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1. 发明申请

US20100020497A1 SUBSTRATE STRUCTURE 失效
标题翻译：基板结构
公开(公告)号：US20100020497A1
公开(公告)日：2010-01-28
申请号：US12065177
申请日：2006-02-20
申请人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
发明人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/0218 , H05K1/0274 , H05K7/20463 , H05K9/0047 , H05K9/0086 , H05K2201/0209 , H05K2201/0215 , H05K2201/10128 , H05K2201/10515 , H05K2201/2054 , H05K2203/1316 , H05K2203/1322 , H01L2224/0401
摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
摘要翻译：旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

2. 发明授权

US07969741B2 Substrate structure 失效
标题翻译：基材结构
公开(公告)号：US07969741B2
公开(公告)日：2011-06-28
申请号：US12065177
申请日：2006-02-20
申请人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
发明人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
IPC分类号： H05K7/20
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/0218 , H05K1/0274 , H05K7/20463 , H05K9/0047 , H05K9/0086 , H05K2201/0209 , H05K2201/0215 , H05K2201/10128 , H05K2201/10515 , H05K2201/2054 , H05K2203/1316 , H05K2203/1322 , H01L2224/0401
摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
摘要翻译：旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

3. 发明申请

US20100044100A1 BOARD STRUCTURE AND ELECTRONIC DEVICE 审中-公开
标题翻译：板结构和电子设备
公开(公告)号：US20100044100A1
公开(公告)日：2010-02-25
申请号：US12065042
申请日：2006-08-03
申请人： Masahiro Ono , Yosihiro Uda , Seiji Yamaguchi , Kazuhiro Shinchi , Satoru Tomekawa
发明人： Masahiro Ono , Yosihiro Uda , Seiji Yamaguchi , Kazuhiro Shinchi , Satoru Tomekawa
IPC分类号： H01L23/28
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/0218 , H05K7/20463 , H05K9/0083 , H05K2201/09972 , H05K2201/10371 , H05K2201/2018 , H01L2224/0401
摘要： A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.
摘要翻译：具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。

4. 发明授权

US08826713B2 Method and apparatus for manufacturing stator coil for electric rotating machine 有权
标题翻译：旋转电机定子线圈的制造方法和装置
公开(公告)号：US08826713B2
公开(公告)日：2014-09-09
申请号：US13006678
申请日：2011-01-14
申请人： Akito Akimoto , Takuji Harada , Seiji Yamaguchi , Atsuo Ishizuka
发明人： Akito Akimoto , Takuji Harada , Seiji Yamaguchi , Atsuo Ishizuka
IPC分类号： B21B3/00 , B21F3/04 , H02K15/04 , H02K3/28
CPC分类号： H02K3/28 , H02K15/0478 , Y10T29/49009
摘要： A method of manufacturing a stator coil for an electric rotating machine includes the steps of: (1) forming substantially planar electric wires each of which includes in-slot portions to be received in slots of a stator core and turn portions to be located outside the slots to connect adjacent pairs of the in-slot portions; (2) rolling each of the planar electric wires through plastic deformation into a spiral or circular-arc shape; and (3) assembling the rolled electric wires together to form the stator coil. Further, in the rolling step, each of the planar electric wires is rolled by deforming each of the turn portions of the electric wire while restricting movement of at least one of the in-slot portions of the electric wire which is located closer to a rolling start end of the electric wire than the turn portion is.
摘要翻译：一种制造用于旋转电机的定子线圈的方法包括以下步骤：（1）形成基本上平面的电线，每个电线包括插槽部分以被接收在定子芯的槽中并且转动部分位于槽以连接相邻的槽内部分; （2）通过塑性变形将每根平面电线卷成螺旋或圆弧形; 和（3）将轧制的电线组装在一起以形成定子线圈。此外，在轧制步骤中，通过使电线的每个转弯部分变形，同时限制位于更接近轧制的电线的槽内部分的至少一个的运动，使每个平面电线卷绕电线的开始端比转弯部分为止。

5. 发明授权

US08465417B2 Endoscope system 有权
标题翻译：内窥镜系统
公开(公告)号：US08465417B2
公开(公告)日：2013-06-18
申请号：US12273071
申请日：2008-11-18
申请人： Seiji Yamaguchi
发明人： Seiji Yamaguchi
IPC分类号： A61B1/018 , A61B1/0638 , A61B1/07 , A61B1/05 , H04N5/33
CPC分类号： A61B1/3132 , A61B1/0005 , A61B1/042 , A61B1/045
摘要： An endoscope system of the invention includes: a first endoscope capable of picking up an image of a subject; a first illuminating section capable of emitting first illuminating light; a second endoscope capable of picking up an image of the subject illuminated by the first light from a direction different from the first endoscope; a second illuminating section capable of emitting second illuminating light; a video signal processing section for generating a video signal based on a signal picked-up by the second endoscope; a display section for displaying an image of the subject obtained by the video signal processing section; an emphasis instructing section for instructing an emphasis on an image obtained based on the first light; and an emphasis control section for controlling to emphasize the subject image obtained based on the first light according to an operation of the emphasis instructing section.
摘要翻译：本发明的内窥镜系统包括：能够拾取被检体的图像的第一内窥镜; 能够发射第一照明光的第一照明部; 第二内窥镜，其能够从不同于所述第一内窥镜的方向拾取由所述第一光照射的被检体的图像; 能够发射第二照明光的第二照明部; 视频信号处理部分，用于基于由第二内窥镜拾取的信号产生视频信号; 用于显示由视频信号处理部分获得的被摄体的图像的显示部分; 强调指示部，用于指示强调基于第一光获得的图像; 以及强调控制部分，用于根据强调指示部分的操作来控制强调基于第一光获得的被摄体图像。

6. 发明授权

US08178066B2 Method for stabilizing calcium phosphates fine particles, method for manufacturing calcium phosphates fine particles by using the method, and use thereof 有权
标题翻译：磷酸钙微粒的稳定化方法，使用该方法制造磷酸钙钙微粒的方法及其应用
公开(公告)号：US08178066B2
公开(公告)日：2012-05-15
申请号：US11990432
申请日：2006-08-15
申请人： Takeshi Yao , Mitsuhiro Hibino , Seiji Yamaguchi , Hidetaka Okada
发明人： Takeshi Yao , Mitsuhiro Hibino , Seiji Yamaguchi , Hidetaka Okada
IPC分类号： C01B25/32 , C30B17/00 , C30B29/14
CPC分类号： C01B25/327 , A61L27/12
摘要： The present invention provides a method for stabilizing fine particles of calcium phosphates without lowering their solid phase forming activity.It is possible to stabilize the fine particles of calcium phosphates by stopping the growth of the fine particles formed in an aqueous solution supersaturated with respect to calcium phosphates. More specifically, the fine particles of calcium phosphates were stabilized by lowering the inorganic ion concentration of a fine-particle-forming solution containing fine particles of calcium phosphates by dialysis, ion exchange, dilution, or the like, or by separating the fine particles of calcium phosphates from the fine-particle-forming solution by filtration, centrifuging, or the like.
摘要翻译：本发明提供一种稳定磷酸钙细粒而不降低其固相形成活性的方法。通过停止相对于磷酸钙过饱和的水溶液中形成的微粒的生长，可以稳定磷酸钙的微粒。更具体地，通过透析，离子交换，稀释等降低含有磷酸钙微粒的微粒形成溶液的无机离子浓度，或者通过将通过过滤，离心等形成细颗粒的溶液中的磷酸钙。

7. 发明授权

US08101441B2 Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US08101441B2
公开(公告)日：2012-01-24
申请号：US12656670
申请日：2010-02-12
申请人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
发明人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L33/56 , H01L2224/05001 , H01L2224/05023 , H01L2224/05144 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/16225 , H01L2924/00014
摘要： A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.
摘要翻译：制造发光器件的方法包括：当通过加热软化的玻璃材料或在密封后加工玻璃材料将安装部分上的发光元件密封时，通过部分地在玻璃材料上部分地形成凹部将模具接触并压靠玻璃材料的上表面，使得与模具不接触的上表面的一部分变形并形成弯曲表面。

8. 发明授权

US07999398B2 Solid state device 有权
标题翻译：固态设备
公开(公告)号：US07999398B2
公开(公告)日：2011-08-16
申请号：US11882601
申请日：2007-08-02
申请人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
发明人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L23/28
CPC分类号： H01L33/56 , C03C3/066 , H01L24/17 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/00014 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.
摘要翻译：固体装置具有固态成分，将固态成分安装在其上用于从固态成分接收/供给电力的电力接收供给部和密封固体成分的玻璃密封部。玻璃密封部由B 2 O 3 -SiO 2 -Li 2 O-Na 2 O-ZnO-Nb 2 O 5基玻璃形成，该玻璃由21重量％〜23重量％的B 2 O 3，11重量％〜13重量％的SiO 2，1重量％〜 1.5重量％的Li 2 O和2重量％至2.5重量％的Na 2 O.

9. 发明授权

US07989236B2 Method of making phosphor containing glass plate, method of making light emitting device 有权
标题翻译：制造含有玻璃板的荧光体的方法，制造发光器件的方法
公开(公告)号：US07989236B2
公开(公告)日：2011-08-02
申请号：US12318150
申请日：2008-12-22
申请人： Seiji Yamaguchi , Takashi Nonogawa , Yoshinobu Suehiro , Hiroki Watanabe , Kazuya Aida
发明人： Seiji Yamaguchi , Takashi Nonogawa , Yoshinobu Suehiro , Hiroki Watanabe , Kazuya Aida
IPC分类号： H01L21/00
CPC分类号： C03B19/063 , C03C8/24 , C03C14/004 , C03C14/006 , C03C27/00 , C09K11/7734 , C09K11/7741 , H01L24/97 , H01L33/501 , H01L2224/05023 , H01L2224/0508 , H01L2224/05124 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0041 , Y02P40/57 , H01L2924/00 , H01L2924/00014
摘要： A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.
摘要翻译：制造发光器件的方法包括：将玻璃粉末与包含硫化物荧光体，铝酸盐荧光体和硅酸盐荧光体中的至少一种的荧光体粉末混合，制成荧光体粉末分散在玻璃粉末中的混合粉末，加热和软化混合粉末以提供一体化材料，随后固化一体化材料以提供荧光体分散玻璃，并将磷光体分散玻璃熔融粘合到通过热压安装有发光元件的安装部分并且将发光元件与分散有荧光体的玻璃同时密封在安装部上。

10. 发明申请

US20100203658A1 Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20100203658A1
公开(公告)日：2010-08-12
申请号：US12656670
申请日：2010-02-12
申请人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
发明人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L33/56 , H01L2224/05001 , H01L2224/05023 , H01L2224/05144 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/16225 , H01L2924/00014
摘要： A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.
摘要翻译：制造发光器件的方法包括：当通过加热软化的玻璃材料或在密封后加工玻璃材料将安装部分上的发光元件密封时，通过部分地在玻璃材料上部分地形成凹部将模具接触并压靠玻璃材料的上表面，使得与模具不接触的上表面的一部分变形并形成弯曲表面。

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