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1. 发明授权

US08313312B2 Screw compressor 有权
标题翻译：螺杆压缩机
公开(公告)号：US08313312B2
公开(公告)日：2012-11-20
申请号：US12533688
申请日：2009-07-31
申请人： Hideki Fujimoto , Hitoshi Nishimura , Yusuke Nagai
发明人： Hideki Fujimoto , Hitoshi Nishimura , Yusuke Nagai
IPC分类号： F04B39/02
CPC分类号： F04C29/04 , F04B39/0033 , F04C18/16 , F04C23/00 , F04C23/001 , F04C29/045 , F04C29/06
摘要： A screw compressor comprising: a pair of male and female screw rotors; and an air-cooled heat exchanger, wherein the air-cooled heat exchanger is provided above a motor for driving the compressor body; wherein, with respect to a cooling wind for the air-cooled heat exchanger, the air-cooled heat exchanger is inclined to the upstream side; wherein the uppermost portion of a unit suction port for the air-cooled heat exchanger cooling winds is positioned below the uppermost portion of the air-cooled heat exchanger positioned at the uppermost portion; wherein the lowermost portion of the unit suction port for the air-cooled heat exchanger cooling wind is positioned below the lowermost portion of the air-cooled heat exchanger positioned at the lowermost portion; and wherein the cooling wind for the air-cooled heat exchanger is exhausted from a ceiling portion of the compressor unit. With this structure, it becomes possible to provide a compact screw compressor with less noise whose installation area can be reduced.
摘要翻译：一种螺杆式压缩机，包括：一对公螺纹转子和内螺纹转子; 以及空气冷却热交换器，其中所述风冷式热交换器设置在用于驱动所述压缩机主体的马达上方; 其中，对于风冷式热交换器的冷却风，风冷式热交换器向上游侧倾斜，其特征在于，所述风冷式热交换器的冷却风的单元吸入口的最上部位于位于所述最上部的所述风冷式热交换器的最上部，其中用于风冷式热交换器冷却风的单元吸入口的最下部位于位于最下部的空气冷却热交换器的最下部的下方; 并且其中所述风冷式热交换器的冷却风从所述压缩机单元的顶部排出。利用这种结构，可以提供一种噪音较小的紧凑型螺旋压缩机，其安装面积可以减小。

2. 发明申请

US20100135840A1 SCREW COMPRESSOR 有权
标题翻译：螺旋压缩机
公开(公告)号：US20100135840A1
公开(公告)日：2010-06-03
申请号：US12533688
申请日：2009-07-31
申请人： Hideki FUJIMOTO , Hitoshi Nishimura , Yusuke Nagai
发明人： Hideki FUJIMOTO , Hitoshi Nishimura , Yusuke Nagai
IPC分类号： F01C1/16 , F04B17/00
CPC分类号： F04C29/04 , F04B39/0033 , F04C18/16 , F04C23/00 , F04C23/001 , F04C29/045 , F04C29/06
摘要： A screw compressor comprising: a pair of male and female screw rotors; and an air-cooled heat exchanger, wherein the air-cooled heat exchanger is provided above a motor for driving the compressor body; wherein, with respect to a cooling wind for the air-cooled heat exchanger, the air-cooled heat exchanger is inclined to the upstream side; wherein the uppermost portion of a unit suction port for the air-cooled heat exchanger cooling winds is positioned below the uppermost portion of the air-cooled heat exchanger positioned at the uppermost portion; wherein the lowermost portion of the unit suction port for the air-cooled heat exchanger cooling wind is positioned below the lowermost portion of the air-cooled heat exchanger positioned at the lowermost portion; and wherein the cooling wind for the air-cooled heat exchanger is exhausted from a ceiling portion of the compressor unit. With this structure, it becomes possible to provide a compact screw compressor with less noise whose installation area can be reduced.
摘要翻译：一种螺杆式压缩机，包括：一对公螺纹转子和内螺纹转子; 以及空气冷却热交换器，其中所述风冷式热交换器设置在用于驱动所述压缩机主体的马达上方; 其中，对于风冷式热交换器的冷却风，风冷式热交换器向上游侧倾斜，其特征在于，所述风冷式热交换器的冷却风的单元吸入口的最上部位于位于所述最上部的所述风冷式热交换器的最上部，其中用于风冷式热交换器冷却风的单元吸入口的最下部位于位于最下部的空气冷却热交换器的最下部的下方; 并且其中所述风冷式热交换器的冷却风从所述压缩机单元的顶部排出。利用这种结构，可以提供一种噪音较小的紧凑型螺旋压缩机，其安装面积可以减小。

3. 发明授权

US07708538B2 Oil free screw compressor 有权
标题翻译：无油螺杆压缩机
公开(公告)号：US07708538B2
公开(公告)日：2010-05-04
申请号：US11779910
申请日：2007-07-19
申请人： Natsuki Kawabata , Hitoshi Nishimura , Yusuke Nagai
发明人： Natsuki Kawabata , Hitoshi Nishimura , Yusuke Nagai
IPC分类号： F01C21/04 , F01C21/06 , F03C2/00
CPC分类号： F04C18/16 , F04C23/00 , F04C29/04
摘要： The invention downsizes and simplifies structures of a compressor and its driving system apparatus, and achieves a reduction of a noise. An oil free screw compressor is constituted by compressor main bodies compressing a gas, a motor driving rotors of the compressor main bodies via step-up gears, a gear casing storing the step-up gears, cooling apparatuses cooling a discharge air and the like. An oil tank is provided independently from the gear casing, the motor is fixed to a common base, the gear casing is integrally attached to the motor via a flange, and the compressor main bodies are integrally attached to the gear casing via the flange. Further, the cooling apparatuses are arranged in an upper side of the driving system apparatus, and a cooling fan is installed in an upper side thereof.
摘要翻译：本发明缩小了并简化了压缩机及其驱动系统装置的结构，并且实现了噪音的降低。无油螺杆式压缩机由压缩气体的压缩机主体，经由升压齿轮驱动压缩机主体的转子，存储升压齿轮的齿轮箱，冷却排出空气的冷却装置等构成。独立于齿轮箱设置油箱，马达固定在公共基座上，齿轮箱通过凸缘一体地安装在马达上，压缩机主体通过凸缘一体地安装在齿轮箱上。此外，冷却装置布置在驱动系统装置的上侧，并且冷却风扇安装在其上侧。

4. 发明申请

US20120058066A1 SELF-ASSEMBLING PEPTIDE AND PEPTIDE GEL WITH HIGH STRENGTH 有权
标题翻译：自组装肽和肽凝胶高强度
公开(公告)号：US20120058066A1
公开(公告)日：2012-03-08
申请号：US13255457
申请日：2010-02-12
申请人： Yusuke Nagai , Hidenori Yokoi , Koji Uesugi , Keiji Naruse
发明人： Yusuke Nagai , Hidenori Yokoi , Koji Uesugi , Keiji Naruse
IPC分类号： A61K8/64 , C12N5/071 , C12N5/04 , A61K47/42 , A61K38/10 , B05D7/24 , A61Q19/00 , A61P7/02 , C09K3/00 , A61L2/04 , B05D5/00 , C07K7/08 , A61Q5/00
CPC分类号： C07K7/08 , A61K8/64 , A61K9/0048 , A61K9/06 , A61K38/10 , A61K47/42 , A61L15/60 , A61L27/227 , A61L27/52 , A61L29/145 , A61L31/10 , A61L31/145 , A61Q5/00 , A61Q19/00 , B01J20/28047 , C10M173/02 , C12N5/0068 , C12N5/0656 , C12N5/0658 , C12N2533/50
摘要： Provide are a peptide gel with practically sufficient mechanical strength and a self-assembling peptide capable of forming the peptide gel. The self-assembling peptide is formed of the following amino acid sequence: a1b1c1b2a2b3db4a3b5c2b6a4 where: a1 to a4 each represent a basic amino acid residue; b1 to b6 each represent an uncharged polar amino acid residue and/or a hydrophobic amino acid residue, provided that at least five thereof each represent a hydrophobic amino acid residue; c1 and c2 each represent an acidic amino acid residue; and d represents a hydrophobic amino acid residue.
摘要翻译：提供具有实际足够的机械强度的肽凝胶和能够形成肽凝胶的自组装肽。自组装肽由以下氨基酸序列形成：a1b1c1b2a2b3db4a3b5c2b6a4其中：a1至a4各自表示碱性氨基酸残基; b1至b6各自表示不带电极性氨基酸残基和/或疏水性氨基酸残基，条件是其至少5个各自表示疏水性氨基酸残基; c1和c2各自表示酸性氨基酸残基; d表示疏水性氨基酸残基。

5. 发明授权

US07682858B2 Wafer processing method including formation of a deteriorated layer 有权
标题翻译：晶片加工方法，包括形成劣化层
公开(公告)号：US07682858B2
公开(公告)日：2010-03-23
申请号：US11151526
申请日：2005-06-14
申请人： Yusuke Nagai , Satoshi Kobayashi , Masaru Nakamura
发明人： Yusuke Nagai , Satoshi Kobayashi , Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/304 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78 , H01L2221/6834
摘要： A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.
摘要翻译：一种晶片处理方法，其特征在于，将沿着划分线将在前表面上形成的划分线的划分线的区域的功能元件分割为各个芯片，所述晶片处理方法包括在劣化层形成步骤中形成劣化层通过施加能够从晶片的背面沿着划分线穿过晶片的激光束，从与晶片的前表面相对应的与芯片的最终厚度相对应的距离的位置的背面; 分割步骤，通过沿着分割线向已经形成有劣化层的晶片施加外力，沿着分割线将晶片分割成单个芯片; 以及后表面研磨步骤，用于将分成单个芯片的晶片的背面研磨至芯片的最终厚度。

6. 发明授权

US07497213B2 Wafer dividing apparatus 有权
标题翻译：晶圆分割装置
公开(公告)号：US07497213B2
公开(公告)日：2009-03-03
申请号：US11249494
申请日：2005-10-14
申请人： Yusuke Nagai
发明人： Yusuke Nagai
IPC分类号： B28D1/32
CPC分类号： H01L21/67132 , B23K26/0853 , B23K37/0461 , B23K2101/40 , H01L21/67092 , H01L21/6838 , Y10T29/41 , Y10T225/10 , Y10T225/12 , Y10T225/30 , Y10T225/325 , Y10T225/35
摘要： A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.
摘要翻译：一种用于沿着分割线沿着多个分割线分割强度减小的晶片的晶片分割装置，其包括用于保持固定在晶片一侧的保护带的带保持装置; 以及晶片分割装置，每个分离装置包括多个张力施加装置，所述张力施加装置包括第一吸持保持构件和第二吸持保持构件，用于通过保护带吸附保持在带保持装置上的晶片在分隔线的两侧以及用于使它们彼此分离的方向移动第一吸持保持构件和第二吸持保持构件的移动装置。

7. 发明授权

US07350446B2 Wafer dividing apparatus 有权
标题翻译：晶圆分割装置
公开(公告)号：US07350446B2
公开(公告)日：2008-04-01
申请号：US11254779
申请日：2005-10-21
申请人： Yusuke Nagai
发明人： Yusuke Nagai
IPC分类号： B26F3/00 , B26F3/02 , B65H35/00 , B65H35/10 , H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6838 , Y10T83/8773 , Y10T225/30 , Y10T225/329 , Y10T225/371
摘要： A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.
摘要翻译：一种分割装置，沿着分割线沿着分割线分割强度降低的晶片，该分割线包括用于保持固定在晶片的一个表面侧上的保护带的带保持装置; 以及晶片分割装置，包括第一吸持保持部件和第二吸持保持部件，两者具有保持面，该保持面用于通过保护带保持在保持带上的晶片通过保护带在分割线的两侧通过保护带，以及用于使第一吸持保持部件和第二吸引保持部件彼此分离的方向移动的移动部件，其中，第一吸引保持部件的保持面和第二吸引保持部件的保持面夹持构件倾斜使得它们相对于彼此相对的侧边缘下降或上升。

8. 发明授权

US07244938B2 Method of checking a laser processed deteriorated layer 有权
标题翻译：检查激光加工劣化层的方法
公开(公告)号：US07244938B2
公开(公告)日：2007-07-17
申请号：US11003327
申请日：2004-12-06
申请人： Yusuke Nagai
发明人： Yusuke Nagai
IPC分类号： G01J5/02
CPC分类号： B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A method of checking a deteriorated layer formed in the inside of a workpiece along a dividing line by applying a laser beam capable of passing through the workpiece to the workpiece along the dividing line formed on the workpiece, the method comprising a focusing step of positioning a microscope of infrared image pick-up means to the dividing line formed on the workpiece, and setting the focusing point of the microscope to a position where the deteriorated layer in the inside of the workpiece has been formed; and an image pick-up step of picking up an image of the inside of the workpiece by moving the infrared image pick-up means and the workpiece along the dividing line relative to each other to scan the workpiece, wherein the deteriorated layer formed in the inside of the workpiece is checked based on the image picked up in the image pick-up step.
摘要翻译：一种通过将能够通过工件穿过工件的激光束沿着形成在工件上的分割线施加到工件上而沿着分割线检查在工件内部形成的劣化层的方法，该方法包括聚焦步骤，将红外图像拾取装置的显微镜装置到形成在工件上的分割线，并将显微镜的聚焦点设置在已经形成工件内部的劣化层的位置; 以及图像拾取步骤，通过沿着分割线相对于彼此移动红外图像拾取装置和工件来扫描工件来拾取工件内部的图像，其中形成在工件中的劣化层基于在图像拾取步骤中拾取的图像来检查工件内部。

9. 发明授权

US07179722B2 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US07179722B2
公开(公告)日：2007-02-20
申请号：US11047619
申请日：2005-02-02
申请人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
发明人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
IPC分类号： H01L21/301
CPC分类号： H01L21/3043 , H01L21/30625 , H01L21/78 , H01L2221/68336
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.
摘要翻译：沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。

10. 发明申请

US20060087008A1 Wafer dividing apparatus 有权
标题翻译：晶圆分割装置
公开(公告)号：US20060087008A1
公开(公告)日：2006-04-27
申请号：US11254779
申请日：2005-10-21
申请人： Yusuke Nagai
发明人： Yusuke Nagai
IPC分类号： H01L23/544
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6838 , Y10T83/8773 , Y10T225/30 , Y10T225/329 , Y10T225/371
摘要： A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.
摘要翻译：一种分割装置，沿着分割线沿着分割线分割强度降低的晶片，该分割线包括用于保持固定在晶片的一个表面侧上的保护带的带保持装置; 以及晶片分割装置，包括第一吸持保持部件和第二吸持保持部件，两者具有保持面，该保持面用于通过保护带保持在保持带上的晶片通过保护带在分割线的两侧通过保护带，以及用于使第一吸持保持部件和第二吸引保持部件彼此分离的方向移动的移动部件，其中，第一吸引保持部件的保持面和第二吸引保持部件的保持面夹持构件倾斜使得它们相对于彼此相对的侧边缘下降或上升。

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