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1. 发明授权

US06833715B2 Semiconductor testing apparatus and semiconductor testing method 失效
标题翻译：半导体测试仪器和半导体测试方法
公开(公告)号：US06833715B2
公开(公告)日：2004-12-21
申请号：US10617387
申请日：2003-07-11
申请人： Hideaki Sakaguchi , Masayuki Ehiro , Masami Mori
发明人： Hideaki Sakaguchi , Masayuki Ehiro , Masami Mori
IPC分类号： G01R3126
CPC分类号： G09G3/006 , G09G3/3688 , G09G3/3696 , G11C29/38
摘要： A semiconductor testing apparatus and a semiconductor testing method are provided which permit an apparatus having an inexpensive configuration to perform, with precision, the acceptance-or-rejection determination and measurement test of a semiconductor integrated circuit having a large number of output terminals each for outputting a multi-gradation level output voltage. The semiconductor testing apparatus includes output voltage testing device and comparison voltage generation data inputting device. The output voltage testing device includes test voltage inputting device, comparison voltage generating device, a high level comparator, a low level comparator, and comparison result outputting device. The high level comparator and the low level comparator constitute comparing device for comparing a voltage to be tested, with a comparison voltage.
摘要翻译：提供一种半导体测试装置和半导体测试方法，其允许具有廉价构造的装置精确地执行具有大量输出端子的半导体集成电路的接受或拒绝确定和测量测试，每个输出端子用于输出多灰度级输出电压。半导体测试装置包括输出电压测试装置和比较电压产生数据输入装置。输出电压测试装置包括测试电压输入装置，比较电压发生装置，高电平比较器，低电平比较器和比较结果输出装置。高电平比较器和低电平比较器构成用于比较被测电压的比较装置和比较电压。

2. 发明授权

US06850085B2 Reference voltage generating device, semiconductor integrated circuit including the same, and testing device and method for semiconductor integrated circuit 失效
标题翻译：参考电压产生装置，包括其的半导体集成电路以及用于半导体集成电路的测试装置和方法
公开(公告)号：US06850085B2
公开(公告)日：2005-02-01
申请号：US10425666
申请日：2003-04-30
申请人： Hideaki Sakaguchi , Masami Mori
发明人： Hideaki Sakaguchi , Masami Mori
IPC分类号： G01R31/28 , G01R31/316 , G01R31/3183 , G09G3/00 , H01L21/822 , H01L27/04 , H03M1/66
CPC分类号： G09G3/006
摘要： A testing device for a semiconductor integrated circuit of the present invention includes a differential amplifier array module and tester which determine whether an output voltage of a liquid crystal driver LSI is at a proper level and an expected value voltage generator which generates an expected value voltage in accordance with expected value data to output it to the differential amplifier array module. The expected value voltage generator produces expected value data by interpolation in accordance with incoming expected value data fewer in number than the expected value voltage to be generated, so as to be equal in number to the expected value voltage. This makes it possible to carry out an extremely short time and highly accurate test for output voltages of a device under test (liquid crystal driver LSI).
摘要翻译：本发明的半导体集成电路的测试装置包括：差分放大器阵列模块和测试器，其确定液晶驱动器LSI的输出电压是否处于适当的电平;以及期望值电压发生器，其产生期望值电压根据预期值数据将其输出到差分放大器阵列模块。期望值电压发生器根据输入的期望值数据通过插值产生预期值数据，数据数量少于要产生的期望值电压，从而与期望值电压相等。这使得可以对被测器件（液晶驱动器LSI）的输出电压进行非常短的时间和高精度的测试。

3. 发明授权

US08671561B2 Substrate manufacturing method 有权
标题翻译：基板制造方法
公开(公告)号：US08671561B2
公开(公告)日：2014-03-18
申请号：US12126306
申请日：2008-05-23
申请人： Kiyoaki Iida , Kazuo Tanaka , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Kiyoaki Iida , Kazuo Tanaka , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： H05K3/34
CPC分类号： H05K3/3478 , H01L2224/11003 , H01L2224/1132 , H01L2224/742 , H05K2203/041 , H05K2203/0557 , H05K2203/104 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49222 , Y10T29/53178
摘要： A substrate manufacturing apparatus 100 has a substrate delivery path 120 through which a multi-unit substrate 110 is delivered and a mask delivery path 140 through which an individual mask 130 is delivered. The substrate delivery path 120 has a pad detecting device 160 for detecting a position of a pad 112 formed on a surface of the substrate 110. The mask delivery path 140 has a mask hole detecting device 220 for detecting a position of a conductive ball inserting hole 132 of the individual mask 130. A moving position of an adsorbing head 212 is adjusted in such a manner that the position of the conductive ball inserting hole 132 is coincident with that of the pad 112 of the substrate 110 based on pad position information of the pad detecting device 160 and mask hole position information of the mask hole detecting device 220.
摘要翻译：基板制造装置100具有基板输送路径120，多单元基板110通过该基板输送路径120传送，并且输送单个基板110的掩模输送路径140。基板输送路径120具有用于检测形成在基板110的表面上的焊盘112的位置的焊盘检测装置150.掩模输送路径140具有掩模孔检测装置220，用于检测导电球插入孔的位置调节吸附头212的移动位置，使得导电球插入孔132的位置基于衬底110的衬垫位置信息与衬底110的衬垫112的位置一致垫检测装置160和掩模孔检测装置220的掩模孔位置信息。

4. 发明授权

US08564077B2 Package for electronic component, manufacturing method thereof and sensing apparatus 有权
标题翻译：电子部件用包装及其制造方法以及感应装置
公开(公告)号：US08564077B2
公开(公告)日：2013-10-22
申请号：US12643391
申请日：2009-12-21
申请人： Akinori Shiraishi , Masahiro Sunohara , Hideaki Sakaguchi , Yuichi Taguchi , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Masahiro Sunohara , Hideaki Sakaguchi , Yuichi Taguchi , Mitsutoshi Higashi
IPC分类号： H01L29/84 , H01L23/52 , H01L21/50
CPC分类号： G01P1/023 , B81B7/0074 , B81B2201/0235 , G01D11/245 , H01L2224/05001 , H01L2224/05009 , H01L2224/05548 , H01L2224/05568 , H01L2224/0557 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15156 , H01L2924/153 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.
摘要翻译：一种电子部件用包装体，具有矩形包装体，该矩形包装体具有与安装基板的平坦安装面抵接的平坦切割面，与该平坦切断面交叉的第一侧面，以及形成在上述平切面和第一侧表面，安装在封装主体中的电子部件，以及电连接到电子部件并形成在第一凹口部分的内壁表面上的第一焊盘。

5. 发明授权

US08299628B2 Conductive ball mounting apparatus having a movable conductive ball container 有权
标题翻译：具有可动导电球容器的导电球安装装置
公开(公告)号：US08299628B2
公开(公告)日：2012-10-30
申请号：US12899947
申请日：2010-10-07
申请人： Hideaki Sakaguchi , Kiyoaki Iida , Kazuo Tanaka
发明人： Hideaki Sakaguchi , Kiyoaki Iida , Kazuo Tanaka
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , H01L21/4853 , H01L2224/05001 , H01L2224/05023 , H01L2224/11003 , H01L2224/11334 , H01L2224/742 , H01L2924/00014 , H05K2203/0292 , H05K2203/041 , H05K2203/0485 , H05K2203/1581 , Y10T29/53174 , Y10T156/17 , H01L2224/05599 , H01L2224/05099
摘要： There is provided a method of mounting conductive balls on pads on a substrate. The method includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.
摘要翻译：提供了一种在基板上的焊盘上安装导电球的方法。该方法包括：（a）将具有涂覆有粘合剂的焊盘的基板放置在用于容纳导电球的容器中，并且其顶表面打开，使得焊盘面向容器的顶表面; 和（b）通过在给定行程上上下移动容器，将导电球投掷在容器中，从而允许导电球粘附到涂覆在垫上的粘合剂。重复执行步骤（b）。

6. 发明授权

US08299370B2 Wiring board and method of manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08299370B2
公开(公告)日：2012-10-30
申请号：US12709838
申请日：2010-02-22
申请人： Hideaki Sakaguchi , Akinori Shiraishi , Mitsutoshi Higashi
发明人： Hideaki Sakaguchi , Akinori Shiraishi , Mitsutoshi Higashi
IPC分类号： H05K1/11
CPC分类号： H05K3/4647 , G01R1/07307 , G01R3/00 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K3/423 , H05K3/4608 , H05K2201/10674 , H05K2203/063 , H05K2203/0733 , Y10T29/49155 , Y10T428/24917 , Y10T428/24926 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.
摘要翻译：布线基板包括在垂直方向上包括第一馈通导体部分的第一基板部分，设置在第一基板部分上的第二基板部分，并且在第二基板部分的相应部分的垂直方向上包括第二馈通导体部分第一馈通导体部分和包括第一馈通导体部分和第二馈通导体部分的馈通电极。

7. 发明授权

US08183679B2 Electronic part package 有权
标题翻译：电子零件包装
公开(公告)号：US08183679B2
公开(公告)日：2012-05-22
申请号：US13182923
申请日：2011-07-14
申请人： Hideaki Sakaguchi , Masahiro Sunohara , Mitsutoshi Higashi
发明人： Hideaki Sakaguchi , Masahiro Sunohara , Mitsutoshi Higashi
IPC分类号： H01L23/02
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L2221/68345 , H01L2224/04105 , H01L2224/16225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/73204 , H01L2224/82001 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/18162 , H01L2924/19041 , H01L2924/00
摘要： A peeling off layer 18 is formed on an entire surface of one surface side of a support plate 10 including the inner wall surfaces respectively of a recessed part 12 for an electronic part and recessed parts 16 for posts in which the posts 20 are formed. Then, the recessed parts 16 are filled with metal to form the posts 20. Then, conductor patterns 28 are formed that electrically connect the electrode terminals 22a of the electronic part 22 inserted into the recessed part 12 to the posts 20. Then, an insulating layer covering the conductor patterns 28 is formed to form an electronic part package 30 on the one surface side of the support plate 10 through the peeling off layer 18. After that, the electronic part package 30 is separated from the support plate 10 by the peeling off layer 18.
摘要翻译：在包括用于电子部件的凹部12的内壁面的支撑板10的一个表面侧的整个表面上形成有剥离层18，以及形成有柱20的柱的凹部16。然后，用金属填充凹部16以形成柱20.然后，形成将插入到凹部12中的电子部件22的电极端子22a电连接到柱20的导体图案28。形成覆盖导体图案28的层通过剥离层18在支撑板10的一个表面侧上形成电子部件封装30.然后，电子部件封装30通过剥离与支撑板10分离关闭层18。

8. 发明授权

US07981798B2 Method of manufacturing substrate 有权
标题翻译：制造基板的方法
公开(公告)号：US07981798B2
公开(公告)日：2011-07-19
申请号：US12233875
申请日：2008-09-19
申请人： Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： H01L21/44
CPC分类号： H01L33/486 , B81B2207/096 , B81C1/00301 , H01L24/97 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/12041 , H01L2924/15788 , H01L2224/81 , H01L2924/00 , H01L2224/05599
摘要： The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first surface of the silicon substrate; (b) forming a first insulating film to cover the first surface of the silicon substrate, surfaces of the silicon substrate exposed from the through holes, and a second surface of the silicon substrate opposite to the first surface; (c) forming an opening in a portion of the first insulating film provided on the second surface, the portion of the first insulating film corresponding to an area in which the through holes are formed; (d) etching the silicon substrate using the first insulating film provided on the second surface as a mask, thereby forming a cavity in the silicon substrate; and (e) removing the first insulating film.
摘要翻译：本公开涉及一种制造衬底的方法。该方法包括：（a）通过从硅衬底的第一表面向硅衬底施加各向异性蚀刻形成通孔; （b）形成第一绝缘膜以覆盖硅衬底的第一表面，从通孔露出的硅衬底的表面和与第一表面相对的硅衬底的第二表面; （c）在设置在第二表面上的第一绝缘膜的一部分中形成开口，第一绝缘膜的与形成通孔的区域相对应的部分; （d）使用设置在第二表面上的第一绝缘膜作为掩模蚀刻硅衬底，从而在硅衬底中形成空腔; 和（e）去除第一绝缘膜。

9. 发明授权

US07900807B2 Conductive ball mounting apparatus and conductive ball mounting method 有权
标题翻译：导电球安装装置和导电球安装方法
公开(公告)号：US07900807B2
公开(公告)日：2011-03-08
申请号：US12720084
申请日：2010-03-09
申请人： Kiyoaki Iida , Kazuo Tanaka , Norio Kondo , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Kiyoaki Iida , Kazuo Tanaka , Norio Kondo , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： B23K1/00 , B23K31/02
CPC分类号： H05K3/3478 , B23K3/0623 , B23K35/02 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H05K2203/0292 , H05K2203/041 , H05K2203/0485 , H05K2203/0557 , H05K2203/105 , H05K2203/1344 , H05K2203/1581 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
摘要翻译：在用于将一个导电球安装在设置在基板上并且在其上形成有粘合剂的多个焊盘中的导电球安装装置中的导电球安装装置中，导电球安装装置包括：导电球容器，用于容纳多个导电球并且具有通过所述多个导电球的开口; 衬底保持器，设置在导电性球容器上面对开口，并且以使得多个导电球和多个焊盘彼此面对的方式保持衬底，并且衬底设置在导电性球容器上方，其间具有空间 ; 以及导电球供给单元，其用于通过使所述多个导电球向上移动而经由所述开口将多个导电球供给到所述多个焊盘。

10. 发明授权

US07866534B2 Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method 有权
标题翻译：导体球安装装置，导体球安装方法，用于安装导体球的掩模和掩模制造方法
公开(公告)号：US07866534B2
公开(公告)日：2011-01-11
申请号：US12166673
申请日：2008-07-02
申请人： Hideaki Sakaguchi , Kiyoaki Iida , Mitsutoshi Higashi
发明人： Hideaki Sakaguchi , Kiyoaki Iida , Mitsutoshi Higashi
IPC分类号： B23K31/02
CPC分类号： H01L24/11 , H01L24/742 , H01L2224/11005 , H01L2224/1132 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3478 , H05K2203/041 , H05K2203/0485 , H05K2203/0557 , H05K2203/082
摘要： There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.
摘要翻译：提供了导电球安装装置。导电球安装装置包括：导电球安装掩模，设置为与具有涂覆有粘合剂焊剂的多个焊盘的基板相对，导电球安装掩模具有多个球安装通孔，用于将每个导电球安装在每个导电球上所述多个焊盘，所述多个球安装通孔布置成与所述多个焊盘相对; 以及导电球供给单元，用于通过在导电性球安装掩模的上表面侧吸入空气来移动或去除导电性球安装掩模上的导电球。导电球安装掩模包括形成为阻挡导电球通过的通孔部分。

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