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    • 1. 发明授权
    • Nonvolatile memory structure for programmable logic devices
    • 用于可编程逻辑器件的非易失性存储器结构
    • US5978272A
    • 1999-11-02
    • US871589
    • 1997-06-06
    • Hao FangSameer HaddadNader Radjy
    • Hao FangSameer HaddadNader Radjy
    • G11C16/04H01L29/423H01L29/788G11C11/34
    • G11C16/0416H01L29/42324H01L29/7886G11C2216/10
    • A nonvolatile memory structure is disclosed. The nonvolatile memory structure includes a substrate, a heavily doped drain junction disposed in the substrate, and a lightly doped source junction disposed in the substrate. The source junction is diffused more deeply than the drain junction. The nonvolatile memory structure also includes a gate structure. The gate structure has a floating gate capacitively coupled to the substrate and a control gate capacitively coupled to the floating gate. The heavily doped drain junction has a central portion proximate to the gate structure. The lightly doped source junction also has a central portion proximate to the gate structure. At least the central portion of the lightly doped source junction is more lightly doped than the central portion of the heavily doped drain junction.
    • 公开了非易失性存储器结构。 非易失性存储器结构包括衬底,设置在衬底中的重掺杂漏极结,以及设置在衬底中的轻掺杂源极结。 源极结比漏极结扩散更深。 非易失性存储器结构还包括栅极结构。 栅极结构具有电容耦合到衬底的浮动栅极和与浮动栅极电容耦合的控制栅极。 重掺杂漏极结具有靠近栅极结构的中心部分。 轻掺杂源极结还具有靠近栅极结构的中心部分。 至少轻掺杂源结的中心部分比重掺杂漏极结的中心部分更轻掺杂。
    • 3. 发明申请
    • Method and System for Providing Contact to a First Polysilicon Layer in a Flash Memory Device
    • 用于在闪存器件中提供与第一多晶硅层的接触的方法和系统
    • US20120302017A1
    • 2012-11-29
    • US13566741
    • 2012-08-03
    • Mark S. CHANGHao FangKing Wai Kelwin Ko
    • Mark S. CHANGHao FangKing Wai Kelwin Ko
    • H01L21/336
    • H01L27/11521H01L21/76816H01L27/115
    • A method and system for providing at least one contact in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and at lease one component including a polysilicon layer as a top surface. The method and system further include forming a silicide on the top surface of the polysilicon layer and providing an insulating layer covering the plurality of gate stacks, the at least one component and the silicide. The method and system also include etching the insulating layer to provide at least one contact hole. The insulating layer etching step uses the silicide as an etch stop layer to ensure that the insulating etching step does not etch through the polysilicon layer. The method and system also include filling the at least one contact hole with a conductor.
    • 公开了一种用于在闪速存储器件中提供至少一个触点的方法和系统。 闪速存储器件包括多个栅极堆叠,并且至少包括一个包括多晶硅层作为顶表面的部件。 该方法和系统还包括在多晶硅层的顶表面上形成硅化物,并提供覆盖多个栅叠层,至少一个元件和硅化物的绝缘层。 该方法和系统还包括蚀刻绝缘层以提供至少一个接触孔。 绝缘层蚀刻步骤使用硅化物作为蚀刻停止层,以确保绝缘蚀刻步骤​​不会蚀刻穿过多晶硅层。 该方法和系统还包括用导体填充至少一个接触孔。
    • 7. 发明授权
    • Method of forming poly insulator poly capacitors by using a self-aligned salicide process
    • 通过使用自对准自对准硅化物工艺形成多晶硅绝缘体聚电容器的方法
    • US07141469B2
    • 2006-11-28
    • US10967198
    • 2004-10-19
    • Jung-Cheng KaoHao Fang
    • Jung-Cheng KaoHao Fang
    • H01L21/8238
    • H01L28/60H01L27/0629
    • A method of forming poly insulator poly capacitors by using self-aligned salicide process for mixed mode analog devices. These capacitors are formed in the self-aligned salicide process as stacked poly insulator poly (PIP) capacitors. In the self-aligned salicide process, a self-aligned salicide block process is needed to protect the the salicide formation process from electrostatic discharge (ESD) devices such as resistors or capacitors. The oxide layer of the self-aligned salicide block is used as the dielectric layer of the capacitors to form the PIP capacitor. Therefore, some process steps are omitted due to the formation of the PIP capacitors.
    • 通过对混合模式模拟装置使用自对准自对准硅化物工艺形成多晶硅绝缘体多晶硅电容器的方法。 这些电容器在自对准的自对准硅化物工艺中形成为堆叠的多晶硅绝缘体聚(PIP)电容器。 在自对准的自对准硅化物工艺中,需要自对准的自对准硅化物阻挡工艺来保护自对准硅化物形成工艺免受例如电阻器或电容器的静电放电(ESD)器件的影响。 自对准硅化物块的氧化物层用作电容器的电介质层以形成PIP电容器。 因此,由于形成PIP电容器,省略了一些处理步骤。
    • 8. 发明申请
    • Impedance-matched write circuit with shunted matching resistor
    • 具有分流匹配电阻的阻抗匹配写电路
    • US20050174668A1
    • 2005-08-11
    • US10776701
    • 2004-02-11
    • Hao FangCameron Rabe
    • Hao FangCameron Rabe
    • G11B5/00G11B5/012G11B5/09
    • G11B5/012G11B2005/0013
    • An impedance matched write circuit is provided that shunts one or more matching resistors. The impedance matched write circuit includes an interconnect for connecting to a write head and at least one resistor between a control voltage and the interconnect for impedance matching to the interconnect. A transistor can be connected across the resistor to shunt current that would otherwise pass through the resistor during an overshoot mode. The transistor may be a PMOS transistor or a combination of PMOS and NMOS transistors. A gate voltage of the transistor is controlled by a source such that the transistor is turned on in an overshoot mode and turned off during a steady state mode.
    • 提供阻抗匹配写电路,其分流一个或多个匹配电阻器。 阻抗匹配写入电路包括用于连接到写入头的互连和用于与互连的阻抗匹配的控制电压和互连之间的至少一个电阻器。 晶体管可以跨过电阻连接,以分流电流,否则在过冲模式下电流将通过电阻。 晶体管可以是PMOS晶体管或PMOS和NMOS晶体管的组合。 晶体管的栅极电压由源极控制,使得晶体管以过冲模式导通,并在稳态模式期间截止。