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1. 发明申请

US20070242389A1 Method for manufacturing a magnetic write head using a protective layer to prevent write pole consumption 有权
标题翻译：使用保护层制造磁写头以防止写入极消耗的方法
公开(公告)号：US20070242389A1
公开(公告)日：2007-10-18
申请号：US11407320
申请日：2006-04-18
申请人： Hamid Balamane , Yvette Winton , Yi Zheng
发明人： Hamid Balamane , Yvette Winton , Yi Zheng
IPC分类号： G11B5/147
CPC分类号： G11B5/3163 , Y10T29/49043 , Y10T29/49044 , Y10T29/4906
摘要： A method of manufacturing a write pole that prevents P2 pedestal consumption during ion milling removal of coil and pole seed layers. The write head can be constructed by forming a first pole and then forming a magnetic pedestal (P2) over the first pole. A protective layer of, for example, alumina is deposited over a portion of the pedestal in the pole tip region, leaving a portion of the pedestal uncovered in the flare region. A coil seed layer can then be deposited and a coil formed. When the coil seed layer is removed, such as by ion milling, the pole tip region of the pedestal is protected from the ion milling by the protective layer. Similarly, a top pole can be deposited by first depositing an electrically conductive, magnetic seed layer and then plating the top pole. When the top pole seed layer is removed by ion milling, the pole tip region of the pedestal is protected from removal by the protective layer.
摘要翻译：一种制造写入极的方法，该写入极在离子铣除去线圈和极种子层期间防止P2基座消耗。写头可以通过形成第一极，然后在第一极上形成磁性基座（P2）来构造。例如氧化铝的保护层沉积在极尖区域中的基座的一部分上，使基座的一部分露出在扩口区域中。然后可以沉积线圈种子层并形成线圈。当线圈种子层被去除时，例如通过离子铣削，底座的极尖区域被保护层防止离子铣削。类似地，可以通过首先沉积导电的磁性种子层然后电镀顶极来沉积顶极。当通过离子研磨去除顶极种子层时，保护基座的极尖区域被保护层除去。

2. 发明授权

US07363698B2 Process for creating a write head by forming a bump after the top pole is formed 失效
标题翻译：用于通过在形成顶极之后形成凸起来产生写入头的过程
公开(公告)号：US07363698B2
公开(公告)日：2008-04-29
申请号：US10956221
申请日：2004-09-30
申请人： Amanda Baer , Hamid Balamane , Daniel Wayne Bedell , Jyh-Shuey Jerry Lo , Vladimir Nikitin , Aron Pentek , Yvette Winton
发明人： Amanda Baer , Hamid Balamane , Daniel Wayne Bedell , Jyh-Shuey Jerry Lo , Vladimir Nikitin , Aron Pentek , Yvette Winton
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/1871 , G11B5/3163 , Y10T29/49021 , Y10T29/49032 , Y10T29/49034 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods for creating a write head by forming a bump after the top pole is formed are provided. In one embodiment, a bottom pole is created out of a first layer. A non-magnetic gap material is applied to the surface of the wafer. A top pole is created out of a second layer. After creating the top pole, a bump is created. The bump is used to protect at least a portion of the first layer while etching to create a stray flux absorber.
摘要翻译：提供了通过在形成顶极之后形成凸块来创建写入头的方法。在一个实施例中，从第一层产生底极。将非磁隙材料施加到晶片的表面。第二层创建顶杆。创建顶极后，会创建一个凸起。凸块用于在蚀刻时保护第一层的至少一部分以产生杂散通量吸收体。

3. 发明申请

US20060070231A1 Process for creating a write head by forming a bump after the top pole is formed 失效
标题翻译：用于通过在形成顶极之后形成凸起来产生写入头的过程
公开(公告)号：US20060070231A1
公开(公告)日：2006-04-06
申请号：US10956221
申请日：2004-09-30
申请人： Amanda Baer , Hamid Balamane , Daniel Bedell , Jyh-Shuey Lo , Vladimir Nikitin , Aron Pentek , Yvette Winton
发明人： Amanda Baer , Hamid Balamane , Daniel Bedell , Jyh-Shuey Lo , Vladimir Nikitin , Aron Pentek , Yvette Winton
IPC分类号： G11B5/187
CPC分类号： G11B5/1871 , G11B5/3163 , Y10T29/49021 , Y10T29/49032 , Y10T29/49034 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods for creating a write head by forming a bump after the top pole is formed are provided. In one embodiment, a bottom pole is created out of a first layer. A non-magnetic gap material is applied to the surface of the wafer. A top pole is created out of a second layer. After creating the top pole, a bump is created. The bump is used to protect at least a portion of the first layer while etching to create a stray flux absorber.
摘要翻译：提供了通过在形成顶极之后形成凸块来创建写入头的方法。在一个实施例中，从第一层产生底极。将非磁隙材料施加到晶片的表面。第二层创建顶杆。创建顶极后，会创建一个凸起。凸块用于在蚀刻时保护第一层的至少一部分以产生杂散通量吸收体。

4. 发明申请

US20060091103A1 Write head fabrication by inverting order of process steps 失效
标题翻译：通过反转处理步骤的顺序来编写头部制造
公开(公告)号：US20060091103A1
公开(公告)日：2006-05-04
申请号：US10976588
申请日：2004-10-29
申请人： Douglas Tsang , Jorge Colonia , Yvette Winton , Michael Yang
发明人： Douglas Tsang , Jorge Colonia , Yvette Winton , Michael Yang
IPC分类号： B44C1/22 , G11B5/127
CPC分类号： G11B5/313 , G11B5/3163 , Y10T29/49037 , Y10T29/49046 , Y10T29/49048
摘要： During fabrication of a write head via holes are first opened in a gap layer, followed by formation of seed layers instead of the other way around. Moreover a first seed layer is formed, and without the first seed layer being used a second seed layer is formed. The second seed layer (which is the topmost layer) is used in plating to form coils (e.g. of copper) for the write head. After coil formation, the first seed layer is used for plating to form vias (e.g. of NiFe). The two seed layers may be formed in a single operation by using two different targets in a vacuum deposition chamber. Moreover, a single insulation layer is sufficient to insulate and protect all plated elements, regardless of whether they are formed by use of the first seed layer or the second seed layer.
摘要翻译：在写头的制造期间，首先在间隙层中打开通孔，然后形成种子层，而不是围绕其形成。此外，形成第一种子层，并且在不使用第一种子层的情况下形成第二种子层。第二种子层（其是最上层）用于电镀以形成用于写入头的线圈（例如铜）。在线圈形成之后，第一种子层用于电镀以形成通孔（例如NiFe）。两个种子层可以通过在真空沉积室中使用两个不同的靶而在一个操作中形成。此外，单个绝缘层足以绝缘和保护所有电镀元件，而不管它们是通过使用第一种子层或第二种子层形成的。

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