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1. 发明申请

US20090294056A1 METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT 有权
标题翻译：印刷线路板的制造方法及制作印刷电路板单元的方法
公开(公告)号：US20090294056A1
公开(公告)日：2009-12-03
申请号：US12365279
申请日：2009-02-04
申请人： Hideaki YOSHIMURA , Takashi NAKAGAWA , Kenji FUKUZONO , Takashi KANDA , Tomohisa YAGI
发明人： Hideaki YOSHIMURA , Takashi NAKAGAWA , Kenji FUKUZONO , Takashi KANDA , Tomohisa YAGI
IPC分类号： B32B37/12
CPC分类号： H05K3/321 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4641 , H05K3/4644 , H05K2201/0218 , H05K2201/0323 , H05K2201/0361 , H05K2201/10378 , H05K2201/10674 , H05K2203/0156 , H05K2203/061
摘要： The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.
摘要翻译：响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。粘合片软化后，填料熔化。金属间化合物形成在填料和导电性焊盘之间以及填料之间。电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。然后将基质材料和粘合片固化。第一支撑体和第二支撑体彼此牢固地接合。

2. 发明申请

US20090294160A1 METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE BINDER 审中-公开
标题翻译：制造印刷电路板和电导体粘合剂的方法
公开(公告)号：US20090294160A1
公开(公告)日：2009-12-03
申请号：US12390131
申请日：2009-02-20
申请人： Hideaki YOSHIMURA , Tomohisa YAGI , Kenji FUKUZONO , Takashi KANDA
发明人： Hideaki YOSHIMURA , Tomohisa YAGI , Kenji FUKUZONO , Takashi KANDA
IPC分类号： H05K1/09 , C08K3/08 , H01B1/22 , C09J5/06
CPC分类号： H05K3/4614 , H05K1/056 , H05K1/095 , H05K3/20 , H05K3/3484 , H05K3/4069 , H05K3/4608 , H05K3/4644 , H05K2201/0218 , H05K2201/0323 , H05K2201/10378 , H05K2203/0384 , H05K2203/061
摘要： A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder. The electrically-conductive binder includes matrix material containing a thermosetting resin and fillers including copper particles dispersed in the matrix material. The copper particles have the surface coated with a tin-bismuth alloy. When heat is applied to the electrically-conductive binder, the tin-bismuth alloy melts. The tin forms an intermetallic compound on the surface of the individual copper particle. The copper-tin alloy layers serve to unit the copper particles together. Electrical connection is established. The bismuth embeds the copper particles. The bismuth is hardened or cured. The matrix material is then hardened or cured.
摘要翻译：热固性树脂片被夹在第一和第二支撑体之间，使得第一支撑体上的第一导电凸台与形成在片材中的开口中的第二支撑体上的第二导电凸台相对。开口填充有导电粘合剂。导电粘合剂包括含有热固性树脂的基质材料和分散在基质材料中的包含铜颗粒的填料。铜颗粒具有涂覆有锡 - 铋合金的表面。当对导电粘合剂施加热量时，锡 - 铋合金熔化。锡在单个铜颗粒的表面上形成金属间化合物。铜 - 锡合金层用于将铜颗粒整合在一起。建立电气连接。铋包埋铜颗粒。铋被硬化或固化。然后将基质材料硬化或固化。

3. 发明申请

US20090196002A1 PRINTED WIRING BOARD UNIT 有权
标题翻译：印刷线路板单元
公开(公告)号：US20090196002A1
公开(公告)日：2009-08-06
申请号：US12362149
申请日：2009-01-29
申请人： Kenji FUKUZONO
发明人： Kenji FUKUZONO
IPC分类号： H05K1/18 , H05K1/11
CPC分类号： H05K1/0271 , H05K3/0058 , H05K3/301 , H05K3/325 , H05K3/3436 , H05K2201/0311 , H05K2201/10659 , H05K2201/10734 , H05K2201/2009 , H05K2201/2018
摘要： A printed wiring board unit includes an electronic circuit component, a printed wiring board, a plurality of first conductive terminals disposed between the electronic circuit component and the printed wiring board, at least one of the first conductive terminals arranged along a quadrangular outline, and a plurality of second conductive terminals disposed between the electronic circuit component and the printed wiring board, the second conductive terminals arranged at a corner of the quadrangular outline, and the second conductive terminals contacting at least one of the printed wiring board and the electronic circuit component in a relatively displaceable manner.
摘要翻译：印刷电路板单元包括电子电路部件，印刷线路板，布置在电子电路部件和印刷线路板之间的多个第一导电端子，沿着四边形轮廓布置的至少一个第一导电端子，以及设置在电子电路部件和印刷线路板之间的多个第二导电端子，布置在四边形轮廓的角部的第二导电端子和与印刷线路板和电子电路部件中的至少一个接触的第二导电端子相对位移的方式。

4. 发明申请

US20130083504A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20130083504A1
公开(公告)日：2013-04-04
申请号：US13587268
申请日：2012-08-16
申请人： Kenji FUKUZONO , Naoaki NAKAMURA
发明人： Kenji FUKUZONO , Naoaki NAKAMURA
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/4056 , H01L2023/4062 , H01L2023/4068 , H01L2023/4075 , H01L2023/4081 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311
摘要： An electronic device includes: a first plate; a wiring board arranged on the first plate and configured to have a plurality of first terminals on a surface opposite to a surface facing the first plate; an electronic component arranged above the wiring board and configured to have a plurality of second terminals on a surface facing the wiring board; a connecting unit arranged between the wiring board and the electronic component and configured to electrically couple the first terminals and the second terminals; a second plate arranged on the electronic component; a fixing unit arranged in an area outside of an area where the electronic component is placed and configured to pressurize the first plate and the second plate; and a pressing unit arranged below the area where the electronic component is placed and configured to press the wiring board toward the electronic component.
摘要翻译：电子设备包括：第一板; 布线板，布置在第一板上并且被配置为在与面对第一板的表面相对的表面上具有多个第一端子; 布置在所述布线板上方并构成为在与所述布线板对置的表面上具有多个第二端子的电子部件; 连接单元，布置在所述布线板和所述电子部件之间，并且被配置为电连接所述第一端子和所述第二端子; 布置在所述电子部件上的第二板; 固定单元，其布置在所述电子部件放置的区域的外侧的区域中，并且构造成对所述第一板和所述第二板加压; 以及压电单元，布置在放置电子部件的区域的下方并被配置为将电路板朝向电子部件按压。

5. 发明申请

US20100326714A1 PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD FABRICATION METHOD, AND ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板，印刷电路板制造方法和包括印刷电路板的电子设备
公开(公告)号：US20100326714A1
公开(公告)日：2010-12-30
申请号：US12817562
申请日：2010-06-17
申请人： Kenji FUKUZONO
发明人： Kenji FUKUZONO
IPC分类号： H05K1/18 , H05K1/02 , H05K3/30
CPC分类号： H05K1/0271 , H01L21/4857 , H01L23/3128 , H01L23/49822 , H01L23/5389 , H01L23/562 , H01L2224/73204 , H01L2924/01019 , H05K1/181 , H05K3/4602 , H05K3/4697 , H05K2201/068 , H05K2201/09036 , H05K2201/10416 , H05K2201/10674 , H05K2201/10734 , H05K2203/063 , Y10T29/49124 , Y10T29/4913 , Y10T29/49139
摘要： A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body.
摘要翻译：印刷电路板包括：印刷电路板主体，其具有位于印刷电路板主体的第一表面上的安装区域;以及凹部，设置在作为第一表面的第一表面的第二表面的第二表面的凹部所述印刷电路板主体，所述电子部件安装在所述安装区域上，所述凹部区域设置成对应于所述安装区域; 并且热膨胀控制元件放置在凹部中并且具有比印刷电路板主体更小的热膨胀系数。

6. 发明申请

US20130083488A1 SEMICONDUCTOR PACKAGE, WIRING BOARD UNIT, AND ELECTRONIC APPARATUS 有权
标题翻译：半导体封装，接线板单元和电子设备
公开(公告)号：US20130083488A1
公开(公告)日：2013-04-04
申请号：US13593733
申请日：2012-08-24
申请人： Manabu WATANABE , Kenji FUKUZONO
发明人： Manabu WATANABE , Kenji FUKUZONO
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/10 , H01L23/3675 , H01L23/4006 , H01L23/42 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/19105 , H01L2924/3511
摘要： A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board.
摘要翻译：分配在布线板和冷却构件之间的半导体封装，所述半导体封装包括：封装板; 安装在所述封装板上的加热元件; 芯片部分，其安装在封装板上并设置在加热元件周围; 以及传热元件，其具有主体单元，该主体单元用金属接合材料接合到所述加热元件，所述腿部从所述主体部分延伸到所述封装板，并且其顶端附接到所述封装板，以及其中所述腿部包括：分配在所述包装板的角部中的第一腿部; 以及分配在所述加热元件和所述封装板上的所述芯片部分之间的所述第一腿部内的第二腿部。

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