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    • 1. 发明申请
    • Method of fabricating array substrate
    • 阵列基板的制作方法
    • US20100291741A1
    • 2010-11-18
    • US12591501
    • 2009-11-20
    • Hee-Dong ChoiSang-Gul LeeSeong-Moh SeoJun-Min LeeByung-Chui Ahn
    • Hee-Dong ChoiSang-Gul LeeSeong-Moh SeoJun-Min LeeByung-Chui Ahn
    • H01L21/336
    • H01L27/1274H01L27/1214H01L27/1288H01L29/4908
    • A method of fabricating an array substrate includes sequentially forming a first metal layer, a first inorganic insulating layer and an intrinsic amorphous silicon layer on a substrate, the first metal layer including a first metallic material layer and a second metallic material layer; crystallizing the intrinsic amorphous silicon; forming a gate electrode, a gate line, a gate insulating layer and an active layer; forming an interlayer insulating layer including first and second contact holes respectively exposing both sides of the active layer; forming first and second ohmic contact patterns respectively contacting the both sides of the active layers, a source electrode, a drain electrode, and a data line connecting the source electrode; forming a passivation layer on the source electrode, the drain electrode; and forming a pixel electrode on the passivation layer and contacting the drain electrode.
    • 制造阵列基板的方法包括在基板上依次形成第一金属层,第一无机绝缘层和本征非晶硅层,所述第一金属层包括第一金属材料层和第二金属材料层; 结晶本征非晶硅; 形成栅电极,栅极线,栅绝缘层和有源层; 形成包括分别暴露有源层的两侧的第一和第二接触孔的层间绝缘层; 形成分别接触有源层的两侧的第一和第二欧姆接触图案,源电极,漏电极和连接源电极的数据线; 在源极上形成钝化层,漏电极; 以及在所述钝化层上形成像素电极并与所述漏电极接触。
    • 2. 发明授权
    • Method of fabricating array substrate
    • 阵列基板的制作方法
    • US07910414B2
    • 2011-03-22
    • US12591501
    • 2009-11-20
    • Hee-Dong ChoiSang-Gul LeeSeong-Moh SeoJun-Min LeeByung-Chul Ahn
    • Hee-Dong ChoiSang-Gul LeeSeong-Moh SeoJun-Min LeeByung-Chul Ahn
    • H01L21/00H01L21/84
    • H01L27/1274H01L27/1214H01L27/1288H01L29/4908
    • A method of fabricating an array substrate includes sequentially forming a first metal layer, a first inorganic insulating layer and an intrinsic amorphous silicon layer on a substrate, the first metal layer including a first metallic material layer and a second metallic material layer; crystallizing the intrinsic amorphous silicon; forming a gate electrode, a gate line, a gate insulating layer and an active layer; forming an interlayer insulating layer including first and second contact holes respectively exposing both sides of the active layer; forming first and second ohmic contact patterns respectively contacting the both sides of the active layers, a source electrode, a drain electrode, and a data line connecting the source electrode; forming a passivation layer on the source electrode, the drain electrode; and forming a pixel electrode on the passivation layer and contacting the drain electrode.
    • 制造阵列基板的方法包括在基板上依次形成第一金属层,第一无机绝缘层和本征非晶硅层,所述第一金属层包括第一金属材料层和第二金属材料层; 结晶本征非晶硅; 形成栅电极,栅极线,栅绝缘层和有源层; 形成包括分别暴露有源层的两侧的第一和第二接触孔的层间绝缘层; 形成分别接触有源层的两侧的第一和第二欧姆接触图案,源电极,漏电极和连接源电极的数据线; 在源极上形成钝化层,漏电极; 以及在所述钝化层上形成像素电极并与所述漏电极接触。
    • 6. 发明授权
    • Methods of fabricating thin film transistor and organic light emitting display device using the same
    • 制造薄膜晶体管的方法和使用其的有机发光显示装置
    • US07915102B2
    • 2011-03-29
    • US11473455
    • 2006-06-22
    • Eui-Hoon HwangSang-Gul Lee
    • Eui-Hoon HwangSang-Gul Lee
    • H01L21/84
    • H01L27/1288H01L27/1214H01L27/127
    • Methods of fabricating a TFT and an OLED using the same are provided. The method of fabricating a CMOS TFT includes: preparing a substrate having first and second TFT regions; forming a gate electrode on the substrate; forming a gate insulating layer on the entire surface of the substrate including the gate electrode; forming a semiconductor layer on a predetermined region of the gate insulating layer using a mask; exposing the back of the mask using the gate electrode; injecting n-type impurity ions into the semiconductor layers of the first and second TFT regions using the back-exposed mask and forming a channel region and source and drain regions; ashing both sides of the back-exposed mask; injecting low concentration impurity ions into the semiconductor layers of the first and second TFT regions using the ashed mask and forming an LDD region; and injecting p-type impurity ions into the semiconductor layer of the second TFT region and forming source and drain regions.
    • 提供了使用其制造TFT和OLED的方法。 制造CMOS TFT的方法包括:制备具有第一和第二TFT区域的衬底; 在所述基板上形成栅电极; 在包括所述栅电极的所述基板的整个表面上形成栅极绝缘层; 使用掩模在所述栅极绝缘层的预定区域上形成半导体层; 使用栅极暴露掩模的背面; 使用反向曝光掩模将n型杂质离子注入到第一和第二TFT区域的半导体层中,并形成沟道区域和源极和漏极区域; 灰化背面裸露的两面; 使用所述灰化掩模将低浓度杂质离子注入到所述第一和第二TFT区域的半导体层中,并形成LDD区域; 并将p型杂质离子注入到第二TFT区域的半导体层中并形成源区和漏区。