专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2011121643A Method for binding dried noodle 审中-公开
标题翻译：用于结合干燥的食物的方法
公开(公告)号：JP2011121643A
公开(公告)日：2011-06-23
申请号：JP2009299377
申请日：2009-12-12
申请人： Mitsuru Nozaki , 充野崎
发明人： NOZAKI MITSURU
IPC分类号： B65B27/10 , B65B13/12
摘要： PROBLEM TO BE SOLVED: To provide a method for binding a dried noodle capable of easily unbinding a binding tape of the obtained dried noodle without drastically modifying a step in the binding method of the dried noodle by solving a problem that it takes a time and labor for unbinding the binding tape of the dried noodle bounded by the conventional noodle binding method.
SOLUTION: In such a state that the binding tape 3 is wound at a predetermined number of windings at the outer periphery of a bundle 1 of stock noodles to be bounded which is a kind of a Japanese dried noodle in the case that the binding tape 3 is cut by a laser cutter 9 in a cutting step, the binding tape 3 is cut on a mark 8 so that the rear end 8t of the mark 8 of the binding tape already wound over the bundle 1 of the stock noodles after cut is reduced to 2% from 50% of the outer peripheral dimension (50 mm in the case of an embodiment) of the bundle 1 of the stock noodles to be bound in length in the longitudinal direction of the binding tape 3. Since the binding tape 3 leaves the rear end 8t for the mark 8, the mark 8 surely remains in the predetermined longitudinal direction in the bundle 1 of the stock noodles.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：待解决的问题：提供一种能够容易地解除所获得的干面条的结合带的干燥面的方法，而不会通过解决所需干燥面的问题而大幅度地改变干面条的粘合方法中的步骤用于解除通过常规面条结合方法界定的干面的结合带的时间和劳动。解决方案：在这样一种状态下，捆扎带3以预定数量的绕组缠绕在作为一种日本干面条的面条的面条的捆1的外周，在切割步骤中用激光切割机9切割装订带3，在标记8上切割装订带3，使得装订带的标记8的后端8t已经在股票面条的束1上缠绕，从捆扎带3的纵向长度方向捆扎的面料的捆1的外周尺寸（在实施例的情况下为50mm）的50％的切割量减少到2％。由于结合胶带3离开标记8的后端8t，标记8确定地保持在原料面的捆1中的预定长度方向上。版权所有（C）2011，JPO＆INPIT

2. 发明申请

US20110281126A1 RESIN COMPOSITE COPPER FOIL 审中-公开
标题翻译：树脂复合铜箔
公开(公告)号：US20110281126A1
公开(公告)日：2011-11-17
申请号：US13142189
申请日：2009-12-10
申请人： Mitsuru Nozaki , Takabumi Oomori , Akihiro Nomoto , Norikatsu Akiyama , Eiji Nagata , Masashi Yano
发明人： Mitsuru Nozaki , Takabumi Oomori , Akihiro Nomoto , Norikatsu Akiyama , Eiji Nagata , Masashi Yano
IPC分类号： B32B15/08
CPC分类号： H05K3/386 , H05K2201/0154 , H05K2201/0209 , H05K2201/0358 , Y10T428/31681
摘要： This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.
摘要翻译：本发明涉及一种能够在铜箔（哑光）表面上施加非常小的不均匀性的铜箔的树脂复合铜箔，而不会对覆铜层压板的树脂组合物造成附着力的降低，更具体地说，涉及一种树脂复合铜包括铜箔和聚酰亚胺树脂层的箔，其中聚酰亚胺树脂层含有特定的嵌段共聚聚酰亚胺树脂和无机填料。

3. 发明授权

US07989081B2 Resin composite copper foil, printed wiring board, and production processes thereof 有权
标题翻译：树脂复合铜箔，印刷线路板及其制造方法
公开(公告)号：US07989081B2
公开(公告)日：2011-08-02
申请号：US11657529
申请日：2007-01-25
申请人： Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
发明人： Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
IPC分类号： B32B15/08 , B32B27/06 , C23C18/54
CPC分类号： B32B27/281 , B32B7/06 , B32B15/14 , B32B15/20 , B32B27/38 , C08G73/1042 , C08G73/12 , H05K3/181 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , H05K2203/1152 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
摘要翻译：一种树脂复合铜箔，其包含铜箔和含有嵌段共聚物聚酰亚胺和马来酰亚胺化合物的树脂层，所述树脂层形成在所述铜箔的一个表面上，其制造方法，使用所述树脂复合材料的覆铜层压板铜箔，使用覆铜层压板的印刷电路板的制造方法，以及通过上述方法得到的印刷电路板。

4. 发明授权

US07892651B2 Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate 有权
标题翻译：树脂复合金属箔，层压板和使用该层压板生产印刷线路板的方法
公开(公告)号：US07892651B2
公开(公告)日：2011-02-22
申请号：US11224021
申请日：2005-09-13
申请人： Takabumi Omori , Mitsuru Nozaki , Eiji Nagata , Masashi Yano
发明人： Takabumi Omori , Mitsuru Nozaki , Eiji Nagata , Masashi Yano
IPC分类号： B32B15/08 , B32B27/06 , C23C18/54
CPC分类号： B32B15/20 , B32B15/08 , B32B27/281 , B32B2250/02 , B32B2307/202 , B32B2307/75 , B32B2457/08 , C08G73/10 , C08G73/1042 , C08G73/105 , C08G73/1078 , H05K1/0346 , H05K2203/1152 , Y10S428/901 , Y10T428/31721
摘要： A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.
摘要翻译：一种树脂复合金属箔，其包含金属箔和形成在金属箔的一个表面上的嵌段共聚物聚酰亚胺树脂层，使用上述树脂复合金属箔的金属箔覆层压板，使用上述金属的印刷线路板覆箔层叠体的制造方法以及印刷电路板的制造方法，其特征在于，除去覆盖有金属箔的层压体的外层金属箔，通过电镀在外层绝缘层上形成导体层，箔覆层压板包括与外层金属箔接触的层的嵌段共聚物聚酰亚胺树脂层。

5. 发明申请

US20060054589A1 Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate 有权
标题翻译：树脂复合金属箔，层压板和使用该层压板生产印刷线路板的方法
公开(公告)号：US20060054589A1
公开(公告)日：2006-03-16
申请号：US11224021
申请日：2005-09-13
申请人： Takabumi Omori , Mitsuru Nozaki , Eiji Nagata , Masashi Yano
发明人： Takabumi Omori , Mitsuru Nozaki , Eiji Nagata , Masashi Yano
IPC分类号： H01B13/00
CPC分类号： B32B15/20 , B32B15/08 , B32B27/281 , B32B2250/02 , B32B2307/202 , B32B2307/75 , B32B2457/08 , C08G73/10 , C08G73/1042 , C08G73/105 , C08G73/1078 , H05K1/0346 , H05K2203/1152 , Y10S428/901 , Y10T428/31721
摘要： A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.
摘要翻译：一种树脂复合金属箔，其包含金属箔和形成在金属箔的一个表面上的嵌段共聚物聚酰亚胺树脂层，使用上述树脂复合金属箔的金属箔覆层压板，使用上述金属的印刷线路板覆箔层叠体的制造方法以及印刷电路板的制造方法，其特征在于，除去覆盖有金属箔的层压体的外层金属箔，通过电镀在外层绝缘层上形成导体层，箔覆层压板包括与外层金属箔接触的层的嵌段共聚物聚酰亚胺树脂层。

6. 发明授权

US07192651B2 Resin composition and prepreg for laminate and metal-clad laminate 有权
标题翻译：树脂组合物和层压板和覆金属层压板的预浸料
公开(公告)号：US07192651B2
公开(公告)日：2007-03-20
申请号：US10919265
申请日：2004-08-17
申请人： Daisuke Ohno , Kenji Ishii , Yasumasa Norisue , Michio Nawata , Yoshinori Kondo , Mitsuru Nozaki , Seiji Shika
发明人： Daisuke Ohno , Kenji Ishii , Yasumasa Norisue , Michio Nawata , Yoshinori Kondo , Mitsuru Nozaki , Seiji Shika
IPC分类号： B32B15/08 , C08F16/12 , C07C43/215
CPC分类号： C08G65/485 , C08L71/12 , H05K1/0326 , Y10S428/901 , Y10T428/31678 , Y10T428/31692 , Y10T428/31855 , C08L2666/02
摘要： A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
摘要翻译：含有至少10重量％的由式（1）表示的乙烯基化合物的层压体用树脂组合物和使用该树脂组合物的预浸料坯和覆金属层压板。

7. 发明申请

US20060093824A1 Resin composition and its use 审中-公开
标题翻译：树脂组合物及其用途
公开(公告)号：US20060093824A1
公开(公告)日：2006-05-04
申请号：US11251934
申请日：2005-10-18
申请人： Mitsuru Nozaki
发明人： Mitsuru Nozaki
IPC分类号： C08K5/34 , B32B9/04
CPC分类号： B32B15/14 , B32B15/08 , B32B15/20 , B32B27/28 , B32B2307/204 , B32B2307/306 , B32B2307/714 , B32B2457/08 , C08K5/3415 , H05K1/0353 , Y10T428/31504 , Y10T428/31721 , C08L79/00
摘要： A thermosetting resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule, a bismaleimide (b) represented by the formula (1) wherein each of R1, R2, R3, and R4 is independently an alkyl group having 3 or less carbon atoms, and a bismaleimide (c) represented by the formula (2), a copper-clad laminate comprising the above thermosetting resin composition and a printed wiring board comprising the above copper-clad laminate.
摘要翻译：含有每分子具有至少两个氰酸酯基的氰酸酯树脂（a）的热固性树脂组合物，由式（1）表示的双马来酰亚胺（b），其中R 1，R 2， 2，R 3和R 4独立地为具有3个以下碳原子的烷基和由式（2）表示的双马来酰亚胺（c）），包含上述热固性树脂组合物的覆铜层压板和包含上述覆铜层压板的印刷线路板。

8. 发明授权

US5692940A Sheet material for laminate of printed circuit and laminate for printed circuit using the same 失效
标题翻译：用于印刷电路层压板和用于印刷电路的层压板的片材
公开(公告)号：US5692940A
公开(公告)日：1997-12-02
申请号：US676180
申请日：1996-07-15
申请人： Hidenori Kinbara , Mitsuru Nozaki , Masanobu Mizoguchi , Koji Kimura , Naohiko Shimono
发明人： Hidenori Kinbara , Mitsuru Nozaki , Masanobu Mizoguchi , Koji Kimura , Naohiko Shimono
IPC分类号： C08J5/04 , C08J5/24 , D04H1/42 , D04H1/46 , D04H1/48 , D04H1/58 , D04H1/64 , D04H13/00 , H05K1/03 , B32B5/06 , B32B9/00 , B32B27/06 , B32B31/00
CPC分类号： C08J5/046 , B32B5/28 , C08J5/24 , D04H1/435 , D04H1/48 , D04H1/49 , D04H1/587 , D04H1/64 , H05K1/0366 , H05K2201/0141 , H05K2201/0145 , H05K2201/0278 , H05K2201/0293 , H05K2203/1105 , Y10S428/901 , Y10T428/31 , Y10T428/31786 , Y10T442/689
摘要： A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.
摘要翻译： PCT No.PCT / JP95 / 02328 Sec。 371日期：1996年7月15日 102（e）日期1996年7月15日PCT提交1995年11月15日PCT公布。公开号WO96 / 15306 日期：1996年5月23日一种层叠体用基材，其为主要由液晶聚酯纤维构成的无纺布，并进行（1）缠结处理，（2）加热处理以赋予热固性树脂和（3）表面改性处理，以及含有至少一种通过用热固性树脂浸渍基材而制备的预浸料并进行干燥的层压体。本发明的基材具有低介电常数，轻质，吸湿性低，并且具有良好的热固性树脂浸渍性能和对热固性树脂的良好粘附性。

9. 发明授权

US5186880A Process for producing cyanate ester resin cure product 失效
标题翻译：生产氰酸酯树脂固化产品的方法
公开(公告)号：US5186880A
公开(公告)日：1993-02-16
申请号：US547207
申请日：1990-07-03
申请人： Morio Gaku , Mitsuru Nozaki
发明人： Morio Gaku , Mitsuru Nozaki
IPC分类号： C08K5/17 , C08G73/06 , C08K5/56 , C08L79/04
CPC分类号： C08G73/0655
摘要： The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.

10. 发明授权

US4764327A Process of producing plastic-molded printed circuit boards 失效
标题翻译：生产塑料印刷电路板的工艺
公开(公告)号：US4764327A
公开(公告)日：1988-08-16
申请号：US3344
申请日：1987-01-14
申请人： Mitsuru Nozaki , Hirokatsu Nakamura
发明人： Mitsuru Nozaki , Hirokatsu Nakamura
IPC分类号： B29C33/40 , C08K3/08 , C08L79/08 , H05K3/00
CPC分类号： H05K3/0014 , B29C33/40 , C08K3/08 , C08L79/08 , H05K2201/09118
摘要： A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that(a) the mold I is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the hard pin mold III is fixed to the movable side metal platen in this order, or(b) the hard pin mold III is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the mold I is fixed to the movable side metal platen in this order.
摘要翻译：一种通过注射成型耐热塑料来形成塑料模制印刷电路板的方法，以形成具有许多穿孔的塑料模制件，并在模制件上形成导电层，该方法包括使用所获得的用于注模的模具模制耐热塑料通过制备由至少具有熔融树脂入口并形成用于安装模具部件的空间的固定侧金属压板组成的注塑成型模具，如果需要，具有熔融树脂入口的汽提金属压板连接到固定侧金属压板并形成用于安装模具部件的空间和形成用于安装模具部件的空间的可动侧金属压板; 并且组装由模具I构成的一对模具，该模具具有用于空腔的凹部，模具II具有用于穿过用于形成孔的硬销的穿孔，并且如果需要，还需要一个空腔的凹部，所述模具由固化树脂组合物形成或金属和固化树脂组合物的复合物，以及具有用于形成孔的硬销的硬销模具III，其以（a）模具I固定在固定侧金属压板上，模具II为固定到剥离金属压板上，硬销模具III依次固定到可动侧金属压板上，或者（b）硬销模具III固定到固定侧金属压板上，模具II固定到剥离金属压板，并且模具I按此顺序固定到可移动侧金属压板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式