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1. 发明授权

US07905012B2 Method for manufacturing electronic components 有权
标题翻译：电子元件制造方法
公开(公告)号：US07905012B2
公开(公告)日：2011-03-15
申请号：US12029832
申请日：2008-02-12
申请人： Hajime Kuwajima , Hitoshi Ohkubo , Manabu Ohta
发明人： Hajime Kuwajima , Hitoshi Ohkubo , Manabu Ohta
IPC分类号： H05K3/02
CPC分类号： H01G4/248 , H01C1/148 , H01C17/281 , H01G4/232 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163 , Y10T29/4979 , Y10T156/1052
摘要： A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.
摘要翻译：一种电子部件的制造方法，其特征在于，包括：利用粘合片将基板临时粘结在支撑板上的工序; 通过在基板上设置从第一表面侧相对的第二表面侧在厚度方向上延伸的切口，形成用于将基板分割为各个芯片的切割槽的步骤; 例如通过溅射在每个芯片的位于切割槽内的第二表面和外周表面上形成连续电极的步骤; 以及将芯片从支撑板上分离的步骤。可以在临时接合步骤之前形成基板的第一表面上的电极，并且形成在外围表面上的电极可以连接到第一表面上的电极。

2. 发明申请

US20080236870A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US20080236870A1
公开(公告)日：2008-10-02
申请号：US12029832
申请日：2008-02-12
申请人： Hajime KUWAJIMA , Hitoshi Ohkubo , Manabu Ohta
发明人： Hajime KUWAJIMA , Hitoshi Ohkubo , Manabu Ohta
IPC分类号： H01B5/14 , B32B37/12 , B32B38/10
CPC分类号： H01G4/248 , H01C1/148 , H01C17/281 , H01G4/232 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163 , Y10T29/4979 , Y10T156/1052
摘要： A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.
摘要翻译：一种电子部件的制造方法，其特征在于，包括：利用粘合片将基板临时粘结在支撑板上的工序; 通过在基板上设置从第一表面侧相对的第二表面侧在厚度方向上延伸的切口，形成用于将基板分割为各个芯片的切割槽的步骤; 例如通过溅射在每个芯片的位于切割槽内的第二表面和外周表面上形成连续电极的步骤; 以及将芯片从支撑板上分离的步骤。可以在临时接合步骤之前形成基板的第一表面上的电极，并且形成在外围表面上的电极可以连接到第一表面上的电极。

3. 发明授权

US08048228B2 Masking apparatus and method of fabricating electronic component 有权
标题翻译：屏蔽装置及其制造方法
公开(公告)号：US08048228B2
公开(公告)日：2011-11-01
申请号：US11925249
申请日：2007-10-26
申请人： Hajime Kuwajima , Hitoshi Ohkubo
发明人： Hajime Kuwajima , Hitoshi Ohkubo
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01G2/065 , H01G4/232 , Y10T428/24802
摘要： A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.
摘要翻译：掩模装置包括掩模基体和掩模板。掩模基体包括至少一个间隔板，以及可容纳电子部件的空腔。掩模板设置在掩模基体的上表面和/或下表面上。掩模板包括具有对应于形成在部件的外表面上的外部结构体的形状的成膜开口。因此，掩模板允许通过成膜开口在部件的外表面上选择性地进行成膜操作。该空腔的内表面包括与成膜开口连通的成膜槽，使外部结构体能够立即形成在上表面和/或下表面上部件表面。

4. 发明申请

US20080107873A1 MASKING APPARATUS AND METHOD OF FABRICATING ELECTRONIC COMPONENT 有权
标题翻译：掩蔽设备和电子元件制作方法
公开(公告)号：US20080107873A1
公开(公告)日：2008-05-08
申请号：US11925249
申请日：2007-10-26
申请人： Hajime KUWAJIMA , Hitoshi Ohkubo
发明人： Hajime KUWAJIMA , Hitoshi Ohkubo
IPC分类号： B05C11/00 , B05D5/00
CPC分类号： H01G2/065 , H01G4/232 , Y10T428/24802
摘要： A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.
摘要翻译：掩模装置包括掩模基体和掩模板。掩模基体包括至少一个间隔板，以及可容纳电子部件的空腔。掩模板设置在掩模基体的上表面和/或下表面上。掩模板包括具有对应于形成在部件的外表面上的外部结构体的形状的成膜开口。因此，掩模板允许通过成膜开口在部件的外表面上选择性地进行成膜操作。该空腔的内表面包括与成膜开口连通的成膜槽，使外部结构体能够立即形成在上表面和/或下表面上部件表面。

5. 发明授权

US09236171B2 Coil component and method for producing same 有权
标题翻译：线圈部件及其制造方法
公开(公告)号：US09236171B2
公开(公告)日：2016-01-12
申请号：US13880039
申请日：2011-10-14
申请人： Tomokazu Ito , Hitoshi Ohkubo , Yoshihiro Maeda , Makoto Morita , Toshiyuki Anbo , Kyohei Tonoyama , Manabu Ohta
发明人： Tomokazu Ito , Hitoshi Ohkubo , Yoshihiro Maeda , Makoto Morita , Toshiyuki Anbo , Kyohei Tonoyama , Manabu Ohta
IPC分类号： H01F5/00 , H01F27/28 , H01F3/08 , H01F17/04 , H01F27/32 , H01F41/04 , H01F27/255
CPC分类号： H01F3/08 , H01F5/003 , H01F17/04 , H01F27/255 , H01F27/324 , H01F41/04 , H01F2017/048 , Y10T29/4902 , Y10T29/49075
摘要： A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.
摘要翻译：线圈部件包括：绝缘树脂层，设置在形成在第一基板的背面上的第一平面螺旋导体和形成在第二基板的背面上的第二平面螺旋导体之间; 覆盖形成在其上形成有绝缘树脂层的第一基板的前表面上的第三第二平面螺旋形导体的上芯; 以及覆盖形成在其上形成有绝缘树脂层的第二基板的前表面上的第四平面螺旋形导体的下芯。上下芯之一由含金属磁粉的树脂形成。线圈部件包括分别设置在第一和第二基板中的每一个的中心部分和外部部分的连接部分，以物理地连接上部和下部芯部。

6. 发明申请

US20130222101A1 COIL COMPONENT AND METHOD FOR PRODUCING SAME 有权
标题翻译：线圈组件及其制造方法
公开(公告)号：US20130222101A1
公开(公告)日：2013-08-29
申请号：US13880039
申请日：2011-10-14
申请人： Tomokazu Ito , Hitoshi Ohkubo , Yoshihiro Maeda , Makoto Morita , Toshiyuki Anbo , Kyohei Tonoyama , Manabu Ohta
发明人： Tomokazu Ito , Hitoshi Ohkubo , Yoshihiro Maeda , Makoto Morita , Toshiyuki Anbo , Kyohei Tonoyama , Manabu Ohta
IPC分类号： H01F3/08 , H01F41/04 , H01F5/00
CPC分类号： H01F3/08 , H01F5/003 , H01F17/04 , H01F27/255 , H01F27/324 , H01F41/04 , H01F2017/048 , Y10T29/4902 , Y10T29/49075
摘要： A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.
摘要翻译：线圈部件包括：绝缘树脂层，设置在形成在第一基板的背面上的第一平面螺旋导体和形成在第二基板的背面上的第二平面螺旋导体之间; 覆盖形成在其上形成有绝缘树脂层的第一基板的前表面上的第三第二平面螺旋形导体的上芯; 以及覆盖形成在其上形成有绝缘树脂层的第二基板的前表面上的第四平面螺旋形导体的下芯。上下芯之一由含金属磁粉的树脂形成。线圈部件包括分别设置在第一和第二基板中的每一个的中心部分和外部部分的连接部分，以物理地连接上部和下部芯部。

7. 发明授权

US5679420A Polymer resin packaging material for photographic light sensitive material 失效
标题翻译：用于摄影感光材料的聚合物树脂包装材料
公开(公告)号：US5679420A
公开(公告)日：1997-10-21
申请号：US577326
申请日：1995-12-22
申请人： Masahiko Taguchi , Katsunori Goi , Hitoshi Ohkubo
发明人： Masahiko Taguchi , Katsunori Goi , Hitoshi Ohkubo
IPC分类号： B29C47/06 , G03C3/00 , B65D85/84
CPC分类号： G03C3/00 , Y10T428/13
摘要： A polymer resin packaging material for a photographic light sensitive material is disclosed, the packaging material comprising at least one heat seal layer consisting of a polymer resin prepared by polymerizing an ethylenically unsaturated monomer in the presence of a metallocene catalyst, the polymer resin containing a lower molecular weight polymer in an amount of 3 weight % or less.
摘要翻译：公开了一种用于照相感光材料的聚合物树脂包装材料，该包装材料包括至少一个由茂金属催化剂存在下聚合烯属不饱和单体制备的聚合物树脂组成的热封层，该聚合物树脂含有较低的 3重量％以下的分子量聚合物。

8. 发明授权

US06376789B2 Key switch and keyboard 有权
标题翻译：钥匙开关和键盘
公开(公告)号：US06376789B2
公开(公告)日：2002-04-23
申请号：US09833709
申请日：2001-04-13
申请人： Junichi Maruyama , Takashi Terada , Hitoshi Ohkubo , Kazutoshi Hayashi
发明人： Junichi Maruyama , Takashi Terada , Hitoshi Ohkubo , Kazutoshi Hayashi
IPC分类号： H01H1370
CPC分类号： H01H13/7006 , H01H3/125 , H01H2227/028 , H01H2227/036 , H01H2231/042
摘要： A key switch includes a base, a key top arranged above the base, a pair of link members interlocked to each other to support the key top above the base and direct the key top in a vertical direction, and a switching mechanism capable of opening and closing an electric circuit in connection with a vertical movement of the key top. Each of the link members includes an engagable end region engaged with the key top. The base includes an inner peripheral surface defining an opening capable of receiving the link members. The base is provided on the inner peripheral surface with protruding wall parts located at positions respectively facing oppositely to the engagable end regions of the link members. Each protruding wall part serves to locally reduce a clearance defined between the inner peripheral surface and the engagable region of each link member when the link member is received in the opening.
摘要翻译：钥匙开关包括基座，布置在基座上方的键顶，一对互锁的支撑构件，以支撑基座上方的键顶部并在顶部方向上引导键顶;以及切换机构，其能够打开和关闭与键顶的垂直运动有关的电路。每个链接构件包括与键顶接合的可接合的端部区域。底座包括限定能够接收连杆构件的开口的内周面。基部设置在内周面上，突出壁部位于分别面对连接构件的可接合端部区域的相对的位置。当连接构件被容纳在开口中时，每个突出壁部分用于局部地减小限定在每个连杆构件的内周表面和可接合区域之间的间隙。

9. 发明授权

US5462710A Manufacturing method of a flange for use in a film cartridge 失效
标题翻译：用于暗盒的凸缘的制造方法
公开(公告)号：US5462710A
公开(公告)日：1995-10-31
申请号：US148848
申请日：1993-11-08
申请人： Osamu Shibazaki , Hitoshi Ohkubo
发明人： Osamu Shibazaki , Hitoshi Ohkubo
IPC分类号： B29C45/26 , G03B17/30 , B29C45/40
CPC分类号： G03B17/30 , B29C45/26
摘要： A manufacturing method forms flanges for use in a film cartridge which are made of resin. Each flange is made of the resin by an injection molding process. Gates to cavities provided in a mold are located such that residual portions of solidified resin at the gates, remaining after the injection molding process has been completed, do not come into contact with a film in the cartridge as the film is moved into and out of the cartridge.
摘要翻译：制造方法形成用于由树脂制成的暗盒的凸缘。每个凸缘由注塑成型工艺由树脂制成。将浇口设置在模具中的空腔被定位成使得在注射成型过程之后剩余的浇口处的固化树脂的残留部分已经完成，当薄膜移入和移出时，不会与胶片中的薄膜接触墨盒。

10. 发明授权

US07212095B2 Inductive element and manufacturing method of the same 有权
标题翻译：感应元件及其制造方法相同
公开(公告)号：US07212095B2
公开(公告)日：2007-05-01
申请号：US10773318
申请日：2004-02-09
申请人： Shinichi Sato , Hitoshi Ohkubo , Toshiaki Kikuchi
发明人： Shinichi Sato , Hitoshi Ohkubo , Toshiaki Kikuchi
IPC分类号： H01F5/00
CPC分类号： H01F5/00 , H01F17/0033 , H01F2017/004
摘要： Conductor layers 2A and insulating layers 4A are alternately stacked so as to prepare a base material 17. A plurality of grooves 18 having a predetermined width are formed in a surface of the base material 17 in such a manner that these plural grooves 18 are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials 5 are filled into the grooves 18. Surfaces 16 of the base material into which the embedding materials 5 have been filled are flattened by polishing. The conductor layers 2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.
摘要翻译：交替层叠导体层2A和绝缘层4A以制备基材17。为了形成线圈内周部，在基材17的表面上形成多个具有预定宽度的槽18，使得这些多个槽18沿层叠层方向彼此平行地定位。嵌入材料5被填充到凹槽18中。嵌入材料5填充到其中的基材的表面16通过抛光而变平。彼此相邻的导体层2A彼此连接，从而构成构成感应元件的螺旋线圈。然后，所得基材的前平面和后平面被绝缘层覆盖，绝缘层被切割以获得各自的芯片。

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