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    • 5. 发明申请
    • Method of forming a conductive wiring pattern by laser irradiation and a conductive wiring pattern
    • 通过激光照射形成导电布线图案的方法和导电布线图案
    • US20060057502A1
    • 2006-03-16
    • US11103448
    • 2005-04-12
    • Issei OkadaKohei ShimodaKeiji EbataTakayuki Hirai
    • Issei OkadaKohei ShimodaKeiji EbataTakayuki Hirai
    • G03F7/00
    • G03F7/2053C23C18/14H05K1/097H05K3/02H05K2203/107H05K2203/1131
    • Fine wirings are made by a method having the steps of painting a board with metal dispersion colloid including metal nanoparticles of 0.5 nm-200 nm diameters, drying the metal dispersion colloid into a metal-suspension film, irradiating the metal-suspension film with a laser beam of 300 nm-550 nm wavelengths, depicting arbitrary patterns on the film with the laser beam, aggregating metal nanoparticles into larger conductive grains, washing the laser-irradiated film, eliminating unirradiated metal nanoparticles, and forming metallic wiring patterns built by the conductive grains on the board. The present invention enables an inexpensive apparatus to form fine arbitrary wiring patterns on boards without expensive photomasks, resists, exposure apparatus and etching apparatus. The method can make wirings also on plastic boards or low-melting-point glass boards which have poor resistance against heat and chemicals.
    • 通过具有以下步骤的方法制造细线,该方法包括用包含0.5nm-200nm直径的金属纳米颗粒的金属分散体胶体涂布板,将金属分散体胶体干燥成金属悬浮膜,用激光照射金属 - 悬浮膜 300nm-550nm波长的光束,用激光束描绘膜上的任意图案,将金属纳米颗粒聚集成更大的导电颗粒,洗涤激光照射的膜,消除未照射的金属纳米颗粒,以及形成由导电颗粒构成的金属布线图案 在板上。 本发明使得廉价的装置能够在没有昂贵的光掩模,抗蚀剂,曝光装置和蚀刻装置的板上形成精细的任意布线图案。 该方法也可以在耐热和耐化学性差的塑料板或低熔点玻璃板上进行布线。