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1. 发明授权

US09226406B2 Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device 有权
标题翻译：电极连接方法，电极连接结构，用于其的导电粘合剂和电子装置
公开(公告)号：US09226406B2
公开(公告)日：2015-12-29
申请号：US13377998
申请日：2010-06-04
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
IPC分类号： B32B9/04 , H05K3/32 , C09J9/02 , H05K3/36 , H05K3/28
CPC分类号： H05K3/323 , C09J9/02 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/01005 , H01L2924/01027 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H05K3/282 , H05K3/361 , H05K2201/023 , H05K2201/0379 , Y10T156/10 , H01L2924/00
摘要： By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.
摘要翻译：通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

2. 发明授权

US09012386B2 Grease composition for hub unit bearing employing an angular contact ball bearing and hub unit bearing 有权
标题翻译：使用角接触球轴承和轮毂单元轴承的轮毂单元轴承的润滑脂组成
公开(公告)号：US09012386B2
公开(公告)日：2015-04-21
申请号：US13580217
申请日：2011-02-28
申请人： Osamu Saita , Takashi Azuma , Masamichi Yamamoto
发明人： Osamu Saita , Takashi Azuma , Masamichi Yamamoto
IPC分类号： C10M115/08 , C10M137/10 , C10M115/10 , C10M133/20 , C10M133/12 , C10M149/00 , C10M129/10 , F16C33/66 , C10M169/06
CPC分类号： F16C33/6633 , C10M169/06 , C10M2207/1236 , C10M2207/1245 , C10M2215/1026 , C10M2219/044 , C10M2219/068 , C10M2223/045 , C10N2210/01 , C10N2230/02 , C10N2230/06 , C10N2230/72 , C10N2240/02 , C10N2250/10 , C10N2210/02 , C10N2210/06
摘要： The invention provides a grease composition for a hub unit bearing employing an angular contact ball bearing, containing (a) as a thickener a mixture of diurea compounds represented by formula (I): R1—NHCONH—R2—NHCONH—R1, formula (II): R1—NHCONH—R2—NHCONH—R3, and formula (III): R3—NHCONH—R2—NHCONH—R3 wherein R1 is cyclohexyl group, R2 is a divalent aromatic hydrocarbon group having 6 to 15 carbon atoms, R3 is a straight-chain or branched alkyl group having 12 to 20 carbon atoms, and (R1/(R1+R3))×100=85 to 95 mol %; (b) a base oil; (c) a molybdenum dialkyldithiocarbamate; and (d) a calcium sulfonate. The grease composition of the invention, when used in the hub unit bearing, shows minimum leakage, excellent anti-flaking properties and satisfactory bearing lubrication life.
摘要翻译：本发明提供一种用于使用角接触球轴承的轮毂单元轴承的润滑脂组合物，其包含（a）作为增稠剂的由式（I）表示的二脲化合物的混合物：R1-NHCONH-R2-NHCONH-R1，式（II ）：R1-NHCONH-R2-NHCONH-R3和式（III）：R3-NHCONH-R2-NHCONH-R3其中R1是环己基，R2是碳原子数6〜15的二价芳香族烃基，R3是具有12〜20个碳原子的直链或支链烷基，（R1 /（R1 + R3））×100 = 85〜95摩尔％（b）基础油; （c）二烷基二硫代氨基甲酸钼; 和（d）磺酸钙。本发明的润滑脂组合物在轮毂单元轴承中使用时，显示出最小的泄漏，优异的抗剥落性能和令人满意的轴承润滑寿命。

3. 发明授权

US08470438B2 Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus 有权
标题翻译：电极连接结构，用于其的导电粘合剂和电子设备
公开(公告)号：US08470438B2
公开(公告)日：2013-06-25
申请号：US13139926
申请日：2010-06-04
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
IPC分类号： B32B5/16
CPC分类号： H05K3/323 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/81815 , H01L2924/00014 , H01L2924/12044 , H01L2924/14 , H05K3/361 , H05K2201/023 , H05K2203/104 , Y10T428/24372 , Y10T428/24413 , Y10T428/249921 , Y10T428/25 , Y10T428/268 , H01L2924/00 , H01L2224/0401
摘要： There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.
摘要翻译：通过使用导电性粘合剂将各自包括作为防氧化膜的有机膜彼此连接的连接电极简化为生产工艺，提供了以低成本生产的高可靠性产生的高可靠性的连接结构。其中第一连接电极2和第二连接电极10之间的导电粘合剂层9彼此连接的电极连接结构包括形成在至少第一连接电极上的有机膜6和11以及包含的导电颗粒8 颗粒的长轴在导电粘合剂层的厚度方向上定向，并且长轴的平均长度大于至少有机膜和导电粘合剂层的总厚度，其中导电颗粒刺穿有机物并与第一连接电极和第二连接电极接触。

4. 发明申请

US20120085580A1 ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE 有权
标题翻译：电极连接方法，电极连接结构，其使用的导电粘合剂和电子装置
公开(公告)号：US20120085580A1
公开(公告)日：2012-04-12
申请号：US13377998
申请日：2010-06-04
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
IPC分类号： H01R4/00 , B23K1/00 , C09J9/02 , B32B37/12
CPC分类号： H05K3/323 , C09J9/02 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/01005 , H01L2924/01027 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H05K3/282 , H05K3/361 , H05K2201/023 , H05K2201/0379 , Y10T156/10 , H01L2924/00
摘要： By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.
摘要翻译：通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

5. 发明授权

US08088863B2 Organic-solvent dispersion of fine polysilsesquioxane particle, process for producing the same, aqueous dispersion of fine polysilsesquioxane particle, and process for producing the same 有权
标题翻译：精细倍半硅氧烷颗粒的有机溶剂分散体，其制造方法，精细倍半硅氧烷颗粒的水分散体及其制造方法
公开(公告)号：US08088863B2
公开(公告)日：2012-01-03
申请号：US11794177
申请日：2005-12-27
申请人： Chenghuan Ma , Masamichi Yamamoto , Fumio Oi
发明人： Chenghuan Ma , Masamichi Yamamoto , Fumio Oi
IPC分类号： C08G77/06
CPC分类号： C08J3/09 , C08J2383/04
摘要： An organic-solvent dispersion containing fine polysilsesquioxane particles stably dispersed therein, which is obtained by adjusting the pH of an aqueous dispersion of fine polysilsesquioxane particles to 2 to 9, subsequently adding an organic solvent thereto, and then removing the water from the system; and an aqueous dispersion of fine polysilsesquioxane particles having an appropriate average particle diameter, which is obtained by adjusting the amount of a base catalyst to be used so as to be in a specific range. The process for producing an aqueous dispersion of fine polysilsesquioxane particles having a pH of 2 to 9 with an organic solvent. The process for producing an aqueous dispersion of fine polysilsesquioxane particles having an average particle diameter of 1 to 40 nm comprises mixing a dispersion stabilizer, a base catalyst, and trialkoxysilane in the presence of an aqueous solvent to produce an aqueous dispersion of fine polysilsesquioxane particles, and is characterized in that the base catalyst is used in an amount of 4 to 45 mmol/L per total amount of the aqueous solvent.
摘要翻译：通过将细聚倍半硅氧烷颗粒的水性分散体的pH调节至2〜9，然后向其中加入有机溶剂，然后从体系中除去水而获得的包含稳定分散在其中的细聚倍半硅氧烷颗粒的有机溶剂分散体。以及通过将所使用的碱催化剂的量调整到特定范围而得到的具有适当的平均粒径的细聚倍半硅氧烷颗粒的水分散体。用有机溶剂制备pH为2〜9的细聚倍半硅氧烷颗粒的水分散体的方法。制备平均粒径为1〜40nm的细聚倍半硅氧烷颗粒的水性分散体的方法包括在水性溶剂的存在下混合分散稳定剂，碱催化剂和三烷氧基硅烷，以制备细聚倍半硅氧烷颗粒的水性分散体，其特征在于，所述碱催化剂的用量为每水溶剂总量为4〜45mmol / L。

6. 发明申请

US20110147048A1 ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME 有权
标题翻译：电极结构，接线体，粘合连接结构，电子器件及其制造方法
公开(公告)号：US20110147048A1
公开(公告)日：2011-06-23
申请号：US13060845
申请日：2010-04-13
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Takashi Yamaguchi , Shigeki Kawakami , Michihiro Kimura
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Takashi Yamaguchi , Shigeki Kawakami , Michihiro Kimura
IPC分类号： H01B5/00 , H01R43/02
CPC分类号： H05K3/282 , H01L2924/0002 , H05K1/148 , H05K3/305 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0248 , H05K2201/0373 , H05K2201/083 , H05K2201/10977 , H05K2203/104 , Y10T29/49213 , H01L2924/00
摘要： There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.
摘要翻译：提供了一种电极结构，其通过用主要由热固性树脂构成的各向异性导电粘合剂与连接导体电连接，该电极结构包括使用粘合剂连接的电极，该电极设置在基材上以及作为氧化防止膜的有机膜，其被配置为使用粘合剂覆盖用于连接的电极的表面，其中有机膜具有比要进行的热处理的最高温度更高的分解温度。还提供了布线体和使用粘合剂的连接结构。

7. 发明授权

US07588698B2 Circuit connecting adhesive 失效
标题翻译：电路连接胶
公开(公告)号：US07588698B2
公开(公告)日：2009-09-15
申请号：US11578334
申请日：2005-12-02
申请人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
发明人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
IPC分类号： H01B1/00 , H01B1/04 , H01B1/06 , H01B1/02 , H01B1/22
CPC分类号： C09J163/00 , C09J9/02 , H01B1/22 , H01B1/24 , H01R4/04
摘要： A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.
摘要翻译：提供了耐热性和耐湿性优异的电路耦合粘合剂。本发明的电路耦合粘合剂可以用于需要高性能可靠性的目的，因为它在电极连接时表现出令人满意的导电/绝缘性能，并且特性即使在长时间在高温高湿环境下使用。电路耦合粘合剂包括环氧树脂，潜伏性固化剂，平均粒径为500nm以下的无机填料和导电性颗粒作为必要成分。通过混合足量的平均粒径为500nm以下的无机填料，能够降低热膨胀系数，提高耐热性和耐湿性。

8. 发明授权

US08507803B2 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity 有权
标题翻译：连接印刷电路板的结构，印刷电路板的连接方法和具有各向异性导电性的粘合剂
公开(公告)号：US08507803B2
公开(公告)日：2013-08-13
申请号：US12722810
申请日：2010-03-12
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
IPC分类号： H05K1/03
CPC分类号： H05K3/323 , H05K2201/0248 , H05K2201/083 , H05K2203/083 , H05K2203/087 , H05K2203/104 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.
摘要翻译：本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a，粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

9. 发明申请

US20120142566A1 GREASE COMPOSITION AND MECHANICAL PART 审中-公开
标题翻译：油脂组合物和机械部件
公开(公告)号：US20120142566A1
公开(公告)日：2012-06-07
申请号：US13389711
申请日：2010-08-10
申请人： Masamichi Yamamoto
发明人： Masamichi Yamamoto
IPC分类号： C10M169/04
CPC分类号： C10M169/06 , C10M2203/1006 , C10M2205/0285 , C10M2207/122 , C10M2207/126 , C10M2207/16 , C10M2215/04 , C10M2215/1026 , C10M2219/046 , C10M2223/043 , C10M2223/045 , C10N2210/02 , C10N2220/022 , C10N2230/02 , C10N2230/06 , C10N2240/02 , C10N2240/04 , C10N2240/50 , C10N2250/10
摘要： The invention provides a grease composition containing a base oil, a thickener and an additive, characterized in that the base oil has a kinetic viscosity at 40° C. of 50 to 200 mm2/s; the thickener contains a diurea compound represented by formula (I): R1—NHCONH—R2—NHCONH—R3 (wherein R2 is a divalent aromatic hydrocarbon group having 6 to 15 carbon atoms, and R1 and R3, which may be the same or different, represent cyclohexyl group or a straight-chain or branched alkyl group having 8 to 22 carbon atoms); and the additive is at least one selected from the group consisting of a metal salt of naphthenic acid, a salt of a fatty acid having 6 to 10 carbon atoms and an aliphatic amine having 6 to 10 carbon atoms, and a metal salt of an organic sulfonic acid. The composition of the invention shows excellent anti-fretting properties under the conditions of ordinary temperature to low temperature (e.g., −50° C., preferably about −40° C.).
摘要翻译：本发明提供一种含有基础油，增稠剂和添加剂的润滑脂组合物，其特征在于，所述基油在40℃下的动力粘度为50〜200mm 2 / s; 增稠剂含有由式（I）表示的二脲化合物：R1-NHCONH-R2-NHCONH-R3（其中R2是具有6至15个碳原子的二价芳族烃基，R1和R3可以相同或不同）表示环己基或碳原子数为8〜22的直链或支链烷基）。所述添加剂为选自环烷酸金属盐，碳原子数为6〜10的脂肪酸的盐和碳原子数为6〜10的脂肪族胺的金属盐和有机金属盐中的至少一种磺酸。本发明的组合物在常温至低温（例如-50℃，优选约-40℃）的条件下显示优异的抗微动特性。

10. 发明授权

US07390442B2 Anisotropic conductive film and method for producing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US07390442B2
公开(公告)日：2008-06-24
申请号：US10506425
申请日：2003-03-03
申请人： Hideki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
发明人： Hideki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
IPC分类号： H01B1/02 , H01B1/22
CPC分类号： H01R4/04 , G01R1/06755 , G01R1/073 , G01R3/00 , H01R43/007 , Y10T428/25 , Y10T428/258 , Y10T428/31678
摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
摘要翻译：各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离当安装接触探针时，链条的直径设定在1mum-20mum的范围内。在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

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