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1. 发明授权

US08981275B2 Solid-state image pickup device with an optical waveguide, method for manufacturing solid-state image pickup device, and camera 有权
标题翻译：具有光波导的固态图像拾取装置，固态图像拾取装置的制造方法和照相机
公开(公告)号：US08981275B2
公开(公告)日：2015-03-17
申请号：US13181626
申请日：2011-07-13
申请人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
发明人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
IPC分类号： H01L27/00 , G01J1/44 , H01L27/146 , H01L27/148
CPC分类号： H01L27/14687 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14689 , H01L27/148
摘要： A solid-state image pickup device includes a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.
摘要翻译：固态图像拾取装置包括：光接收表面上的多个像素，设置在半导体衬底的光接收表面上的光电二极管，同时基于像素分隔，设置在半导体衬底上的信号传输部分，其读取产生并存储在光电二极管中的信号电荷或对应于信号电荷的电压，设置在半导体衬底上的绝缘膜同时覆盖光电二极管，设置在绝缘膜中的凹部，设置在绝缘膜上的焊盘电极，钝化膜覆盖设置在焊盘电极上并且折射率高于氧化硅的折射率的凹部的内壁，以及设置在钝化膜上同时填充在凹部中的芯层，折射率高于氧化硅。

2. 发明授权

US08424999B2 Recording apparatus 有权
标题翻译：记录装置
公开(公告)号：US08424999B2
公开(公告)日：2013-04-23
申请号：US12715381
申请日：2010-03-01
申请人： Hideaki Kato
发明人： Hideaki Kato
IPC分类号： B41J2/165
CPC分类号： B41J11/06 , B41J2/155 , B41J19/04
摘要： A recording apparatus includes: a recording head which conducts recording onto a printing medium; a supporter which supports the recording head at a recording position; and a vibration damper interposed between the recording head and the supporter. The recording head includes a recording surface facing a printing medium and a gradient inclined relative to the recording surface. The gradient is provided at an end of the recording surface. The vibration damper abuts: at least one of the recording surface and a surface parallel to the recording surface of the recording head; and the gradient.
摘要翻译：记录装置包括：记录头，其将打印介质进行记录; 在记录位置支撑记录头的支撑件; 以及插入在记录头和支撑件之间的振动阻尼器。记录头包括面向打印介质的记录表面和相对于记录表面倾斜的梯度。梯度设置在记录表面的一端。振动阻尼器抵接在记录表面和与记录头的记录表面平行的表面中的至少一个; 和渐变。

3. 发明申请

US20120171789A1 SOLID ELEMENT DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：固体元件及其制造方法
公开(公告)号：US20120171789A1
公开(公告)日：2012-07-05
申请号：US13419093
申请日：2012-03-13
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L33/52 , H01L33/64
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.
摘要翻译：一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。

4. 发明授权

US08154047B2 Solid element device and method for manufacturing the same 有权
标题翻译：固体元件及其制造方法
公开(公告)号：US08154047B2
公开(公告)日：2012-04-10
申请号：US12923788
申请日：2010-10-07
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.
摘要翻译：固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低熔化眼镜。

5. 发明申请

US20110248146A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA 有权
标题翻译：固态图像拾取装置，制造固态图像拾取装置的方法和相机
公开(公告)号：US20110248146A1
公开(公告)日：2011-10-13
申请号：US13163129
申请日：2011-06-17
申请人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
发明人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
IPC分类号： H01L27/00 , H01L31/18
CPC分类号： H01L27/14687 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14689 , H01L27/148
摘要： A solid-state image pickup device including a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.
摘要翻译：一种固态图像拾取装置，包括在受光面上的多个像素，在半导体基板的受光面上配置的光电二极管，同时以像素为基准分割，设置在半导体基板上的信号传送部，其读取产生并存储在光电二极管中的信号电荷或对应于信号电荷的电压，设置在半导体衬底上的绝缘膜同时覆盖光电二极管，设置在绝缘膜中的凹部，设置在绝缘膜上的焊盘电极，钝化膜覆盖设置在焊盘电极上并且折射率高于氧化硅的折射率的凹部的内壁，以及设置在钝化膜上同时填充在凹部中的芯层，折射率高于氧化硅。

6. 发明申请

US20110173807A1 DISPERSION FOR DISPOSING FINE PARTICLE AT PREDETERMINED POINT ON SUBSTRATE BY INK-JET PRINTING 审中-公开
标题翻译：通过喷墨打印处理基板上预测点的细颗粒的分散
公开(公告)号：US20110173807A1
公开(公告)日：2011-07-21
申请号：US13062437
申请日：2009-09-25
申请人： Masahiro Kuzawa , Katsumi Hara , Michio Doi , Hideaki Kato
发明人： Masahiro Kuzawa , Katsumi Hara , Michio Doi , Hideaki Kato
IPC分类号： H05K3/00 , C08K5/053
CPC分类号： G02F1/13394 , C09D11/30 , G02F2001/13398 , G02F2202/022 , G02F2202/28 , Y10T29/49124
摘要： It is provided a dispersion for positioning and adhering fine particles at predetermined positions on a substrate upon heating by ink jet printing. The dispersion comprises spacers, a solvent and an adhesive additive. The adhesive additive has an average molecular weight (Mw) of 3600 or lower and a property of forming a polymer upon heating.
摘要翻译：提供了一种分散体，用于通过喷墨印刷加热将细颗粒定位并粘附在基板上的预定位置。分散体包括间隔物，溶剂和粘合剂添加剂。粘合剂添加剂的平均分子量（Mw）为3600以下，加热时形成聚合物的性质。

7. 发明申请

US20110036477A1 SHEET PEELING APPARATUS AND SHEET PEELING METHOD 有权
标题翻译：薄膜剥离装置和薄膜剥离方法
公开(公告)号：US20110036477A1
公开(公告)日：2011-02-17
申请号：US12936850
申请日：2009-03-16
申请人： Hideaki Kato
发明人： Hideaki Kato
IPC分类号： B32B38/10
CPC分类号： B65H35/0013 , B65G2207/02 , B65H29/54 , B65H2301/44335 , H01L21/67132
摘要： A sheet peeling apparatus 10 includes: a sticking means 14 for sticking a peeling tape PT by pressing the peeling tape PT onto an adhesive sheet S; a moving means 15 for moving the peeling tape PT stuck to the adhesive sheet S and a holding means 11 for holding a wafer W relative to each other to peel the adhesive sheet S; a detecting means 17 for detecting the position of the outer periphery of the adhesive sheet S, and outputting a signal thereof; an input means 18 for inputting a correction value; a controlling means 19 for determining a pressing position of the peeling tape PT to the adhesive sheet S based on the output signal from the detecting means 17 and the correction value, and controlling the moving means 15 so as to stick the adhesive sheet S at the pressing position.
摘要翻译：片材剥离装置10包括：粘贴装置14，用于通过将剥离带PT压在粘合片S上来粘贴剥离带PT; 用于移动粘贴在粘合片S上的剥离带PT的移动装置15和用于保持晶片W相对于彼此剥离粘合片S的保持装置11; 检测装置17，用于检测粘合片S的外周的位置，并输出其信号; 用于输入校正值的输入装置18; 控制装置19，用于根据来自检测装置17的输出信号和修正值确定剥离带PT到粘合片S的按压位置，以及控制移动装置15以将粘合片S粘贴在按压位置。

8. 发明申请

US20080135732A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA 有权
标题翻译：固态图像拾取装置，制造固态图像拾取装置的方法和相机
公开(公告)号：US20080135732A1
公开(公告)日：2008-06-12
申请号：US11950680
申请日：2007-12-05
申请人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
发明人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14687 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14689 , H01L27/148
摘要： A solid-state image pickup device includes a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.
摘要翻译：固态图像拾取装置包括：光接收表面上的多个像素，设置在半导体衬底的光接收表面上的光电二极管，同时基于像素分隔，设置在半导体衬底上的信号传输部分，其读取产生并存储在光电二极管中的信号电荷或对应于信号电荷的电压，设置在半导体衬底上的绝缘膜同时覆盖光电二极管，设置在绝缘膜中的凹部，设置在绝缘膜上的焊盘电极，钝化膜覆盖设置在焊盘电极上并且折射率高于氧化硅的折射率的凹部的内壁，以及设置在钝化膜上同时填充在凹部中的芯层，折射率高于氧化硅。

9. 发明授权

US06953265B2 Light source device 失效
标题翻译：光源装置
公开(公告)号：US06953265B2
公开(公告)日：2005-10-11
申请号：US10422809
申请日：2003-04-25
申请人： Yoshinobu Suehiro , Yuji Takahashi , Takemasa Yasukawa , Hideaki Kato , Hideki Omoya , Hideyuki Nakano , Hisao Yamaguchi
发明人： Yoshinobu Suehiro , Yuji Takahashi , Takemasa Yasukawa , Hideaki Kato , Hideki Omoya , Hideyuki Nakano , Hisao Yamaguchi
IPC分类号： H01L33/60 , F21V1/00 , F21V11/00
CPC分类号： H01L33/60 , F21W2111/02 , F21W2121/008 , F21Y2105/10 , F21Y2115/10 , G09F9/33 , G09F13/22 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , Y10S362/80 , H01L2924/00 , H01L2924/00014
摘要： A light source device has a light shielding member having an aperture, a light source arranged on one side of the light shielding member, and a converging member arranged relatively with respect to the light source and the light source to thereby converge light emitted from the light source in the aperture or in a vicinity of the aperture. Another type of light source device has a single light source, and a converging member for converging light from the light source to thereby distribute the light to at least two points. Still another type of light source device has a light source, and a reflecting mirror arranged to enclose a side of a light emission direction of the light source, the reflecting mirror reflecting light emitted from the light source in a direction except the light source so that the light is radiated outside.
摘要翻译：光源装置具有遮光构件，其具有孔，设置在遮光构件的一侧的光源和相对于光源和光源布置的会聚构件，从而会聚从光发射的光来源于光圈或光圈附近。另一种类型的光源装置具有单个光源，以及会聚构件，用于会聚来自光源的光，从而将光分配到至少两个点。又一种类型的光源装置具有光源，反射镜被布置为包围光源的发光方向的一侧，反射镜反射从光源发射的光沿除了光源的方向，使得灯光在外面辐射。

10. 发明申请

US20050082561A1 Light emitting diode and manufacturing method thereof 有权
标题翻译：发光二极管及其制造方法
公开(公告)号：US20050082561A1
公开(公告)日：2005-04-21
申请号：US10972534
申请日：2004-10-26
申请人： Yoshinobu Suehiro , Hideaki Kato , Kunihiro Hadame
发明人： Yoshinobu Suehiro , Hideaki Kato , Kunihiro Hadame
IPC分类号： F21S8/10 , F21V11/12 , F21V13/10 , H01L33/54 , H01L33/60 , H01L33/64 , H01L21/00 , H01L33/00
CPC分类号： F21V29/83 , F21S43/14 , F21V11/12 , F21V13/10 , F21V29/74 , F21Y2115/10 , H01L33/54 , H01L33/60 , H01L33/647 , H01L2224/13 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.
摘要翻译：发光二极管具有其中具有散热导电构件的基板和安装在基板上的发光元件。发光元件的至少一部分直接与放热导电部件接触并电连接。

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