专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5286840A Thermally stable polyimide and preparation process of polyimide 失效
标题翻译：聚酰亚胺热稳定剂及其制备方法
公开(公告)号：US5286840A
公开(公告)日：1994-02-15
申请号：US795750
申请日：1991-11-21
申请人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
发明人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1071 , C08G73/1014
摘要： A thermally stable polyimide which is blocked at the polymer terminal with a dicarboxylic acid anhydride represented by the formula (III): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or dicarboxylic acid anhydride and has from 6 to 15 carbon atoms, a condensed polyaromatic radical or a noncondensed aromatic radical connected each other with a direct bond or a bridge member, and has a fundamental skeleton represented by recurring structural units of the formula (IV): ##STR2## and a process of preparing the polyimide.
摘要翻译：在聚合物末端用由式（III）表示的二羧酸酐封闭的热稳定聚酰亚胺：（*化学结构*）（III）其中Z是选自以下的二价基团：单芳族基团，其为基本上未被取代或被不与胺或二羧酸酐反应的基团或具有6至15个碳原子的基团取代，稠合的多芳族基团或非缩合的芳族基团彼此直接连接或桥接，并具有基本的由式（IV）的重复结构单元表示的骨架：（*化学结构*）（IV）和制备聚酰亚胺的方法。

2. 发明授权

US4908409A Polyimide 失效
标题翻译：聚酰亚胺
公开(公告)号：US4908409A
公开(公告)日：1990-03-13
申请号：US119042
申请日：1987-11-10
申请人： Hideaki Oikawa , Katsuaki Liyama , Nobuhito Koga , Saburo Kawashima , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Hideaki Oikawa , Katsuaki Liyama , Nobuhito Koga , Saburo Kawashima , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/1071 , C08G73/1046
摘要： Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): ##STR2## and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include,2,2-bis[4-(3-aminophenoxy)phenyl]propane,2,2-bis[4-(4-aminophenoxy)phenyl]propane,2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,4,4'-bis(3-aminophenoxy)biphenyl,4,4'-bis(4-aminophenoxy)biphenyl,bis[4-(3-aminophenoxy)phenyl] ketone,bis[4-(4-aminophenoxy)phenyl] ketone,bis[4-(3-aminophenoxy)phenyl] sulfide,bis[4-(4-aminophenoxy)phenyl] sulfide,bis[4-(3-aminophenoxy)phenyl] sulfone andbis[4-(4-aminophenoxy)phenyl] sulfone.
摘要翻译：本发明的聚酰亚胺除了具有显着的高温稳定性外，几乎是无色的，并且具有非常高的透光率以及优异的加工性和高温下的粘合性。该聚酰亚胺是一种能用于空间和航空材料，电气和电子部件，汽车部件以及高温粘合剂的新型聚酰亚胺。聚酰亚胺具有以下结构式的重复单元：其中X是选自键，具有1至10个碳的二价烃基，六氟化异丙叉基，羰基，磺酰基自由基和硫基，并且酰亚胺环的每个氮原子同时位于醚键或对位至醚键。本发明的聚酰亚胺通过使4,4' - （对亚苯基二氧基）二邻苯二甲酸二酐与具有以下通式（V）的醚二胺反应：（V）并依次酰亚胺化得到的聚酰胺酸制备。用于制备聚酰胺的醚二胺的实例包括2,2-双[4-（3-氨基苯氧基）苯基]丙烷，2,2-双[4-（4-氨基苯氧基）苯基]丙烷，双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，2,2-双[4-（4-氨基苯氧基）苯基] -1,1,1,3， 3,3'-六氟丙烷，4,4'-双（3-氨基苯氧基）联苯，4,4'-双（4-氨基苯氧基）联苯，双[4-（3-氨基苯氧基）苯基]酮，双[4-（双[4-（3-氨基苯氧基）苯基]硫醚，双[4-（4-氨基苯氧基）苯基]硫醚，双[4-（3-氨基苯氧基）苯基]砜和双[4 - （4-氨基苯氧基）苯基]砜。

3. 发明授权

US5321096A Polyimide composition 失效
标题翻译：聚酰亚胺组合物
公开(公告)号：US5321096A
公开(公告)日：1994-06-14
申请号：US35043
申请日：1993-03-22
申请人： Yuichi Okawa , Nobuhito Koga , Hideaki Oikawa , Tadashi Asanuma , Akihiro Yamaguchi
发明人： Yuichi Okawa , Nobuhito Koga , Hideaki Oikawa , Tadashi Asanuma , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L71/00 , C08L79/08 , C08L81/06 , C08F283/04 , C08G69/48
CPC分类号： C08L71/00 , C08G73/101 , C08L79/08 , C08L81/06
摘要： A thermoplastic resin composition comprise 99.9.about.50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1.about.50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1): ##STR1## wherein R.sub.1 .about.R.sub.5 is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6.about.27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member.The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.
摘要翻译：热塑性树脂组合物包含99.9重量份的一种或多种选自芳族聚酰亚胺，芳族聚醚酰亚胺，芳族聚酰胺酰亚胺，芳族聚醚砜和芳族聚醚酮的热塑性树脂和0.1重量份的一种或多种液体具有由式（1）表示的重复结构单元的结晶型芳族聚酰亚胺：（1）n原子，氟原子，三氟甲基，甲基，乙基或氰基，可以相同或不同，R是具有 6个碳原子，并且选自由直链或桥构件相互连接的单芳族基团，缩合多芳族基团和非缩合芳族基团组成的组。本发明可以提供具有非常好的加工性和优异的热稳定性的热塑性树脂组合物，除了每种树脂的基本上优异的性能。

4. 发明授权

US4831102A Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine 失效
标题翻译：聚亚芳基 - 氧 - 双 - 马来酰亚胺和聚亚芳基二胺的热固性树脂组合物
公开(公告)号：US4831102A
公开(公告)日：1989-05-16
申请号：US71161
申请日：1987-07-08
申请人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12
CPC分类号： C08G73/121
摘要： Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and high-temperature stability.

5. 发明授权

US4960852A Thermosetting resin compostion from bis, maleimide and bis (meta-amino phenoxy) compound 失效
标题翻译：来自双，马来酰亚胺和双（间 - 氨基苯氧基）化合物的热固性树脂组合物
公开(公告)号：US4960852A
公开(公告)日：1990-10-02
申请号：US304558
申请日：1989-02-01
申请人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12
CPC分类号： C08G73/121
摘要： Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, impact strength, flexibility and high-temperature stability.

6. 发明授权

US5312866A Polyimide based resin composition 失效
标题翻译：聚酰亚胺基树脂组合物
公开(公告)号：US5312866A
公开(公告)日：1994-05-17
申请号：US883267
申请日：1992-05-14
申请人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
发明人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
IPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , C08L67/02
CPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , Y10S525/928
摘要： A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
摘要翻译：一种模塑树脂组合物，其包含99.9至50重量％的由下式表示的聚酰亚胺：（I）和0.1-50重量％的聚醚酮树脂和/或聚酯树脂，更具体地包括能够在420℃以下的温度下形成各向异性热熔融相，以及包含所述树脂和酚醛树脂，氟树脂，石墨，碳纤维，芳香族聚酰胺纤维，钛酸钾等其他添加剂的聚酰亚胺系成型树脂组合物纤维和结晶促进剂，耐热性，耐化学性，机械强度和加工性优异。

7. 发明授权

US5514748A Polyimide based resin composition comprising cured phenolic resins and liquid crystal polymers 失效
标题翻译：聚酰亚胺基树脂组合物，其包含固化的酚醛树脂和液晶聚合物
公开(公告)号：US5514748A
公开(公告)日：1996-05-07
申请号：US474380
申请日：1995-06-07
申请人： Toshihiko Isutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
发明人： Toshihiko Isutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
IPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , C08L67/02 , C08L61/10
CPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , Y10S525/928
摘要： A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
摘要翻译：一种模塑树脂组合物，其包含99.9至50重量％的由下式表示的聚酰亚胺：（I）和0.1-50重量％的聚醚酮树脂和/或聚酯树脂，更具体地包括能够在420℃以下的温度下形成各向异性热熔融相，以及包含所述树脂和酚醛树脂，氟树脂，石墨，碳纤维，芳香族聚酰胺纤维，钛酸钾等其他添加剂的聚酰亚胺系成型树脂组合物纤维和结晶促进剂，耐热性，耐化学性，机械强度和加工性优异。

8. 发明授权

US5206340A Integrated circuit socket comprising a polyimide polymer 失效
标题翻译：包含聚酰亚胺聚合物的集成电路插座
公开(公告)号：US5206340A
公开(公告)日：1993-04-27
申请号：US452369
申请日：1989-12-19
申请人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Taizo Nagahiro , Shuithi Morikawa , Nobuhito Koga
发明人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Taizo Nagahiro , Shuithi Morikawa , Nobuhito Koga
IPC分类号： C08G73/10 , G01R31/28 , H01B3/30 , H01L21/68 , H01R43/24
CPC分类号： G01R31/2863 , C08G73/105 , C08G73/1064 , C08G73/1067 , C08G73/1071 , H01B3/306 , H01L21/6835 , H01R43/24
摘要： Integrated circuit sockets for use in a burn-in test are disclosed. The IC sockets are produced by injection molding of a specific polyimide having an inherent viscosity of 0.35 to 0.65 dl/g and essentially consisting of recurring units represented by the formula (I): ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon having from 1 to 10 carbon atoms, etc. and R is a tetravalent radical selected from the group consisting of an aliphatic radical having two or more carbon atoms, cycloaliphatic radical, monoaromatic radical etc.

9. 发明授权

US4816516A Polyimide resin-fluoropolymer compositions 失效
标题翻译：聚酰亚胺树脂 - 含氟聚合物组合物
公开(公告)号：US4816516A
公开(公告)日：1989-03-28
申请号：US63962
申请日：1987-06-19
申请人： Norimasa Yamaya , Nobuhito Koga , Kenichi Baba
发明人： Norimasa Yamaya , Nobuhito Koga , Kenichi Baba
IPC分类号： C08L27/12 , C08L79/08 , C08L87/00
CPC分类号： C08L79/08 , C08L27/12 , Y10S525/928
摘要： This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula: ##STR1## wherein Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetravalent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc.Polyimide of this invention can be prepared from aromatic diamines and tetracarboxylic acid dianydrides. Suitable aromatic diamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3aminophenoxy)phenyl] sulfide etc. Suitable tetracarboxylic acid dianhydrides are pyromellitic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride.Representative fluororesin which can be used in this invention is polytetrafluoroethylene.
摘要翻译：本发明是一种聚酰亚胺树脂组合物，其含有100重量份具有下式重复单元的聚酰亚胺：其中Y为键，具有1至10个碳的二价烃基，六氟化异丙叉基，羰基，硫基，亚磺酰基，磺酰基或氧化物，R是具有至少2个碳的脂族基团的四价基团，脂环族基团，单芳族基团，缩合多芳族基团或非缩合多芳族基团，其中芳族基团与键或交联功能和5至100重量份的氟树脂。树脂组合物可以提供高温稳定性，尺寸稳定性和机械强度优异的成型体，并且摩擦系数低，耐磨性好。因此，该组合物可用作电气和电子设备的材料，精密仪器部件等。本发明的聚酰亚胺可以由芳族二胺和四羧酸二酐制备。合适的芳族二胺是4,4'-双（3-氨基苯氧基）联苯，2,2-双[4-（3-氨基苯氧基）苯基]丙烷，双[4-（3-氨基苯氧基）苯基]硫醚等。适用的四羧酸二酐是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。可用于本发明的代表性氟树脂是聚四氟乙烯。

10. 发明授权

US5087644A Carbon-fiber-reinforced polyimide resin compositions 失效
标题翻译：碳纤维增强聚酰胺树脂组合物
公开(公告)号：US5087644A
公开(公告)日：1992-02-11
申请号：US480631
申请日：1990-02-15
申请人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Nobuhito Koga
发明人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Nobuhito Koga
IPC分类号： C08J5/06
CPC分类号： C08J5/06 , C08J2379/08
摘要： Provided are carbon-fiber-reinforced polyimide resin compositions having excellent mechanical strength. The compositions are formed of (a) 5-50 parts by weight of carbon fibers, which have been obtained by coating starting carbon fibers at surfaces thereof with an aromatic polysulfone resin and then heating the thus-coated carbon fibers at 300.degree.-400.degree. C., and (b) 95-50 parts by weight of a polyimide resin which perferably have recurring units of following formula: ##STR1## wherein X represents a specific divalent radical and R represents a particular tetra-valent radical.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式