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1. 发明申请

WO2005021828A2 PVD TARGETS COMPRISING COPPER IN TERNARY MIXTURES, AND METHODS OF FORMING COPPER-CONTAINING PVD TARGETS 审中-公开
标题翻译：在三元混合物中包含铜的PVD目标和形成含铜PVD靶材的方法
公开(公告)号：WO2005021828A2
公开(公告)日：2005-03-10
申请号：PCT/US2004027090
申请日：2004-08-20
申请人： HONEYWELL INT INC , DANIELS BRIAN J , HAUSMAN CHRISTIE J , HUTCHISON CARA L , LEE EAL H , YI WUWEN , STROTHERS SUSAN D , PINTER MICHAEL R , THOMAS MICHAEL E
发明人： DANIELS BRIAN J , HAUSMAN CHRISTIE J , HUTCHISON CARA L , LEE EAL H , YI WUWEN , STROTHERS SUSAN D , PINTER MICHAEL R , THOMAS MICHAEL E
IPC分类号： C23C14/16 , C23C14/34 , H01L21/285 , H01L21/768 , H01L23/532 , C23C14/14 , C23C14/32
CPC分类号： C23C14/3414 , B32B15/012 , C23C14/16 , C23C14/185 , C23C14/3407 , H01L21/2855 , H01L21/76841 , H01L21/76843 , H01L21/76871 , H01L21/76877 , H01L23/53233 , H01L2924/0002 , H01L2924/00
摘要： The invention includes a physical vapor deposition target containing copper and at least two additional elements selected from Ag, Al, As, Au, B, Be, Ca, Cd, Co, Cr, Fe, Ga, Ge, Hf, Hg, In, Ir, Li, Mg, Mn, Nb, Ni, Pb, Pd, Pt, Sb, Sc, Si, Sn, Ta, Te, Ti, V, W, Zn and Zr, a total amount of the at least two additional elements being from 100 ppm to 10 atomic %. The invention additionally includes thin films and interconnects which contain the mixture of copper and at least two added elements. The invention also includes forming a copper-containing target. A mixture of copper and two or more elements is formed. The mixture is cast by melting and is subsequently cooled to form a billet which is worked utilizing one or both of equal channel angular extrusion and thermornechanical processing to form a target.
摘要翻译：本发明包括含有铜和至少两种选自Ag，Al，As，Au，B，Be，Ca，Cd，Co，Cr，Fe，Ga，Ge，Hf，Hg，In， Ir，Li，Mg，Mn，Nb，Ni，Pb，Pd，Pt，Sb，Sc，Si，Sn，Ta，Te，Ti，V，W，Zn和Zr中的至少两种添加元素为100〜10原子％。本发明还包括含有铜和至少两种添加元素的混合物的薄膜和互连。本发明还包括形成含铜靶。形成铜和两种或更多种元素的混合物。混合物通过熔化铸造并随后冷却以形成坯料，其使用等通道角挤压和热机械加工中的一种或两种来形成靶。

2. 发明申请

WO2008060917A9 NOVEL MANUFACTURING DESIGN AND PROCESSING METHODS AND APPARATUS FOR SPUTTERING TARGETS 审中-公开
标题翻译：新型溅射靶材的制造设计和加工方法及装置
公开(公告)号：WO2008060917A9
公开(公告)日：2008-07-31
申请号：PCT/US2007083903
申请日：2007-11-07
申请人： HONEYWELL INT INC , KARDOKUS JANINE , WERNER HORT , STROTHERS SUSAN D , HAUSMAN CHRISTIE J , HUBERT KEVIN T , MORALES DIANE , PAYTON MICHAEL D
发明人： KARDOKUS JANINE , WERNER HORT , STROTHERS SUSAN D , HAUSMAN CHRISTIE J , HUBERT KEVIN T , MORALES DIANE , PAYTON MICHAEL D
IPC分类号： C23C14/34
CPC分类号： C23C14/3414
摘要： Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.
摘要翻译：本文描述了具有减少的老化时间的溅射靶，其包括：a）具有平均晶粒尺寸的机器表面材料，和b）具有平均晶粒尺寸的芯材，其中机器表面材料具有平均粒度表面粗糙度（Ra）等于或小于表面材料或芯材中的至少一种的平均粒度。本文描述了具有减少的老化时间的溅射靶，其包括：表面材料和芯材料，其中表面材料或芯材料中的至少一种包含相对无带结晶学取向。此外，生产具有减少的老化时间的溅射靶的方法包括：提供具有至少一些残余表面损伤的表面材料，提供芯材，将表面材料结合到芯材，以及将表面材料机加工成平均表面粗糙度（Ra）等于或小于表面材料或芯材中的至少一种的平均粒度。另外，生产具有减少的老化时间的溅射靶的方法包括：提供与芯材相结合的表面材料，其中表面材料具有至少一些残余表面损伤并且将表面材料机加工至平均表面粗糙度（Ra ）等于或小于表面材料或芯材中的至少一种的平均粒度。

3. 发明申请

WO2008060917A3 METHODS FOR MAKING SPUTTERING TARGETS 审中-公开
标题翻译：制造喷射目标的方法
公开(公告)号：WO2008060917A3
公开(公告)日：2009-04-02
申请号：PCT/US2007083903
申请日：2007-11-07
申请人： HONEYWELL INT INC , KARDOKUS JANINE , WERNER HORT , STROTHERS SUSAN D , HAUSMAN CHRISTIE J , HUBERT KEVIN T , MORALES DIANE , PAYTON MICHAEL D
发明人： KARDOKUS JANINE , WERNER HORT , STROTHERS SUSAN D , HAUSMAN CHRISTIE J , HUBERT KEVIN T , MORALES DIANE , PAYTON MICHAEL D
IPC分类号： C23C14/34
CPC分类号： C23C14/3414
摘要： Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.
摘要翻译：本文描述了具有减少的烧伤时间的溅射靶，其包括：a）具有平均晶粒尺寸的机加工的表面材料，以及b）具有平均晶粒尺寸的芯材，其中机加工表面材料具有平均表面粗糙度（Ra）等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。本文描述了具有减少的老化时间的溅射靶，其包括：表面材料和芯材料，其中至少一个表面材料或芯材料包含相对无带的结晶取向。此外，生产具有减少的老化时间的溅射靶的方法包括：提供具有至少一些残余表面损伤的表面材料，提供芯材料，将表面材料耦合到芯材料，以及将表面材料机加工成平均表面粗糙度（Ra）等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。此外，生产具有减少的烧成时间的溅射靶的方法包括：提供与芯材组合的表面材料，其中表面材料具有至少一些残余表面损伤并将表面材料机加工成平均表面粗糙度（Ra ）等于或小于表面材料或芯材料中的至少一种的平均晶粒尺寸。

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