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    • 2. 发明授权
    • Heat sink module and an arrangment of heat sink modules
    • 散热模块和散热模块的布置
    • US06708757B2
    • 2004-03-23
    • US10220172
    • 2002-08-28
    • Rainer HebelHartmut Michel
    • Rainer HebelHartmut Michel
    • F28F700
    • H01G2/08H01G11/78Y02E60/13
    • A plate-like heat sink module with polygonal ground plan or shape has an upper side for securing a heat generating component and an underside comprises cooling ribs. The outside edges of the module have surface structure complementary with one another and with whose assistance a plurality of the identical heat sink modules can be joined in one plane, whereby the surface structures are fashioned so that a heat sink module can be joined to another heat sink module in only one orientation to form an arrangement of the heat sink modules. As a result of the arrangement of heat sink modules, a heat sink for the interconnection of a plurality of capacitors to form a capacitor bank can be produced in an especially flexible way.
    • 具有多边形平面或形状的板状散热器模块具有用于固定发热部件的上侧,并且下侧包括冷却肋。 模块的外边缘具有彼此互补的表面结构,并且通过它们的辅助,多个相同的散热器模块可以在一个平面中接合,由此表面结构被制成使得散热模块可以被连接到另一个热 吸收器模块仅在一个方向上形成散热器模块的布置。 作为散热器模块的布置的结果,可以以特别灵活的方式制造用于互连多个电容器以形成电容器组的散热器。
    • 4. 发明授权
    • Darlington transistor circuit
    • 达林顿晶体管电路
    • US4539492A
    • 1985-09-03
    • US464503
    • 1983-01-27
    • Hartmut MichelLothar GademannErich Jesse
    • Hartmut MichelLothar GademannErich Jesse
    • H03K17/04H03K17/0412H03K17/14H03K17/60H03K17/615H03K3/26H03K3/313
    • H03K17/615H03K17/04126
    • A three-stage Darlington transistor circuit having a power transistor (T.sub.3), a driver transistor (T.sub.2) and an initial transistor (T.sub.1) is provided. The collectors of these three transistors are connected with one another, while the emitter of the driver transistor (T.sub.2) is connected to the base of the power transistor (T.sub.3), and the emitter of the initial transistor (T.sub.1) is connected to the base of the driver transistor (T.sub.2). Connected to the base of the driver transistor (T.sub.2) is a series circuit comprising a first resistor (R.sub.1), which is connected directly to this base, and a Zener diode (ZD), the anode of the Zener diode being connected with the resistor (R.sub.1); and a second resistor (R.sub.2); the second resistor (R.sub.2) is connected in parallel to the emitter-base path of the driver transistor (T.sub.2). Upon the attainment of a predetermined voltage at the cathode of the Zener diode (ZD), the driver transistor (T.sub.2) and the power transistor (T.sub.3) are switched ON. The temperature dependency of this switch-on voltage can be adjusted by varying the resistance ratio of these two resistors (R.sub.1, R.sub.2).
    • PCT No.PCT / DE82 / 00045 Sec。 371日期1983年1月27日 102(e)日期1983年1月27日PCT提交1982年3月5日PCT公布。 出版物WO82 / 04509 日期为1982年12月23日。提供具有功率晶体管(T3),驱动晶体管(T2)和初始晶体管(T1)的三阶段达林顿晶体管电路。 这三个晶体管的集电极彼此连接,而驱动晶体管(T2)的发射极连接到功率晶体管(T3)的基极,并且初始晶体管(T1)的发射极连接到基极 的驱动晶体管(T2)。 连接到驱动晶体管(T2)的基极的是串联电路,其包括直接连接到该基极的第一电阻器(R1)和齐纳二极管(ZD),齐纳二极管的阳极与电阻器 (R1); 和第二电阻器(R2); 第二电阻器(R2)并联连接到驱动晶体管(T2)的发射极 - 基极路径。 当在齐纳二极管(ZD)的阴极达到预定电压时,驱动晶体管(T2)和功率晶体管(T3)导通。 可以通过改变这两个电阻(R1,R2)的电阻比来调节该接通电压的温度依赖性。