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1. 发明申请

US20050261290A1 Novel compounds of proline and morpholine derivatives 审中-公开
标题翻译：脯氨酸和吗啉衍生物的新型化合物
公开(公告)号：US20050261290A1
公开(公告)日：2005-11-24
申请号：US11122599
申请日：2005-05-04
申请人： Hengmiao Cheng , Stephan Cripps , Klaus Dress , Jacqui Hoffman , Buwen Huang , Stanley Kupchinsky , Phuong Le , Sajiv Nair , Timothy Parrott , Christopher Smith , Yong Wang , Yi Yang
发明人： Hengmiao Cheng , Stephan Cripps , Klaus Dress , Jacqui Hoffman , Buwen Huang , Stanley Kupchinsky , Phuong Le , Sajiv Nair , Timothy Parrott , Christopher Smith , Yong Wang , Yi Yang
IPC分类号： A61K31/401 , A61K31/4025 , A61K31/445 , A61K31/5375 , A61K31/5377 , C07D207/16 , C07D211/26 , C07D211/60 , C07D211/96 , C07D241/24 , C07D265/30 , C07D277/06 , C07D401/06 , C07D401/12 , C07D403/06 , C07D405/06 , C07D413/02 , C07D413/06 , C07D413/12 , C07D453/06 , C07D471/04 , C07D43/02
CPC分类号： C07D211/26 , C07D207/16 , C07D211/60 , C07D211/96 , C07D241/24 , C07D265/30 , C07D277/06 , C07D401/06 , C07D401/12 , C07D403/06 , C07D405/06 , C07D413/06 , C07D413/12 , C07D453/06 , C07D471/04
摘要： The present invention relates to compounds with the formulas (I), (II), and (III), or a pharmaceutically acceptable salt thereof: wherein T is a (4 to 10)-membered heterocyclyl selected from the group consisting of and wherein R1, R2 and R3 are as defined in the specification. The invention also relates to pharmaceutical compositions comprising the compounds of formulas (I), (II), and (III) and methods of treating a condition that is mediated by the modulation of the 11-β-hsd-1 enzyme, the method comprising administering to a mammal an effective amount of a compound of formulas (I), (II), and (III).
摘要翻译：本发明涉及具有式（I），（II）和（III）的化合物或其药学上可接受的盐：其中T是选自下组的（4至10）元素的杂环基，其中R R 1，R 2和R 3如说明书中所定义。本发明还涉及包含式（I），（II）和（III）化合物的药物组合物和治疗由11-β-hsd-1酶的调节介导的病症的方法，所述方法包括向哺乳动物施用有效量的式（I），（II）和（III）的化合物。

2. 发明申请

US20080090801A1 4-METHYLPYRIDOPYRIMIDINONE COMPOUNDS 有权
标题翻译： 4-甲基吡啶二恶英酮化合物
公开(公告)号：US20080090801A1
公开(公告)日：2008-04-17
申请号：US11854999
申请日：2007-09-13
申请人： Hengmiao Cheng , Dilip Bhumralkar , Klaus Dress , Jacqui Hoffman , Mary Johnson , Robert Kania , Phuong Le , Mitchell Nambu , Mason Pairish , Michael Plewe , Khanh Tran
发明人： Hengmiao Cheng , Dilip Bhumralkar , Klaus Dress , Jacqui Hoffman , Mary Johnson , Robert Kania , Phuong Le , Mitchell Nambu , Mason Pairish , Michael Plewe , Khanh Tran
IPC分类号： A61K31/519 , A61P35/00 , C07D471/04
CPC分类号： C07D471/04
摘要： The present invention is directed to novel 4-methylpyridopyrimidinone compounds of Formula (I), and to salts thereof, their synthesis, and their use as inhibitors of phosphoinositide 3-kinase alpha (PI3-Kα).
摘要翻译：本发明涉及式（I）的新颖的4-甲基吡啶并嘧啶酮化合物及其盐，它们的合成及其作为磷酸肌醇3-激酶α（PI3-Kalpha）抑制剂的用途。

3. 外观设计

USD897558S1 Fence 有权
公开(公告)号：USD897558S1
公开(公告)日：2020-09-29
申请号：US29699934
申请日：2019-07-30
申请人： Phuong Le
设计人： Phuong Le
摘要： FIG. 1 is a perspective view of a fence.
FIG. 2 is a front view of a fence.
FIG. 3 is a rear view of the fence.
FIG. 4 is a left side view of the fence.
FIG. 5 is a right side view of the fence.
FIG. 6 is a top view of the fence; and,
FIG. 7 is a bottom view of the fence.

4. 发明授权

US06249205B1 Surface mount inductor with flux gap and related fabrication methods 有权
标题翻译：具有磁通隙的表面贴装电感及相关制造方法
公开(公告)号：US06249205B1
公开(公告)日：2001-06-19
申请号：US09197743
申请日：1998-11-20
申请人： Richard W. Meadors , James A. Smith , Craig P. Cameron , Phuong Le
发明人： Richard W. Meadors , James A. Smith , Craig P. Cameron , Phuong Le
IPC分类号： H01F500
CPC分类号： H01F17/0013 , H01F27/292
摘要： An inductor, such as for electromagnetic interference (EMI) suppression, comprises a plurality of ferrite layers arranged in stacked relation and joined together to define a ferrite body, and a first electrical conductor extending between a first pair of adjacent ferrite layers. The inductor includes first respective opposing portions of the first pair of adjacent ferrite layers being sintered together, and second respective opposing portions of the first pair of adjacent ferrite layers being in spaced apart relation to define at least one first gap therebetween. Moreover, the device includes a sintering blocking material associated with the at least one first gap. The sintering blocking material causes the gap to form in the ferrite body to selectively block the magnetic path to thereby retain a higher inductance than would otherwise be possible at relatively high currents. In a surface mounting embodiment of the inductor, the ferrite body has a generally rectangular shape. In addition, a pair of end conductors are provided on opposing ends of the ferrite body to facilitate surface mounting of the inductor. The sintering blocking material may comprise a non-magnetic material. In particular, the sintering blocking material may comprise titanium-dioxide.
摘要翻译：诸如用于电磁干扰（EMI）抑制的电感器包括以层叠关系布置并连接在一起以限定铁氧体本体的多个铁氧体层，以及在第一对相邻的铁氧体层之间延伸的第一电导体。所述电感器包括所述第一对相邻铁氧体层的第一相对的相对部分被烧结在一起，并且所述第一对相邻铁氧体层的第二对应部分间隔开，以在其间限定至少一个第一间隙。此外，该装置包括与至少一个第一间隙相关联的烧结阻挡材料。烧结阻挡材料在铁氧体中形成间隙以选择性地阻挡磁路，从而保持比在较高电流下可能的电感更高的电感。在电感器的表面安装实施例中，铁氧体主体具有大致矩形形状。此外，一对端部导体设置在铁氧体的相对端部，以便于电感器的表面安装。烧结阻挡材料可以包括非磁性材料。特别地，烧结阻挡材料可以包括二氧化钛。

5. 发明授权

US09188355B1 Fan array control system 有权
标题翻译：风机阵列控制系统
公开(公告)号：US09188355B1
公开(公告)日：2015-11-17
申请号：US13342902
申请日：2012-01-03
申请人： Don Allen , Jay Kamani , Phuong Le , Jack Cornelius
发明人： Don Allen , Jay Kamani , Phuong Le , Jack Cornelius
IPC分类号： F24F11/00
CPC分类号： F24F11/77 , F24F11/0001 , F24F11/64
摘要： A system and method for intelligent management of an array of fans. The system uses mean-time-between-failure, fan usage and other data in add ventilation, subtract ventilation and recycle array routines to maximize the life of the fans and the array. The system comprises a primary embodiment making use of smart fans in the array, each smart fan including a fan and appropriate control electronics capable of processing commands received from a smart fan array controller. Fan control signals are multiplexed over a local operating network power line using carrier communication protocols, command messages and data values, all to accomplish a goal of the system to maximize fan life. In an alternate embodiment, fan and array control electronics are integrated onto the fan array controller itself and power is provided to conventional fans using a conventional wiring harness.
摘要翻译：用于智能管理风扇阵列的系统和方法。该系统使用平均故障间隔时间，风扇使用率和其他数据进行增加通风，减去通风和循环阵列程序，以最大限度地延长风扇和阵列的使用寿命。该系统包括使用阵列中的智能风扇的主要实施例，每个智能风扇包括风扇和能够处理从智能风扇阵列控制器接收的命令的适当的控制电子装置。风扇控制信号通过使用载波通信协议，命令消息和数据值的本地操作网络电力线进行复用，以实现系统的目标，以最大限度地提高风扇寿命。在替代实施例中，风扇和阵列控制电子器件集成到风扇阵列控制器本身上，并且使用传统的线束将功率提供给常规风扇。

6. 发明授权

US09157239B2 Roof ridge ventilation system 有权
标题翻译：屋脊通风系统
公开(公告)号：US09157239B2
公开(公告)日：2015-10-13
申请号：US13241195
申请日：2011-09-22
申请人： Don Allen , Jay Kamani , Phuong Le
发明人： Don Allen , Jay Kamani , Phuong Le
IPC分类号： B61D17/14 , E04B7/00 , E04D13/17 , F24F7/02
CPC分类号： E04D13/17 , E04D13/174 , F24F7/025 , Y02B10/20 , Y10T29/49826
摘要： Roof ridge vent system adapted for housing a plurality of fans in a central airflow channel positioned directly over the opening in a ridge portion of a roof for ventilating a plurality of vent chutes or attic space comprising: a hood member engaged with outer edge portions of vent members having air-passageway holes defined therein and inner edge portions preferably being hinged respectively to inner edge portions of base members so as to be adapted for installation on variously-pitched roofs, each base member also having outer edge portions defining a wall adapted for blocking wind from being blown into the vent and for causing airflow over the top of the vent to encourage airflow through the vent system. Vent member sections may be installed end-to-end to define an elongated airflow channel adapted for ventilating with or without assistance from the fans.
摘要翻译：屋顶脊排气系统，其适于容纳多个风扇，所述中央气流通道直接位于屋顶的脊部的开口处，用于通风多个通风槽或阁楼空间，所述空间通道包括：与外部边缘部分接合的罩构件具有限定在其中的通气孔的构件和内边缘部分优选地分别铰接到基部构件的内边缘部分，以便适于安装在各种倾斜的屋顶上，每个基座构件还具有限定适于阻挡的壁的外边缘部分风从吹入通风口并引起气流在通风口的顶部，以鼓励气流通过排气系统。排气构件部分可以端对端地安装以限定适于在有或没有来自风扇的帮助下通风的细长气流通道。

7. 发明申请

US20070057731A1 On-chip harmonic termination for RF power amplifier applications 审中-公开
标题翻译： RF功率放大器应用的片上谐波终端
公开(公告)号：US20070057731A1
公开(公告)日：2007-03-15
申请号：US11229112
申请日：2005-09-15
申请人： Phuong Le
发明人： Phuong Le
IPC分类号： H03F3/191
CPC分类号： H03F3/189 , H01L2223/6644 , H03F1/56
摘要： A radio frequency (“RF”) amplifier as disclosed herein includes an on-chip power transistor formed on a substrate and an on-chip harmonic termination formed on the same substrate. The on-chip harmonic termination is configured to provide a short-circuit termination for even harmonics of the RF output signal and to provide an open-circuit termination for odd harmonics of the RF output signal. The on-chip harmonic termination employs tunable inductance elements and tunable capacitor elements to achieve the desired resonant characteristics. In one example embodiment, the on-chip harmonic termination utilizes conductive wire bonds as the tunable inductance elements, and arrays or banks of on-chip capacitors as the tunable capacitance elements.
摘要翻译：本文公开的射频（“RF”）放大器包括形成在衬底上的片上功率晶体管和形成在同一衬底上的片上谐波终端。片上谐波终端被配置为为RF输出信号的偶次谐波提供短路终端，并为RF输出信号的奇次谐波提供开路端接。片上谐波终端采用可调电感元件和可调谐电容器元件来实现所需的谐振特性。在一个示例实施例中，片上谐波终端利用导线接合作为可调谐电感元件，以及片上电容器的阵列或组作为可调谐电容元件。

8. 发明申请

US20210017786A1 FENCE 有权
公开(公告)号：US20210017786A1
公开(公告)日：2021-01-21
申请号：US16996141
申请日：2020-08-18
申请人： Phuong Le
发明人： Phuong Le
IPC分类号： E04H17/14
摘要： A method for forming a fence includes forming first and second feet each having at least two extensions thereon, wherein at least three extensions are spaced apart and parallel to each other; forming a frame having first, second and third elongated posts, wherein the first elongated post is below the extensions projecting from the first and second feet, wherein the third elongated post is positioned above the first and second posts, and wherein the second support post is positioned between the first and third elongated posts; and forming a wire mesh on the frame and welded to the three elongated posts.

9. 发明申请

US20140035114A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD 有权
标题翻译：半导体封装结构与方法
公开(公告)号：US20140035114A1
公开(公告)日：2014-02-06
申请号：US13745072
申请日：2013-01-18
申请人： Bishnu Prasanna Gogoi , Phuong Le , Alexander J. Elliott
发明人： Bishnu Prasanna Gogoi , Robert Bruce Davies , Phuong Le , Alexander J. Elliott
IPC分类号： H01L25/065
CPC分类号： H01L25/0652 , H01L23/13 , H01L23/142 , H01L23/3121 , H01L23/60 , H01L23/64 , H01L25/072 , H01L2224/48091 , H01L2224/73257 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a semiconductor package structure includes a substrate having a well region extending from a major surface. An interposer structure is attached to the substrate within the well region. The interposer structure has a major surface that is substantially co-planar with the major surface of the substrate. An electrical device is directly attached to the substrate and the interposer structure. The interposer structure can be an active device, such as a gate driver integrated circuit, or passive device structure, such as an impedance matching network.
摘要翻译：在一个实施例中，半导体封装结构包括具有从主表面延伸的阱区的衬底。插入器结构附着在阱区内的衬底上。插入器结构具有与基板的主表面基本共面的主表面。电气设备直接连接到基板和插入器结构。插入器结构可以是有源器件，例如栅极驱动器集成电路或无源器件结构，例如阻抗匹配网络。

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