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1. 发明申请

US20080236870A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US20080236870A1
公开(公告)日：2008-10-02
申请号：US12029832
申请日：2008-02-12
申请人： Hajime KUWAJIMA , Hitoshi Ohkubo , Manabu Ohta
发明人： Hajime KUWAJIMA , Hitoshi Ohkubo , Manabu Ohta
IPC分类号： H01B5/14 , B32B37/12 , B32B38/10
CPC分类号： H01G4/248 , H01C1/148 , H01C17/281 , H01G4/232 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163 , Y10T29/4979 , Y10T156/1052
摘要： A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.
摘要翻译：一种电子部件的制造方法，其特征在于，包括：利用粘合片将基板临时粘结在支撑板上的工序; 通过在基板上设置从第一表面侧相对的第二表面侧在厚度方向上延伸的切口，形成用于将基板分割为各个芯片的切割槽的步骤; 例如通过溅射在每个芯片的位于切割槽内的第二表面和外周表面上形成连续电极的步骤; 以及将芯片从支撑板上分离的步骤。可以在临时接合步骤之前形成基板的第一表面上的电极，并且形成在外围表面上的电极可以连接到第一表面上的电极。

2. 发明申请

US20080107873A1 MASKING APPARATUS AND METHOD OF FABRICATING ELECTRONIC COMPONENT 有权
标题翻译：掩蔽设备和电子元件制作方法
公开(公告)号：US20080107873A1
公开(公告)日：2008-05-08
申请号：US11925249
申请日：2007-10-26
申请人： Hajime KUWAJIMA , Hitoshi Ohkubo
发明人： Hajime KUWAJIMA , Hitoshi Ohkubo
IPC分类号： B05C11/00 , B05D5/00
CPC分类号： H01G2/065 , H01G4/232 , Y10T428/24802
摘要： A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.
摘要翻译：掩模装置包括掩模基体和掩模板。掩模基体包括至少一个间隔板，以及可容纳电子部件的空腔。掩模板设置在掩模基体的上表面和/或下表面上。掩模板包括具有对应于形成在部件的外表面上的外部结构体的形状的成膜开口。因此，掩模板允许通过成膜开口在部件的外表面上选择性地进行成膜操作。该空腔的内表面包括与成膜开口连通的成膜槽，使外部结构体能够立即形成在上表面和/或下表面上部件表面。

3. 发明申请

US20080265429A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US20080265429A1
公开(公告)日：2008-10-30
申请号：US12100039
申请日：2008-04-09
申请人： Hajime KUWAJIMA
发明人： Hajime KUWAJIMA
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： H01L23/552 , H01L23/3192 , H01L23/564 , H01L27/0688 , H01L2224/02371 , H01L2924/0002 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a shielding film having conductivity, being interposed between the first conductor and the second conductor, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole.
摘要翻译：电子部件设置有第一导体，用于覆盖第一导体的表面的绝缘体，穿过绝缘体的通孔，以及位于绝缘体的表面上的第二导体，并且通过通孔电连接到第一导体并且包括具有导电性的屏蔽膜，其被插入在第一导体和第二导体之间，并且至少从构成底部的第一导体的表面连续延伸而覆盖通孔中的第一导体和绝缘体之间的界面通孔的表面到通孔的内壁表面。

4. 发明申请

US20110048789A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电子元件及其制造方法
公开(公告)号：US20110048789A1
公开(公告)日：2011-03-03
申请号：US12939825
申请日：2010-11-04
申请人： Hajime KUWAJIMA
发明人： Hajime KUWAJIMA
IPC分类号： H05K1/11
CPC分类号： H01L23/552 , H01L23/3192 , H01L23/564 , H01L27/0688 , H01L2224/02371 , H01L2924/0002 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a shielding film having conductivity, being interposed between the first conductor and the second conductor, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole.
摘要翻译：电子部件设置有第一导体，用于覆盖第一导体的表面的绝缘体，穿过绝缘体的通孔，以及位于绝缘体的表面上的第二导体，并且通过通孔电连接到第一导体并且包括具有导电性的屏蔽膜，其被插入在第一导体和第二导体之间，并且至少从构成底部的第一导体的表面连续延伸而覆盖通孔中的第一导体和绝缘体之间的界面通孔的表面到通孔的内壁表面。

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