专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050106382A1 Anisotropic conductive film and method for producing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US20050106382A1
公开(公告)日：2005-05-19
申请号：US10506425
申请日：2003-03-03
申请人： Hideaki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
发明人： Hideaki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , H01R4/04 , H01R43/00 , H05K3/32 , B32B15/04
CPC分类号： H01R4/04 , G01R1/06755 , G01R1/073 , G01R3/00 , H01R43/007 , Y10T428/25 , Y10T428/258 , Y10T428/31678
摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
摘要翻译：各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离当安装接触探针时，链条的直径设定在1mum-20mum的范围内。在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

2. 发明授权

US07390442B2 Anisotropic conductive film and method for producing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US07390442B2
公开(公告)日：2008-06-24
申请号：US10506425
申请日：2003-03-03
申请人： Hideki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
发明人： Hideki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
IPC分类号： H01B1/02 , H01B1/22
CPC分类号： H01R4/04 , G01R1/06755 , G01R1/073 , G01R3/00 , H01R43/007 , Y10T428/25 , Y10T428/258 , Y10T428/31678
摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
摘要翻译：各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离当安装接触探针时，链条的直径设定在1mum-20mum的范围内。在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

3. 发明授权

US07220370B2 Plating and production methods for producing a fine metal component using a conductive paste 失效
标题翻译：使用导电膏制造精细金属成分的电镀和制造方法
公开(公告)号：US07220370B2
公开(公告)日：2007-05-22
申请号：US10487345
申请日：2002-08-21
申请人： Jun Yorita , Shinji Inazawa , Masatoshi Majima , Hideki Kashihara , Toshihiro Sakamoto , Hideaki Toshioka
发明人： Jun Yorita , Shinji Inazawa , Masatoshi Majima , Hideki Kashihara , Toshihiro Sakamoto , Hideaki Toshioka
IPC分类号： H01B1/00 , H01B1/02 , H01B1/12 , B05D5/12 , B05D7/00
CPC分类号： H05K3/205 , C25D1/08 , C25D1/10 , C25D5/022 , H01L21/283 , H01L21/2885 , H05K3/202 , H05K3/323 , H05K2201/035
摘要： A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.
摘要翻译：一种制造精细金属成分的方法，其中镀在镀膜上的导电膜上沉积在模具中的细通孔图案部分上以形成细金属成分，其中导电膜由金属金属颗粒以链状磁性连接在一起的粉末。

4. 发明申请

US20100175507A1 PROCESS FOR PRODUCTION OF CHAIN METAL POWDERS, CHAIN METAL POWDERS PRODUCED THEREBY, AND ANISOTROPIC CONDUCTIVE FILM FORMED BY USING THE POWDERS 有权
标题翻译：链金属粉末生产工艺，生产的链金属粉末和使用粉末形成的各向异性导电膜
公开(公告)号：US20100175507A1
公开(公告)日：2010-07-15
申请号：US12687014
申请日：2010-01-13
申请人： Tetsuya KUWABARA , Hideaki Toshioka , Hideki Kashihara , Keiji Koyama , Takashi Sakai
发明人： Tetsuya KUWABARA , Hideaki Toshioka , Hideki Kashihara , Keiji Koyama , Takashi Sakai
IPC分类号： B22F9/16
CPC分类号： B22F9/24 , B22F2999/00 , H01F1/06 , H01F1/42 , Y10T428/12181 , Y10T428/256 , B22F2202/05
摘要： A process for production of a chain metal powder, which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
摘要翻译：一种生产链状金属粉末的方法，包括以下步骤：在还原过程中在能够产生气体的还原剂的存在下，向溶液中施加磁场，同时还原金属离子，金属离子和可发泡水溶性化合物，通过产生气体，在水溶液表面上形成气泡层，形成链状金属粉末，将形成在水溶液表面上的气泡层与溶液分离，以及收集气泡层中所含的链状金属粉末。

5. 发明授权

US07588698B2 Circuit connecting adhesive 失效
标题翻译：电路连接胶
公开(公告)号：US07588698B2
公开(公告)日：2009-09-15
申请号：US11578334
申请日：2005-12-02
申请人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
发明人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
IPC分类号： H01B1/00 , H01B1/04 , H01B1/06 , H01B1/02 , H01B1/22
CPC分类号： C09J163/00 , C09J9/02 , H01B1/22 , H01B1/24 , H01R4/04
摘要： A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.
摘要翻译：提供了耐热性和耐湿性优异的电路耦合粘合剂。本发明的电路耦合粘合剂可以用于需要高性能可靠性的目的，因为它在电极连接时表现出令人满意的导电/绝缘性能，并且特性即使在长时间在高温高湿环境下使用。电路耦合粘合剂包括环氧树脂，潜伏性固化剂，平均粒径为500nm以下的无机填料和导电性颗粒作为必要成分。通过混合足量的平均粒径为500nm以下的无机填料，能够降低热膨胀系数，提高耐热性和耐湿性。

6. 发明申请

US20070224440A1 Process for Production of Chain Metal Powders, Chain Metal Powders Produced Thereby, and Anisotropic Conductive Film Formed Using the Powders 有权
标题翻译：生产链金属粉末的方法，由此生产的链金属粉末和使用粉末形成的各向异性导电膜
公开(公告)号：US20070224440A1
公开(公告)日：2007-09-27
申请号：US11579186
申请日：2005-04-27
申请人： Tetsuya Kuwabara , Hideaki Toshioka , Hideki Kashihara , Keiji Koyama , Takashi Sakai
发明人： Tetsuya Kuwabara , Hideaki Toshioka , Hideki Kashihara , Keiji Koyama , Takashi Sakai
IPC分类号： B22F9/24 , H01B5/16
CPC分类号： B22F9/24 , B22F2999/00 , H01F1/06 , H01F1/42 , Y10T428/12181 , Y10T428/256 , B22F2202/05
摘要： A chain metal powder, which is free from branches and has a small distribution of the chain length, can be produced by a process of reducing metal ions contained in an aqueous solution, while applying a magnetic field to the solution containing ferromagnetic ions, in the presence of a polymer compound comprising repeating units of the formula (1): and repeating unit of the formula (2): or repeating unit of the formula (4); or a process which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
摘要翻译：通过在含有铁磁离子的溶液中施加磁场的方法，可以通过还原金属离子的方法来制造链状金属粉末，其不含分支并具有小的链长分布，存在包含式（1）的重复单元的聚合物化合物和式（2）的重复单元：或式（4）的重复单元; 或者在金属离子还原过程中能够产生气体的还原剂和可发泡水溶性的存在下，同时在溶液中施加磁场的同时还原包含在水溶液中的金属离子的步骤化合物，通过产生气体，在水溶液的表面上形成气泡层，形成链状金属粉末，将形成在水溶液表面上的气泡层与溶液分离，并收集含有的链状金属粉末气泡层。

7. 发明授权

US07736541B2 Anisotropic conductive adhesive 失效
标题翻译：各向异性导电胶
公开(公告)号：US07736541B2
公开(公告)日：2010-06-15
申请号：US11992790
申请日：2006-09-26
申请人： Hideaki Toshioka , Masamichi Yamamoto
发明人： Hideaki Toshioka , Masamichi Yamamoto
IPC分类号： H01B1/00 , H01B1/20 , H01B1/22
CPC分类号： C09J9/02 , C08G59/621 , C08L61/00 , C08L63/00 , C09J163/00 , H01B1/22 , H01R4/04 , H01R43/007 , H05K3/323 , H05K2201/0209 , Y10T428/28 , Y10T428/31511 , C08L2666/22
摘要： An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.
摘要翻译：提供了包括环氧树脂，苯氧树脂，固化剂，无机填料和作为组分的导电颗粒的各向异性导电粘合剂。控制苯氧基树脂的玻璃化转变温度（Tg）在66℃至100℃的范围内，使得各向异性导电粘合剂在安装过程中具有优异的流动性，令人满意的导电/绝缘性能，并具有足够的粘合性。由于各向异性导电粘合剂的性质即使在高温高湿条件下长期使用粘合剂也几乎不变，所以各向异性导电粘合剂可用于需要高可靠性的应用。

8. 发明申请

US20090140210A1 Anisotropic Conductive Adhesive 失效
标题翻译：各向异性导电胶
公开(公告)号：US20090140210A1
公开(公告)日：2009-06-04
申请号：US11992790
申请日：2006-09-26
申请人： Hideaki Toshioka , Masamichi Yamamoto
发明人： Hideaki Toshioka , Masamichi Yamamoto
IPC分类号： C09J163/00
CPC分类号： C09J9/02 , C08G59/621 , C08L61/00 , C08L63/00 , C09J163/00 , H01B1/22 , H01R4/04 , H01R43/007 , H05K3/323 , H05K2201/0209 , Y10T428/28 , Y10T428/31511 , C08L2666/22
摘要： An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.
摘要翻译：提供了包括环氧树脂，苯氧树脂，固化剂，无机填料和作为组分的导电颗粒的各向异性导电粘合剂。控制苯氧基树脂的玻璃化转变温度（Tg）在66℃至100℃的范围内，使得各向异性导电粘合剂在安装过程中具有优异的流动性，令人满意的导电/绝缘性能，并具有足够的粘合性。由于各向异性导电粘合剂的性质即使在高温高湿条件下长期使用粘合剂也几乎不变，所以各向异性导电粘合剂可用于需要高可靠性的应用。

9. 发明申请

US20070215838A1 Circuit Connecting Adhesive 失效
标题翻译：电路连接胶
公开(公告)号：US20070215838A1
公开(公告)日：2007-09-20
申请号：US11578334
申请日：2005-12-02
申请人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
发明人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
IPC分类号： H01B1/12
CPC分类号： C09J163/00 , C09J9/02 , H01B1/22 , H01B1/24 , H01R4/04
摘要： A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.
摘要翻译：提供了耐热性和耐湿性优异的电路耦合粘合剂。本发明的电路耦合粘合剂可以用于需要高性能可靠性的目的，因为它在电极连接时表现出令人满意的导电/绝缘性能，并且特性即使在长时间在高温高湿环境下使用。电路耦合粘合剂包括环氧树脂，潜伏性固化剂，平均粒径为500nm以下的无机填料和导电性颗粒作为必要成分。通过混合足量的平均粒径为500nm以下的无机填料，能够降低热膨胀系数，提高耐热性和耐湿性。

10. 发明授权

US08038762B2 Process for production of chain metal powders, chain metal powers produced thereby, and anisotropic conductive film formed by using the powders 有权
标题翻译：生产链状金属粉末的方法，由此生产的链状金属粉末以及通过使用粉末形成的各向异性导电膜
公开(公告)号：US08038762B2
公开(公告)日：2011-10-18
申请号：US12687014
申请日：2010-01-13
申请人： Tetsuya Kuwabara , Hideaki Toshioka , Hideki Kashihara , Keiji Koyama , Takashi Sakai
发明人： Tetsuya Kuwabara , Hideaki Toshioka , Hideki Kashihara , Keiji Koyama , Takashi Sakai
IPC分类号： B22F9/26
CPC分类号： B22F9/24 , B22F2999/00 , H01F1/06 , H01F1/42 , Y10T428/12181 , Y10T428/256 , B22F2202/05
摘要： A process for production of a chain metal powder, which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
摘要翻译：一种生产链状金属粉末的方法，包括以下步骤：在还原过程中在能够产生气体的还原剂的存在下，向溶液中施加磁场，同时还原金属离子，金属离子和可发泡水溶性化合物，通过产生气体，在水溶液表面上形成气泡层，形成链状金属粉末，将形成在水溶液表面上的气泡层与溶液分离，以及收集气泡层中所含的链状金属粉末。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式