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1. 外观设计

USD570260S1 Bumper of motor vehicle 有权
公开(公告)号：USD570260S1
公开(公告)日：2008-06-03
申请号：US29254632
申请日：2006-02-27
申请人： Hideki Suzuki , Kaname Sawai , Satoshi Utsunomiya , Atsushi Hayasaka
设计人： Hideki Suzuki , Kaname Sawai , Satoshi Utsunomiya , Atsushi Hayasaka

2. 发明申请

US20060267166A1 Semiconductor device 有权
公开(公告)号：US20060267166A1
公开(公告)日：2006-11-30
申请号：US11224982
申请日：2005-09-14
申请人： Satoshi Utsunomiya , Yoshihiro Takano
发明人： Satoshi Utsunomiya , Yoshihiro Takano
IPC分类号： H01L23/02
CPC分类号： H01L23/49558 , H01L23/49503 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.

3. 发明授权

US06504097B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US06504097B2
公开(公告)日：2003-01-07
申请号：US09834153
申请日：2001-04-12
申请人： Takeshi Kobayashi , Hideki Fukazawa , Satoshi Utsunomiya
发明人： Takeshi Kobayashi , Hideki Fukazawa , Satoshi Utsunomiya
IPC分类号： H01L2328
CPC分类号： H01L23/49562 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/181 , H05K3/3426 , Y10T29/49121 , Y10T29/49169 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first external lead (10) being bent into an S shape, the bending depth d thereof being made at least the thickness t of the first external lead (10), and the thickness T of the sealing resin on the non-element side of the element placement pad (11) being made smaller than the bending depth d. The electronic element (30), part of the first external lead (10), and part of the second external lead (20) are sealed by a sealing resin (40). This structure provides a compact electronic device, the vertical, horizontal, and height dimensions of which are all under 1 mm.
摘要翻译：树脂密封电子器件具有电子元件（30），具有厚度t小于0.1mm的元件放置垫（11）的第一外部引线（10）和设置在第二外部引线（20）上的第二外部引线在距离元件放置垫（11）一定距离处，第一外部引线（10）弯曲成S形，其弯曲深度d至少为第一外部引线（10）的厚度t，厚度元件放置垫（11）的非元件侧上的密封树脂的T小于弯曲深度d。电子元件（30），第一外部引线（10）的一部分和第二外部引线（20）的一部分由密封树脂（40）密封。这种结构提供了紧凑的电子设备，其垂直，水平和高度的尺寸都在1毫米以下。

4. 发明授权

US4060451A Polyamide-imide and mica pulp particles and paper-like sheets made therefrom 失效
标题翻译：聚酰胺酰亚胺和云母纸浆颗粒和由其制成的纸状片
公开(公告)号：US4060451A
公开(公告)日：1977-11-29
申请号：US703364
申请日：1976-07-08
申请人： Shuichi Uchiyama , Satoshi Utsunomiya , Hideo Watase
发明人： Shuichi Uchiyama , Satoshi Utsunomiya , Hideo Watase
IPC分类号： C04B18/02 , C04B30/02 , C08G73/06 , C08G73/10 , C08G73/14 , C08G73/18 , C08G73/22 , C08G75/32 , C08K3/34 , D21H13/26 , D21H13/44 , H01B3/04 , H01B3/30 , D21F11/00
CPC分类号： C04B30/02 , C04B18/022 , C08G73/0616 , C08G73/0677 , C08G73/1067 , C08G73/14 , C08G73/18 , C08G73/22 , C08G75/32 , C08K3/34 , D21H13/26 , D21H13/44 , H01B3/04 , H01B3/303
摘要： Pulp particles consisting essentially of 50 to 90% by weight of mica particles and 50 to 10% by weight of polyamide-imide, said polyamide-imide forming a continuous phase in which said mica particles are dispersed discontinuously.A paper-like sheet comprising an integrated intimate mixture of 20 to 95% by weight of the pulp particles and 80 to 5% by weight of staple fibers of a thermally stable polymer.
摘要翻译：基本上由50〜90重量％的云母颗粒和50〜10重量％的聚酰胺 - 酰亚胺组成的纸浆颗粒，所述聚酰胺 - 酰亚胺形成连续相，其中所述云母颗粒不连续地分散。

5. 发明授权

US07602052B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07602052B2
公开(公告)日：2009-10-13
申请号：US11224982
申请日：2005-09-14
申请人： Satoshi Utsunomiya , Yoshihiro Takano
发明人： Satoshi Utsunomiya , Yoshihiro Takano
IPC分类号： H01L23/495
CPC分类号： H01L23/49558 , H01L23/49503 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.
摘要翻译：为了防止即使使用大尺寸芯片也能够制造的半导体器件小，并且可以形成具有低导通电阻的MOSFET，根据本发明的半导体器件包括树脂封装; 至少两个主引线，其集成在树脂封装内，以构成芯片安装部分; 安装在芯片安装部上的半导体芯片; 以及与形成在半导体芯片的表面上的电极电连接的第一和第二表面引线。主引线和第一和第二表面引线分别沿树脂封装的底表面向外突出。

6. 发明申请

US20090069099A1 Shaft coupling 审中-公开
标题翻译：轴联轴器
公开(公告)号：US20090069099A1
公开(公告)日：2009-03-12
申请号：US11920073
申请日：2006-05-25
申请人： Satoshi Utsunomiya
发明人： Satoshi Utsunomiya
IPC分类号： F16D3/04
CPC分类号： F16D3/04
摘要： An object is to provide a shaft coupling of the type in which power is transmitted between two parallel shafts through rolling elements each disposed at the intersecting portion of two guide grooves that intersect each other at a right angle which always operates stably.The rolling elements 3 are cylindrically shaped, and have both ends thereof guided by the respective guide grooves 5 and 6 of the plates 1 and 2 with their central portions each passed through and held by an elongated hole 7 formed in the retainer 4, and sliders 10 are provided each extending from the outer periphery of one of the rolling elements 3 in the shape of a flange and engaging the retainer 4, thereby preventing each rolling element 3 from pivoting in a plane including an axis of the rolling element. With this arrangement, it is possible to prevent forces in the axial direction of the rotary members from acting on the rolling elements, thereby preventing axial movements of the rotary members. Also with this arrangement, because the rolling elements 3 are kept parallel to the axis of the rotary members, the rolling elements 3 never get stuck in the guide grooves 5 and 6. The shaft coupling can thus be always stably operated.
摘要翻译：本发明的目的是提供一种这样的轴联结器，其中，通过滚动元件在两个平行轴之间传递动力，每个滚动元件设置在两个导向槽的交叉部分处，该导向槽以一直稳定地工作的直角相交。滚动体3是圆筒状的，其两端分别被板1和2的导向槽5和6引导，其中心部分分别通过形成在保持架4中的细长孔7并被其保持。 10设置成从凸缘的一个滚动体3的外周延伸并与保持器4接合，从而防止每个滚动体3在包括滚动体的轴线的平面中枢转。通过这种布置，可以防止旋转构件的轴向方向的力作用在滚动体上，从而防止旋转构件的轴向移动。同样地，由于滚动体3与旋转体的轴线平行，因此滚动体3不会卡在引导槽5,6内。因此，轴联结总是能够稳定地运转。

7. 发明授权

US06779264B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US06779264B2
公开(公告)日：2004-08-24
申请号：US09415121
申请日：1999-10-08
申请人： Takeshi Kobayashi , Hideki Fukazawa , Satoshi Utsunomiya
发明人： Takeshi Kobayashi , Hideki Fukazawa , Satoshi Utsunomiya
IPC分类号： H01R4300
CPC分类号： H01L23/49562 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/181 , H05K3/3426 , Y10T29/49121 , Y10T29/49169 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for manufacturing an electronic device by placing within a die a first lead with an element placement pad, a second lead, and an electronic element placed on the element placement pad. The electronic element, the element placement pad, a part of the first lead, and a part of the second lead are sealed in a package by injecting a sealing resin in the die from a position on a longer side of the package, with the position being offset toward one shorter side thereof. The first lead is bent in an S shape, with a bending depth being at least as large as the thickness of the first lead. A thickness of the resin on a non-device side of the element placement pad is smaller than the bending depth.
摘要翻译：一种电子装置的制造方法，通过将具有元件放置垫，第二引线和放置在元件放置垫上的电子元件的第一引线放置在管芯内。将电子元件，元件放置衬垫，第一引线的一部分和第二引线的一部分通过从封装的较长侧的位置注入模具中的密封树脂而密封在封装中，位置朝向其短边偏移。第一引线弯曲成S形，弯曲深度至少与第一引线的厚度一样大。元件放置垫的非装置侧的树脂的厚度小于弯曲深度。

8. 发明授权

US5851163A Planetary roller type power transmission device 失效
标题翻译：行星辊式动力传动装置
公开(公告)号：US5851163A
公开(公告)日：1998-12-22
申请号：US825056
申请日：1997-03-27
申请人： Tatsuo Kawase , Takashi Nozaki , Tomoaki Makino , Satoshi Utsunomiya
发明人： Tatsuo Kawase , Takashi Nozaki , Tomoaki Makino , Satoshi Utsunomiya
IPC分类号： F16H13/08 , F16H57/04
CPC分类号： F16H13/08 , F16H57/0487
摘要： Plating 5 having good slide friction characteristics is applied onto the pocket surfaces 4a1, 4a2, which are opposite each other in the circumferential direction of the pockets 4a of the carrier and onto the end face 4a3 in the axial direction. It is possible to improve the lubrication conditions at the contacting area of the outer circumferential surface of the planetary rollers and the pocket surface 4a1 of the carrier 4 by coating the plating 5 having good slide friction characteristics onto the pocket surfaces 4a1,4a2 of the pocket 4 of the carrier 4 and further onto the end face 4a3. That is, the friction force at the contacting area is able to be decreased by the plating 5 having good friction characteristics, whereby even in a case where the contacting area is lubricated with a little lubricant, thermal deterioration of the lubricant due to heat generation of the contacting area is suppressed and good lubrication actions can be expected.
摘要翻译：具有良好的滑动摩擦特性的电镀5被施加到在载体的凹部4a的周向彼此相对并在轴向方向上的端面4a3上的凹穴表面4a1,4a2上。可以通过将具有良好滑动摩擦特性的电镀5涂覆到口袋的凹槽表面4a1,4a2上来改善行星辊的外周表面和载体4的凹陷表面4a1的接触区域的润滑条件 4并且进一步到端面4a3上。也就是说，接触区域的摩擦力能够通过具有良好摩擦特性的电镀5而降低，由此即使在用少量润滑剂润滑接触区域的情况下，由于发热导致的润滑剂的热劣化接触面积被抑制，可以预期良好的润滑作用。

9. 发明申请

US20090156318A1 Shaft Coupling and In-Wheel Motor System Using the Same 审中-公开
标题翻译：轴联轴器和使用其的车轮电机系统
公开(公告)号：US20090156318A1
公开(公告)日：2009-06-18
申请号：US11988491
申请日：2006-07-10
申请人： Katsumi Tashiro , Satoshi Utsunomiya , Daiji Okamoto
发明人： Katsumi Tashiro , Satoshi Utsunomiya , Daiji Okamoto
IPC分类号： F16D3/04 , B60K7/00
CPC分类号： F16D3/04 , B60K7/0007 , B60K2007/0038 , B60K2007/0092
摘要： There is provide a shaft coupling of the type which can transmit power between two parallel shafts through rolling elements disposed at intersecting portions of guide grooves that intersect each other at a right angle which can always stably transmit power.Guide grooves 5 and 6 are formed in opposed surfaces of two plates 1 and 2 such that each adjacent pair of guide grooves formed in each of the plates extend in a direction that forms an angle of 45 degrees with a reference line X connecting the midpoint between their respective intersecting portions and the center of the plates. Elongated holes 7 are formed in the retainer 4 so that each elongated hole extends along a straight line connecting the two adjacent intersecting portions between the two adjacent pairs of opposed guide grooves. Each elongated hole 7 and two pairs of opposed guide grooves 5 and 6 form a pair of rolling element guide mechanisms. This pair of rolling element guide mechanisms have mutually different positional relationships with the rotational direction of the retainer. This prevents the retainer 4 from rotating relative to the plates 1 and 2 when power is transmitted between the plates 1 and 2, thereby stabilizing transmission of power.
摘要翻译：提供这种类型的联轴器，其可以通过设置在能够始终稳定地传递动力的直角相互交叉的引导槽的交叉部分处的滚动元件在两个平行轴之间传递动力。引导槽5和6形成在两个板1和2的相对表面中，使得形成在每个板中的每个相邻的一对引导槽在形成45度的角度的方向上延伸，并且连接中间点之间的参考线X 它们各自的交叉部分和板的中心。细长孔7形成在保持器4中，使得每个细长孔沿着连接相邻两对相对的导向槽之间的两个相邻交叉部分的直线延伸。每个细长孔7和两对相对的导向槽5和6形成一对滚动元件引导机构。这对滚动元件引导机构与保持器的旋转方向具有相互不同的位置关系。这样当电源在板1和2之间传输时，防止保持器4相对于板1和2旋转，从而稳定功率传递。

10. 发明授权

US06359326B1 Composite transistor incorporating collector-common resistors 有权
标题翻译：复合晶体管结合集电极公共电阻
公开(公告)号：US06359326B1
公开(公告)日：2002-03-19
申请号：US09401724
申请日：1999-09-23
申请人： Satoshi Utsunomiya , Nobuo Tomita
发明人： Satoshi Utsunomiya , Nobuo Tomita
IPC分类号： H01L2900
CPC分类号： H01L27/0772
摘要： A semiconductor device requires a reduced cost, has a decreased substrate mounting area, and ensures that paired transistors, etc., have equivalent characteristics to each other. A separation strip 10 splits a semiconductor substrate 3 of one conductivity type into pairing regions and surrounds the semiconductor substrate, and has a high impurity concentration than a front surface side of the semiconductor substrate 3 but the same conductivity type with semiconductor substrate 3. A pair of vertical type semiconductor elements 1, 2 is disposed which shares the semiconductor substrate as a collector region, and the semiconductor elements 1, 2 comprise base regions 12, 22 of a reverse conductivity type which are formed respectively in the pairing regions and emitter regions 13, 23 of the one conductivity type which are formed within the base regions 12, 22 of the reverse conductivity type. At least one pair resistor elements 14, 24 is formed in the pairing regions on an insulation film which covers a surface of the semiconductor substrate 3.
摘要翻译：半导体器件需要降低成本，具有减小的衬底安装面积，并且确保成对晶体管等具有彼此相等的特性。分离条10将一种导电类型的半导体衬底3分成配对区域并围绕半导体衬底，并且具有比半导体衬底3的正面侧高的杂质浓度，但与半导体衬底3相同的导电类型。一对设置共享作为集电极区域的半导体衬底的垂直型半导体元件1,2，并且半导体元件1,2包括分别形成在配对区域和发射极区域13中的反向导电类型的基极区域12,22 一个导电类型的23，形成在反向导电型的基极区域12,22内。在覆盖半导体基板3的表面的绝缘膜上的配对区域中形成至少一对电阻元件14,24。

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