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    • 2. 发明申请
    • MONOLITHIC LCP POLYMER MICROELECTRONIC WIRING MODULES
    • 单片LCP聚合物微电子接线模块
    • WO1996008945A1
    • 1996-03-21
    • PCT/US1995011101
    • 1995-09-05
    • HOECHST CELANESE CORPORATIONKURARAY CO., LTD.
    • HOECHST CELANESE CORPORATIONKURARAY CO., LTD.JESTER, Randy, D.CULBERTSON, Edwin, C.FRANK, Detlef, M.ROUNSVILLE, Sherman, H.PENOYER, John, A.TSUDAKA, TakeichiONODERA, MioruSATO, ToshiakiSANEFUJI, Toru
    • H05K03/46
    • H05K3/4632H05K3/28H05K3/386H05K3/4617H05K2201/0129H05K2201/0141H05K2201/0145H05K2201/0195H05K2201/10378
    • The invention provides a multilayer microelectronic circuit board comprising a laminate of a plurality of circuit layers containing conductive vias (12) within the layers or a combination of conductive vias (12) and conductive wiring patterns (16) on a surface of the layers, said layers comprising a first liquid crystal polymer (10) and, interposed between said circuit layers, a layer of second liquid crystal polymer (21) having a melting point of at least about 10 DEG C lower than the melting point of said first liquid crystal polymer (10). The boards are produced by stacking a plurality of circuit layer sheets (10) in appropriate electrical alignment such that they are separated by an interposed layer (21) of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers (22) in contact with the higher melting point polymer (23) of the circuit layers.
    • 本发明提供一种多层微电子电路板,其包括多个电路层的叠层,该多个电路层在层内包含导电通孔(12),或者在该层的表面上的导电通孔(12)和导电布线图案(16)的组合, 包含第一液晶聚合物(10)的层和介于所述电路层之间的第二液晶聚合物(21)层,其熔点比所述第一液晶聚合物(10)的熔点低至少约10℃ (10)。 这些板通过以适当的电气对准层叠多个电路层片(10)而制成,使得它们被具有较低熔点的第二液晶聚合物的插入层(21)分开,并在压力下加热堆叠的聚合物片 足以将片或层结合成微电子印刷电路板,加热的温度足以熔化较低熔点的第二聚合物,但不足以熔化存在于电路层中的聚合物。 第二聚合物层可以在组装期间作为单独的片材插入,或者可以作为与电路层的较高熔点聚合物(23)接触的一个或两个分开的表面层(22)存在。