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    • 1. 发明授权
    • Method for manufacturing electronic components
    • 电子元件制造方法
    • US07905012B2
    • 2011-03-15
    • US12029832
    • 2008-02-12
    • Hajime KuwajimaHitoshi OhkuboManabu Ohta
    • Hajime KuwajimaHitoshi OhkuboManabu Ohta
    • H05K3/02
    • H01G4/248H01C1/148H01C17/281H01G4/232Y10T29/49128Y10T29/49156Y10T29/49163Y10T29/4979Y10T156/1052
    • A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.
    • 一种电子部件的制造方法,其特征在于,包括:利用粘合片将基板临时粘结在支撑板上的工序; 通过在基板上设置从第一表面侧相对的第二表面侧在厚度方向上延伸的切口,形成用于将基板分割为各个芯片的切割槽的步骤; 例如通过溅射在每个芯片的位于切割槽内的第二表面和外周表面上形成连续电极的步骤; 以及将芯片从支撑板上分离的步骤。 可以在临时接合步骤之前形成基板的第一表面上的电极,并且形成在外围表面上的电极可以连接到第一表面上的电极。
    • 3. 发明授权
    • Masking apparatus and method of fabricating electronic component
    • 屏蔽装置及其制造方法
    • US08048228B2
    • 2011-11-01
    • US11925249
    • 2007-10-26
    • Hajime KuwajimaHitoshi Ohkubo
    • Hajime KuwajimaHitoshi Ohkubo
    • C23C16/00C23F1/00H01L21/306
    • H01G2/065H01G4/232Y10T428/24802
    • A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.
    • 掩模装置包括掩模基体和掩模板。 掩模基体包括至少一个间隔板,以及可容纳电子部件的空腔。 掩模板设置在掩模基体的上表面和/或下表面上。 掩模板包括具有对应于形成在部件的外表面上的外部结构体的形状的成膜开口。 因此,掩模板允许通过成膜开口在部件的外表面上选择性地进行成膜操作。 该空腔的内表面包括与成膜开口连通的成膜槽,使外部结构体能够立即形成在上表面和/或下表面上 部件表面。
    • 4. 发明申请
    • MASKING APPARATUS AND METHOD OF FABRICATING ELECTRONIC COMPONENT
    • 掩蔽设备和电子元件制作方法
    • US20080107873A1
    • 2008-05-08
    • US11925249
    • 2007-10-26
    • Hajime KUWAJIMAHitoshi Ohkubo
    • Hajime KUWAJIMAHitoshi Ohkubo
    • B05C11/00B05D5/00
    • H01G2/065H01G4/232Y10T428/24802
    • A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.
    • 掩模装置包括掩模基体和掩模板。 掩模基体包括至少一个间隔板,以及可容纳电子部件的空腔。 掩模板设置在掩模基体的上表面和/或下表面上。 掩模板包括具有对应于形成在部件的外表面上的外部结构体的形状的成膜开口。 因此,掩模板允许通过成膜开口在部件的外表面上选择性地进行成膜操作。 该空腔的内表面包括与成膜开口连通的成膜槽,使外部结构体能够立即形成在上表面和/或下表面上 部件表面。
    • 8. 发明授权
    • Key switch and keyboard
    • 钥匙开关和键盘
    • US06376789B2
    • 2002-04-23
    • US09833709
    • 2001-04-13
    • Junichi MaruyamaTakashi TeradaHitoshi OhkuboKazutoshi Hayashi
    • Junichi MaruyamaTakashi TeradaHitoshi OhkuboKazutoshi Hayashi
    • H01H1370
    • H01H13/7006H01H3/125H01H2227/028H01H2227/036H01H2231/042
    • A key switch includes a base, a key top arranged above the base, a pair of link members interlocked to each other to support the key top above the base and direct the key top in a vertical direction, and a switching mechanism capable of opening and closing an electric circuit in connection with a vertical movement of the key top. Each of the link members includes an engagable end region engaged with the key top. The base includes an inner peripheral surface defining an opening capable of receiving the link members. The base is provided on the inner peripheral surface with protruding wall parts located at positions respectively facing oppositely to the engagable end regions of the link members. Each protruding wall part serves to locally reduce a clearance defined between the inner peripheral surface and the engagable region of each link member when the link member is received in the opening.
    • 钥匙开关包括基座,布置在基座上方的键顶,一对互锁的支撑构件,以支撑基座上方的键顶部并在顶部方向上引导键顶;以及切换机构,其能够打开和 关闭与键顶的垂直运动有关的电路。 每个链接构件包括与键顶接合的可接合的端部区域。 底座包括限定能够接收连杆构件的开口的内周面。 基部设置在内周面上,突出壁部位于分别面对连接构件的可接合端部区域的相对的位置。 当连接构件被容纳在开口中时,每个突出壁部分用于局部地减小限定在每个连杆构件的内周表面和可接合区域之间的间隙。
    • 10. 发明授权
    • Inductive element and manufacturing method of the same
    • 感应元件及其制造方法相同
    • US07212095B2
    • 2007-05-01
    • US10773318
    • 2004-02-09
    • Shinichi SatoHitoshi OhkuboToshiaki Kikuchi
    • Shinichi SatoHitoshi OhkuboToshiaki Kikuchi
    • H01F5/00
    • H01F5/00H01F17/0033H01F2017/004
    • Conductor layers 2A and insulating layers 4A are alternately stacked so as to prepare a base material 17. A plurality of grooves 18 having a predetermined width are formed in a surface of the base material 17 in such a manner that these plural grooves 18 are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials 5 are filled into the grooves 18. Surfaces 16 of the base material into which the embedding materials 5 have been filled are flattened by polishing. The conductor layers 2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.
    • 交替层叠导体层2A和绝缘层4A以制备基材17。 为了形成线圈内周部,在基材17的表面上形成多个具有预定宽度的槽18,使得这些多个槽18沿层叠层方向彼此平行地定位。 嵌入材料5被填充到凹槽18中。 嵌入材料5填充到其中的基材的表面16通过抛光而变平。 彼此相邻的导体层2A彼此连接,从而构成构成感应元件的螺旋线圈。 然后,所得基材的前平面和后平面被绝缘层覆盖,绝缘层被切割以获得各自的芯片。