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    • 1. 发明授权
    • Shock absorbing structure for vehicles
    • 车辆减震结构
    • US06764099B2
    • 2004-07-20
    • US10091560
    • 2002-03-07
    • Hideki AkiyamaToyokazu NakamuraTakeyasu ItabashiSatoshi Iijima
    • Hideki AkiyamaToyokazu NakamuraTakeyasu ItabashiSatoshi Iijima
    • B60R1922
    • B62J27/00B62D21/152
    • In order to have an external force heading from the front toward the occupant received, a bumper member extending substantially along the length of the vehicle is disposed under or by the sides of the cabin (riding space). The shock absorbing members are connected at the rear ends of the bumper member. Even in the case of the vehicle in which it is difficult to dispose the shock absorbing member at the front portion of the vehicle within the range of the length of the vehicle for example, when an impact load is exerted to such a vehicle, the impact load may be efficiently absorbed. As a consequent the riding space for an occupant can be maintained. The shock absorbing body may be constructed of an upper shock absorbing member and a lower shock absorbing member. The upper and lower shock absorbing members may be formed of two types of members having different crushing features. Accordingly, since the shock absorbing body is constructed by combining two members having different crushing features, the crushing extent of the shock absorbing body may preferably be determined corresponding to the two-wheel vehicle.
    • 为了具有从前方朝向乘员接收的外力,基本上沿着车辆长度延伸的保险杠构件设置在车厢的侧面(乘坐空间)的下方或由车厢的侧面(乘坐空间))。 减震构件在保险杠构件的后端连接。 即使在车辆的前部难以将车辆的前部部分设置在车辆的长度范围内的车辆的情况下,当对车辆施加冲击载荷时,也会产生冲击 负载可能被有效地吸收。 因此,可以保持乘客的乘坐空间。 冲击吸收体可以由上部减震构件和下部减震构件构成。 上下冲击吸收构件可以由具有不同破碎特征的两种类型的构件形成。 因此,由于通过组合具有不同破碎特征的两个构件来构造冲击吸收体,因此优选地可以相应于两轮车来确定减震体的破碎范围。
    • 2. 发明授权
    • Shock absorbing structure of two-wheeled vehicle
    • 两轮车的减震结构
    • US07204355B2
    • 2007-04-17
    • US10059325
    • 2002-01-31
    • Hideki AkiyamaToyokazu NakamuraTakeshi Yamazaki
    • Hideki AkiyamaToyokazu NakamuraTakeshi Yamazaki
    • F16F7/12
    • B62J27/00B62J17/02F16F7/121F16F7/123
    • A shock absorbing structure of a two-wheeled vehicle capable of sufficiently absorbing shock and desirably maintain the steerability of the two-wheeled vehicle. The structure includes a shock absorbing member projecting from a front wheel, wherein the shock absorbing member is crashed when the vehicle collides with an obstacle so as to absorb shock. A ceiling wall of the shock absorbing member is located at such a position that the ceiling wall does not block a forward viewing area for a driver. A center of a leading end contact surface of the shock absorbing member is located at a position higher than a vertical position of a center of gravity G of both a motorcycle and the driver, and right and left side surfaces of the shock absorbing member are offset to a center of a vehicular body from right and left side surfaces of the motorcycle.
    • 一种能够充分吸收冲击并期望地保持两轮车辆的操纵性的两轮车辆的减震结构。 该结构包括从前轮突出的减震构件,其中当车辆与障碍物碰撞时,减震构件坠毁,以便吸收冲击。 冲击吸收构件的顶壁位于这样的位置,即顶壁不阻挡驾驶员的向前观察区域。 减震构件的前端接触面的中心位于高于摩托车和驾驶员的重心G的垂直位置的位置,并且减震构件的左右侧面偏移 从摩托车的右侧和左侧表面到车身的中心。
    • 3. 发明授权
    • Compact vehicle
    • 紧凑车
    • US07168732B2
    • 2007-01-30
    • US10374040
    • 2003-02-27
    • Takeshi KuroeToshio YamagiwaSatoshi IijimaToyokazu Nakamura
    • Takeshi KuroeToshio YamagiwaSatoshi IijimaToyokazu Nakamura
    • B60R21/16B60R21/20
    • B62J27/00B60R21/16B60R2021/0088
    • In a compact vehicle in which a vehicular component engaged with an inflated and extended air bag is arranged in the inflated and extended range of the air bag that can constrain a rider on a seat provided to the rear of a body frame from a forward direction, even if there is the vehicular component engaged with the air bag in an inflated and extended state, space for the air bag to be fully inflated and extended is secured and in addition, the inflated and extended air bag is securely supported. A vehicular component can be turned between an inactuated position in which an air bag is folded and an actuated position in which the vehicular component is displaced from the inactuated position, being engaged with and supporting a part of the inflated and extended air bag and is supported by fixed supporting means.
    • 在紧凑型车辆中,其中与膨胀和延伸的气囊接合的车辆部件布置在气囊的膨胀和延伸的范围内,该气囊可以从向前的方向限制设置在车架的后部的座椅上, 即使在充气膨胀状态下与气囊接合的车辆部件被固定,也能够确保充气膨胀空间的充气膨胀空间。 车辆部件可以在其中折叠气囊的失效位置和车辆部件从失效位置移动的致动位置之间转动,与膨胀和延伸的气囊的一部分接合并支撑,并被支撑 通过固定支持手段。
    • 5. 发明授权
    • Apparatus for diagnosing interconnections of semiconductor integrated
circuits
    • 用于诊断半导体集成电路互连的装置
    • US5422498A
    • 1995-06-06
    • US227241
    • 1994-04-13
    • Kiyoshi NikawaYasuko HanagamaToyokazu Nakamura
    • Kiyoshi NikawaYasuko HanagamaToyokazu Nakamura
    • G01R31/28G01R31/311G01R31/00
    • G01R31/311G01R31/2853
    • The invention provides an apparatus for diagnosing a void within a conductive material for interconnections of semiconductor integrated circuits. A laser beam irradiating section is provided for supplying a thermal wave to interconnections of the semiconductor integrated circuits to cause a rise of a temperature of the conductive material due to a thermal accumulation around a void within the conductive material, the thermal wave supplying section being able to move in a plane for accomplishment of a scanning operation of the thermal wave supply. A voltage applying section is connected to the interconnections. A current detecting section is connected to the interconnections for detecting an amount of an electrical current flowing through any part of the interconnections to sense a variation of the amount thereof on account of the rise of the temperature of the conductive material due to the thermal accumulation around the void within the conductive material so as to detect any void within the conductive material.
    • 本发明提供一种用于诊断用于半导体集成电路的互连的导电材料内的空隙的装置。 提供激光束照射部分,用于将热波提供给半导体集成电路的互连,导致由导电材料内的空隙周围的热积聚引起的导电材料的温度升高,热波供应部能够 在飞机中移动以完成热波供应的扫描操作。 电压施加部连接到互连。 电流检测部分连接到互连件,用于检测流过互连部分的电流量,以便由于热累积导致的导电材料的温度升高而感测其量的变化 导电材料内的空隙,以便检测导电材料内的任何空隙。
    • 6. 发明授权
    • Apparatus method for testing opening state for hole in semiconductor device
    • 用于测试半导体器件中的孔的开启状态的装置方法
    • US06177681B1
    • 2001-01-23
    • US09236332
    • 1999-01-25
    • Toyokazu Nakamura
    • Toyokazu Nakamura
    • G01N2186
    • G01N21/9501
    • A testing apparatus for an opening state of a hole in a semiconductor device includes a laser light radiating system. The semiconductor device has the conductive layer and the insulating layer formed on the conductive layer, and the hole is formed in the insulating layer at aim to reach the conductive layer. The laser light radiating system radiates to a hole, a laser light having a wave length determined based on a work function of a material of a conductive layer and a work function of a material of an insulating layer. A detector detects photoelectrons emitted through a portion of the hole to which the laser light is irradiated. A charge supplementing mechanism supplies electrons to the conductive layer.
    • 用于半导体器件中的孔的打开状态的测试装置包括激光辐射系统。 半导体器件具有形成在导电层上的导电层和绝缘层,并且在绝缘层中形成孔以达到导电层。 激光辐射系统辐射到孔,具有基于导电层的材料的功函数和绝缘层的材料的功函数确定的波长的激光。 检测器检测通过激光照射的孔的一部分发射的光电子。 电荷补充机构向导电层提供电子。
    • 7. 发明授权
    • Semiconductor integrated circuit fault analyzing apparatus and method
therefor
    • 半导体集成电路故障分析装置及其方法
    • US5521516A
    • 1996-05-28
    • US354088
    • 1994-12-06
    • Yasuko HanagamaToyokazu NakamuraKiyoshi NikawaTohru Tsujide
    • Yasuko HanagamaToyokazu NakamuraKiyoshi NikawaTohru Tsujide
    • G01R31/302G01R31/307H01L21/66G01R1/04
    • G01R31/307
    • A semiconductor integrated circuit fault analyzing apparatus includes an electron beam tester and controller. The electron beam tester includes an electron gun assembly for generating a primary electron beam and forms a voltage contrast image on the basis of a detection amount of secondary electrons obtained by irradiating the primary electron beam from the electron gun assembly onto a semiconductor integrated circuit serving as a target to be tested and supplied with a test pattern signal, thereby specifying a faulty circuit portion of the semiconductor integrated circuit using the formed voltage contrast image. The controller sets, immediately before the test pattern signal is supplied to the semiconductor integrated circuit, at least one of a power and a signal which are supplied to the semiconductor integrated circuit to be a voltage different from a voltage obtained in the presence of the test pattern signal to cause the electron beam tester to acquire a voltage contrast image free from charge-up phenomena in synchronism with the start of supplying the test pattern signal.
    • 半导体集成电路故障分析装置包括电子束测试器和控制器。 该电子束测试器包括一个用于产生一次电子束的电子枪组件,并且基于通过将来自电子枪组件的一次电子束照射到半导体集成电路而获得的二次电子的检测量形成电压对比图像, 要测试并提供测试图案信号的目标,从而使用形成的电压对比图像指定半导体集成电路的故障电路部分。 控制器将紧接在测试图案信号提供给半导体集成电路之前,将提供给半导体集成电路的功率和信号中的至少一个设置为与存在测试时获得的电压不同的电压 模式信号使电子束测试仪与开始提供测试图案信号同步地获取没有充电现象的电压对比图像。
    • 10. 发明授权
    • Fine pattern inspection device capable of carrying out inspection
without pattern recognition
    • 精细图案检查装置能够进行无图案识别的检查
    • US5949900A
    • 1999-09-07
    • US814342
    • 1997-03-11
    • Toyokazu NakamuraYoshikazu Komatsu
    • Toyokazu NakamuraYoshikazu Komatsu
    • G01B11/24G01B11/30G01R31/311G06T1/00G06T7/00H01L21/66G06K9/00H04N7/18
    • G06T7/001G01R31/311G06T7/0002G06T2207/10061G06T2207/30148
    • In a fine pattern inspection device for inspecting a fine pattern comprising a plurality of pattern elements which have the same form and which are formed on an inspection sample, the device detects a defect in the plurality of pattern elements by the use of an image derived from the fine pattern. An image obtaining unit obtains the image from the fine pattern and produces an image signal representing the image. The image signal is divided into first and second divided image signals. A processing unit extracts a defect image and an inverted defect image that is inverted in lightness of the defect image, by carrying out a first process that gives a predetermined delay to the first divided image signal and then inverts the lightness thereof to obtain a processed image signal and carrying out a second process that adds the processed image signal and the second divided image signal to obtain a difference image signal representing a difference image which includes the defect image and the inverted defect image. A display device displays the defect image and the inverted defect image.
    • 在用于检查包括具有相同形状并且形成在检查样本上的多个图案元素的精细图案的精细图案检查装置中,该装置通过使用来自于图像元素的图像来检测多个图案元素中的缺陷 精细图案。 图像获取单元从精细图案获得图像并产生表示图像的图像信号。 图像信号被分成第一和第二分割图像信号。 处理单元通过对第一分割图像信号执行预定延迟的第一处理,然后反转其亮度以获得处理图像,提取缺陷图像的亮度反转的缺陷图像和反转缺陷图像 信号并且执行第二处理,其添加经处理的图像信号和第二分割图像信号,以获得表示包括缺陷图像和反转缺陷图像的差分图像的差分图像信号。 显示装置显示缺陷图像和倒置的缺陷图像。