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1. 发明授权

US5525704A Resin forming compositions 失效
标题翻译：树脂成型组合物
公开(公告)号：US5525704A
公开(公告)日：1996-06-11
申请号：US547517
申请日：1995-10-24
申请人： Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C08G73/10
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译：公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

2. 发明授权

US5484948A Bismaleimide compounds 失效
标题翻译：双马来酰亚胺化合物
公开(公告)号：US5484948A
公开(公告)日：1996-01-16
申请号：US284103
申请日：1994-08-02
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C07D207/444
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译：公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

3. 发明授权

US5206438A Aromatic diamine compounds, bismaleimide compounds, thermosetting resin forming compositions therefrom, resins therefrom, and methods for their preparation 失效
标题翻译：芳族二胺化合物，双马来酰亚胺化合物，形成其组合物的热固性树脂，其树脂及其制备方法
公开(公告)号：US5206438A
公开(公告)日：1993-04-27
申请号：US601424
申请日：1990-10-23
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

4. 发明授权

US5084507A Thermosetting resin composition 失效
公开(公告)号：US5084507A
公开(公告)日：1992-01-28
申请号：US488480
申请日：1990-02-27
申请人： Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12 , C08K3/14 , C08K3/22 , C08K3/36
CPC分类号： C08K3/22 , C08G73/124 , C08G73/125 , C08G73/127 , C08K3/14 , C08K3/36
摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commerical utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

5. 发明授权

US4831102A Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine 失效
标题翻译：聚亚芳基 - 氧 - 双 - 马来酰亚胺和聚亚芳基二胺的热固性树脂组合物
公开(公告)号：US4831102A
公开(公告)日：1989-05-16
申请号：US71161
申请日：1987-07-08
申请人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12
CPC分类号： C08G73/121
摘要： Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and high-temperature stability.

6. 发明授权

US4816516A Polyimide resin-fluoropolymer compositions 失效
标题翻译：聚酰亚胺树脂 - 含氟聚合物组合物
公开(公告)号：US4816516A
公开(公告)日：1989-03-28
申请号：US63962
申请日：1987-06-19
申请人： Norimasa Yamaya , Nobuhito Koga , Kenichi Baba
发明人： Norimasa Yamaya , Nobuhito Koga , Kenichi Baba
IPC分类号： C08L27/12 , C08L79/08 , C08L87/00
CPC分类号： C08L79/08 , C08L27/12 , Y10S525/928
摘要： This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula: ##STR1## wherein Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetravalent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc.Polyimide of this invention can be prepared from aromatic diamines and tetracarboxylic acid dianydrides. Suitable aromatic diamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3aminophenoxy)phenyl] sulfide etc. Suitable tetracarboxylic acid dianhydrides are pyromellitic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride.Representative fluororesin which can be used in this invention is polytetrafluoroethylene.
摘要翻译：本发明是一种聚酰亚胺树脂组合物，其含有100重量份具有下式重复单元的聚酰亚胺：其中Y为键，具有1至10个碳的二价烃基，六氟化异丙叉基，羰基，硫基，亚磺酰基，磺酰基或氧化物，R是具有至少2个碳的脂族基团的四价基团，脂环族基团，单芳族基团，缩合多芳族基团或非缩合多芳族基团，其中芳族基团与键或交联功能和5至100重量份的氟树脂。树脂组合物可以提供高温稳定性，尺寸稳定性和机械强度优异的成型体，并且摩擦系数低，耐磨性好。因此，该组合物可用作电气和电子设备的材料，精密仪器部件等。本发明的聚酰亚胺可以由芳族二胺和四羧酸二酐制备。合适的芳族二胺是4,4'-双（3-氨基苯氧基）联苯，2,2-双[4-（3-氨基苯氧基）苯基]丙烷，双[4-（3-氨基苯氧基）苯基]硫醚等。适用的四羧酸二酐是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。可用于本发明的代表性氟树脂是聚四氟乙烯。

7. 发明授权

US5364967A Aromatic diamine compounds, bismalemide compounds, thermosetting resin forming compositions therefrom, resin therefrom, and methods for their preparation 失效
标题翻译：芳族二胺化合物，双哩组胺化合物，由其形成的热固性树脂组合物，其树脂及其制备方法
公开(公告)号：US5364967A
公开(公告)日：1994-11-15
申请号：US5276
申请日：1993-01-19
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C07C211/50
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译：公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。还公开了由式（IV）表示的双马来酰亚胺化合物其中R是H或CH 3，其中R是H或CH 3，还公开了包含这些化合物的形成树脂的组合物。这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

8. 发明授权

US5106953A Aromatic amine resins, processes for producing the same and a thermosetting resin composition containing the same 失效
标题翻译：芳族胺树脂，其制造方法和含有该组合物的热固性树脂组合物
公开(公告)号：US5106953A
公开(公告)日：1992-04-21
申请号：US511093
申请日：1990-04-19
申请人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatsuhiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
发明人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatsuhiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
IPC分类号： C07C211/50 , C08G73/12
CPC分类号： C08G73/121 , C07C211/50
摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

9. 发明授权

US5028641A Thermosetting resin composition 失效
公开(公告)号：US5028641A
公开(公告)日：1991-07-02
申请号：US388638
申请日：1989-08-02
申请人： Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12 , C08K3/14 , C08K3/22 , C08K3/36
CPC分类号： C08K3/22 , C08G73/124 , C08G73/125 , C08G73/127 , C08K3/14 , C08K3/36
摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

10. 发明授权

US5049606A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5049606A
公开(公告)日：1991-09-17
申请号：US488443
申请日：1990-02-27
申请人： Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08J5/16 , C08K3/04 , C08K3/30 , C08K3/38 , F16C33/20 , F16J9/28
CPC分类号： F16J9/28 , C08G73/1046 , C08G73/1057 , C08G73/1071 , C08K3/04 , C08K3/30 , C08K3/38 , F16C33/201
摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.

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