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1. 发明授权

US08105878B2 Manufacturing method of a semiconductor device having a package dicing 有权
标题翻译：具有封装切割的半导体器件的制造方法
公开(公告)号：US08105878B2
公开(公告)日：2012-01-31
申请号：US11833606
申请日：2007-08-03
申请人： Haruhiko Harada , Takao Matsuura
发明人： Haruhiko Harada , Takao Matsuura
IPC分类号： H01L25/50 , H01L21/56 , H01L21/58 , H01L33/48
CPC分类号： H01L21/78 , H01L21/561 , H01L21/565 , H01L21/67115 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2221/68327 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/85 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00012 , H01L2924/00
摘要： A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adhesive force becomes zero, the CSP can be picked up by the inverting collet without peeling it off from the thermosetting tape. Thus, peel-off charging does not occur and therefore it is not necessary to perform a destaticizing process. As a result, it is possible to improve the production efficiency in assembling the semiconductor device (CSP).
摘要翻译：采用热固性胶带作为切割胶带，并且在包装切割之后，热固性胶带被加热，然后由反转夹头拾取所需的分开的CSP。由于将热固性胶带加热到预定温度以使其粘合力变为零，所以CSP可以由反转夹头拾取，而不会从热固性胶带剥离。因此，不会发生剥离充电，因此不需要进行去静电处理。结果，可以提高组装半导体器件（CSP）的生产效率。

2. 发明申请

US20080076210A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20080076210A1
公开(公告)日：2008-03-27
申请号：US11833606
申请日：2007-08-03
申请人： Haruhiko Harada , Takao Matsuura
发明人： Haruhiko Harada , Takao Matsuura
IPC分类号： H01L21/56 , H01L21/30
CPC分类号： H01L21/78 , H01L21/561 , H01L21/565 , H01L21/67115 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2221/68327 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/85 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00012 , H01L2924/00
摘要： A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adhesive force becomes zero, the CSP can be picked up by the inverting collet without peeling it off from the thermosetting tape. Thus, peel-off charging does not occur and therefore it is not necessary to perform a destaticizing process. As a result, it is possible to improve the production efficiency in assembling the semiconductor device (CSP).
摘要翻译：采用热固性胶带作为切割胶带，并且在包装切割之后，热固性胶带被加热，然后由反转夹头拾取所需的分开的CSP。由于将热固性胶带加热到预定温度以使其粘合力变为零，所以CSP可以由反转夹头拾取，而不会从热固性胶带剥离。因此，不会发生剥离充电，因此不需要进行去静电处理。结果，可以提高组装半导体器件（CSP）的生产效率。

3. 发明授权

US06399423B2 Semiconductor device an a method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06399423B2
公开(公告)日：2002-06-04
申请号：US09733929
申请日：2000-12-12
申请人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
发明人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
IPC分类号： H01L2144
CPC分类号： H01L23/3107 , H01L21/4835 , H01L21/4842 , H01L21/565 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.
摘要翻译：半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

4. 发明授权

US06723583B2 Method of manufacturing a semiconductor device using a mold 有权
标题翻译：使用模具制造半导体器件的方法
公开(公告)号：US06723583B2
公开(公告)日：2004-04-20
申请号：US10453606
申请日：2003-06-04
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

5. 发明授权

US06667193B2 Semiconductor device and a method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06667193B2
公开(公告)日：2003-12-23
申请号：US10108439
申请日：2002-03-29
申请人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
发明人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
IPC分类号： H01L2144
CPC分类号： H01L23/3107 , H01L21/4835 , H01L21/4842 , H01L21/565 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a. In the manufacture method, the sealing body 3 is polished, after resin-molded, at its back face 3a with a brush to form the two widthwise edge portions, as exposed from the back face 3a of the sealing body 3, of the lead la into rounded faces, and the mounted face 1d of the lead la including the rounded faces is protruded at its central portion from the back face 3a of the sealing body 3 thereby to improve the connection reliability at the packaging time.
摘要翻译：为了提高封装半导体器件时的连接可靠性，并且在半导体器件制造方法中使得方法管理变得容易。半导体器件包括：用于支撑半导体芯片2的桶1e; 通过用树脂密封半导体芯片2形成的密封体3; 多个由铜合金制成的引线1a，暴露于密封体3的背面3a，并且在暴露的安装面1d上具有焊接层8; 以及用于连接半导体芯片2的焊盘2a和相应引线1a的导线4。在制造方法中，密封体3在树脂模制后用刷子在其背面3a处被抛光，以形成从密封体3的背面3a露出的两个横向边缘部分的引线1a 并且包括圆形面的引线1a的安装面1d在其中心部分处从密封体3的背面3a突出，从而提高包装时的连接可靠性。

6. 发明申请

US20110291692A1 METHOD AND APPARATUS FOR INSPECTING SEMICONDUCTOR USING ABSORBED CURRENT IMAGE 审中-公开
标题翻译：使用吸收电流图像检测半导体的方法和装置
公开(公告)号：US20110291692A1
公开(公告)日：2011-12-01
申请号：US13147759
申请日：2010-01-20
申请人： Tohru Ando , Masaaki Komori , Takao Matsuura
发明人： Tohru Ando , Masaaki Komori , Takao Matsuura
IPC分类号： G01R31/26
CPC分类号： H01J37/244 , G01R31/307 , H01J37/20 , H01J2237/24592 , H01J2237/2817 , H01L22/14 , H01L2924/0002 , H01L2924/00
摘要： Provided is an apparatus for automatically detecting a failure position on a specified wiring line. The apparatus and a method for automatically detecting the failure position even on a long wiring line by applying a probe and an electron beam onto a sample and using an image of the current absorbed by the sample are provided. The apparatus obtains an absorbed current image, while laterally moving at right angle with the probe applied onto the sample, and based on the obtained absorbed current image, correction is performed by means of both an image shift and a stage. Countermeasures are taken, using a stage not having a sample rotating stage, against factors including a hardware factor of not moving at a correct angle, such as backlash, the wiring line is accurately and continuously displayed even when the apparatus moves to the ends of the long wiring line, and the failure position is detected, while the apparatus automatically reciprocates several times between the both ends of the wiring line.
摘要翻译：提供一种用于自动检测指定布线上的故障位置的装置。提供了通过将探针和电子束施加到样品上并使用由样品吸收的电流的图像来自动检测在长布线上的故障位置的装置和方法。该装置获得吸收的当前图像，同时与施加到样本上的探针成直角地横向移动，并且基于所获得的吸收的当前图像，通过图像偏移和阶段两者进行校正。使用不具有样品旋转台的阶段，针对包括不以正确角度移动的硬件因素（例如齿隙）的因素进行对策，即使当装置移动到并且检测到故障位置，同时设备在布线两端之间自动往复运动数次。

7. 发明授权

US07015069B2 Method of manufacturing a semiconductor device and a semiconductor device 有权
公开(公告)号：US07015069B2
公开(公告)日：2006-03-21
申请号：US11047660
申请日：2005-02-02
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L21/44
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

8. 发明申请

US20050127535A1 Method of manufacturing a semiconductor device and a semiconductor device 有权
标题翻译：制造半导体器件和半导体器件的方法
公开(公告)号：US20050127535A1
公开(公告)日：2005-06-16
申请号：US11047660
申请日：2005-02-02
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： B29C45/14 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/498 , H01L23/28
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

9. 发明授权

US06897097B2 Semiconductor device and a method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06897097B2
公开(公告)日：2005-05-24
申请号：US10669564
申请日：2003-09-25
申请人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
发明人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
IPC分类号： H01L23/12 , H01L21/301 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/50 , H01I21/44 , H01L21/50 , H01I21/48
CPC分类号： H01L23/3107 , H01L21/4835 , H01L21/4842 , H01L21/565 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.
摘要翻译：半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

10. 发明授权

US06872597B2 Method of manufacturing a semiconductor device and a semiconductor device 有权
公开(公告)号：US06872597B2
公开(公告)日：2005-03-29
申请号：US10784276
申请日：2004-02-24
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： B29C45/14 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/498 , H01L21/44
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

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