15/08 , C25D1/04 , C25D5/022 , C25D7/0614 , C25D7/0678 , H05K1/0346 , H05K1/0373 , H05K3/384 , H05K3/4652 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2203/0307 , Y10T428/31681
摘要： The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 μm to 3.0 μm and a lightness value of not more than 30 on one surface of an electrolytic copper foil, and form a layer of a resin composition containing a block copolymerized polyimide resin having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.
摘要翻译：本发明的问题是提供一种在添加剂方法的工作过程中在去污处理后进行电镀时耐热性进一步提高和板粘附强度提高的树脂复合电解铜箔。该溶液是形成具有多个微小突起的粗糙表面，在电解铜箔的一个表面上的表面粗糙度（Rz）在1.0μm至3.0μm范围内且亮度值不大于30，并且形成含有嵌段共聚聚酰亚胺树脂的树脂组合物层，其具有在第一结构单元和第二结构单元上的酰亚胺低聚物的结构在粗糙化表面上交替重复地结合。

7. 发明授权

US06229096B1 Nonwoven reinforcement for printed wiring base board and process for producing the same 有权
标题翻译：印刷布线基板用无纺布加固件及其制造方法
公开(公告)号：US06229096B1
公开(公告)日：2001-05-08
申请号：US09166578
申请日：1998-10-06
申请人： Morio Gaku , Mitsuru Nozaki , Kenji Saimen , Tamemaru Esaki
发明人： Morio Gaku , Mitsuru Nozaki , Kenji Saimen , Tamemaru Esaki
IPC分类号： H05K109
CPC分类号： D21H13/24 , D21H17/53 , D21H25/06 , H05K1/0366 , H05K2201/0141 , H05K2201/0145 , H05K2201/0166 , H05K2201/0278 , H05K2201/0293 , Y10T428/24322 , Y10T442/2475
摘要： There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290° C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290° C. or higher and is in the form of a film having holes including at least 5 holes/mm2 each with an area of opening of 400 to 1000 &mgr;m2 (component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.
摘要翻译：公开了一种用于印刷布线基板的无纺布加强件，其中非织造材料增强件包含由熔点为290℃或更高的（A组分）的热致变性结晶聚酯纤维构成的湿系非织造织物和具有熔点为290℃以上，并且为具有包含至少5个孔/ mm 2的孔的膜的形式，每个孔的开口面积为400〜1000mum2（B成分），成分A被固定在组分B; 一种生产上述无纺布增强件的方法; 由上述无纺布加强件制成的印刷布线基板; 以及由上述印刷布线基板制造的印刷电路板。非织造布加强件和印刷布线（基底）板在诸如均匀性，尺寸稳定性，耐热性和电特性如介电常数和介电损耗角正切性等各种性能方面都是优异的。

8. 发明授权

US4740343A Method for producing rigid resin molds 失效
标题翻译：硬质树脂模具的制造方法
公开(公告)号：US4740343A
公开(公告)日：1988-04-26
申请号：US29581
申请日：1987-03-25
申请人： Morio Gaku , Hidenori Kimbara , Jun Yokoi , Yasunari Osaki , Mitsuru Nozaki
发明人： Morio Gaku , Hidenori Kimbara , Jun Yokoi , Yasunari Osaki , Mitsuru Nozaki
IPC分类号： B29C33/40 , C08K3/08 , C08L79/08 , B29C39/02 , C08L63/00
CPC分类号： C08L79/08 , B29C33/40 , C08K3/08 , H05K2201/09118
摘要： A method for producing a rigid resin mold for preparing plastic moldings which comprises:(1) preparing a composition (I) consisting essentially of(A) a cyanate ester resin composition, and(B-1) a metallic substance which does not substantially accelerate gelation of the cyanate ester resin composition (A),(2) preparing a composition (II) consisting essentially of(C) epoxy resin, and(B-2) a metallic substance which accelerates gelation of the cyanate ester resin composition (A) and does not substantially accelerate gelation of the epoxy resin (C) at temperatures below or equal to 100.degree. C.,(3) mixing composition (I) of step (1) and composition (II) of step (2) to form composition (III),(4) casting composition (III) of step (3) into a mold(5) and gelling the cast resin.
摘要翻译：一种制备用于制备塑料模制品的刚性树脂模具的方法，其包括：（1）制备基本上由（A）氰酸酯树脂组合物组成的组合物（I）和（B-1）基本上不加速的金属物质氰酸酯树脂组合物（A）的凝胶化，（2）制备基本上由（C）环氧树脂组成的组合物（II）和（B-2）加速氰酸酯树脂组合物（A）凝胶化的金属物质，并且在低于或等于100℃的温度下基本上不加速环氧树脂（C）的凝胶化，（3）步骤（1）的组合物（I）和步骤（2）的组合物（II）的混合物形成组合物（III），（4）步骤（3）的铸造组合物（III）加入到模具（5）中并使铸塑树脂胶凝。

9. 发明申请

US20070172674A1 Resin composite copper foil, printed wiring board, and production processes thereof 有权
标题翻译：树脂复合铜箔，印刷线路板及其制造方法
公开(公告)号：US20070172674A1
公开(公告)日：2007-07-26
申请号：US11657529
申请日：2007-01-25
申请人： Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
发明人： Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
IPC分类号： B32B15/08
CPC分类号： B32B27/281 , B32B7/06 , B32B15/14 , B32B15/20 , B32B27/38 , C08G73/1042 , C08G73/12 , H05K3/181 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , H05K2203/1152 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
摘要翻译：一种树脂复合铜箔，其包含铜箔和含有嵌段共聚物聚酰亚胺和马来酰亚胺化合物的树脂层，所述树脂层形成在所述铜箔的一个表面上，其制造方法，使用所述树脂复合材料的覆铜层压板铜箔，使用覆铜层压板的印刷电路板的制造方法，以及通过上述方法得到的印刷电路板。

10. 发明申请

US20050277743A1 Curable resin composition and its use 审中-公开
标题翻译：可固化树脂组合物及其用途
公开(公告)号：US20050277743A1
公开(公告)日：2005-12-15
申请号：US11143496
申请日：2005-06-03
申请人： Mitsuru Nozaki
发明人： Mitsuru Nozaki
IPC分类号： B32B7/04 , B32B27/04 , C08F22/40 , C08G73/06 , C08G73/12 , H05K1/03 , C08G2/00
CPC分类号： B32B15/043 , B32B7/12 , B32B27/04 , B32B27/26 , B32B27/281 , B32B27/36 , B32B27/38 , B32B2262/0261 , B32B2262/0269 , B32B2262/101 , B32B2307/306 , B32B2307/51 , B32B2311/00 , B32B2311/12 , B32B2333/04 , B32B2363/00 , B32B2379/08 , B32B2457/08 , C08G73/0655 , C08G73/12 , H05K1/0346
摘要： A resin composition improved in resistance to crack and having elasticity and high heat resistance, which composition contains a cyanate ester resin (a) having at least two cyanate groups per molecule and a bismaleimide compound (b) represented by the following formula (1), a copper-clad laminate using the above resin composition and a printed wiring board using the above copper-clad laminate, wherein n is an average value and is in the range of from 1 to 30.
摘要翻译：具有耐龟裂性和耐热性高的树脂组合物，该组合物含有每分子具有至少两个氰酸酯基的氰酸酯树脂（a）和由下式（1）表示的双马来酰亚胺化合物（b）使用上述树脂组合物的覆铜层压板和使用上述覆铜层压板的印刷线路板，其中n是平均值，在1至30的范围内。

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