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    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120119261A1
    • 2012-05-17
    • US13356156
    • 2012-01-23
    • Hidekazu UMEDATetsuzo Ueda
    • Hidekazu UMEDATetsuzo Ueda
    • H01L29/778
    • H01L29/7786H01L29/1029H01L29/1066H01L29/2003H01L29/402H01L29/66462
    • A semiconductor device includes: a substrate 101, a first nitride semiconductor layer 104S which includes a plurality of nitride semiconductor layers formed on the substrate 101, and has a channel region; a second semiconductor layer 105 which is formed on the first nitride semiconductor layer 104S, and has a conductivity type opposite a conductivity type of the channel region; a conductive layer which is in contact with the second semiconductor layer 105, and includes a metal layer 107 or a high carrier concentration semiconductor layer having a carrier concentration of 1×1018 cm−3 or higher; an insulating layer 110 formed on the conductive layer; a gate electrode 111 formed on the insulating layer 110; and a source electrode 108 and a drain electrode 109 formed to laterally sandwich the second semiconductor layer 105.
    • 半导体器件包括:衬底101,包括形成在衬底101上的多个氮化物半导体层的第一氮化物半导体层104S,并具有沟道区; 第二半导体层105,其形成在第一氮化物半导体层104S上,并且具有与沟道区的导电类型相反的导电类型; 与第二半导体层105接触的导体层,具有载流子浓度为1×1018 cm -3以上的金属层107或高载流子浓度半导体层; 形成在导电层上的绝缘层110; 形成在绝缘层110上的栅电极111; 以及形成为横向夹持第二半导体层105的源电极108和漏电极109。