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1. 发明专利

JPH0427149A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SUBSTRATE USED FOR MOUNTING SAME 失效
公开(公告)号：JPH0427149A
公开(公告)日：1992-01-30
申请号：JP13203190
申请日：1990-05-22
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： KAWAKUBO HIROSHI , ICHIHARA SEIICHI , HAGIWARA YASUHISA , KAJIWARA YUJIRO , ONO HIROSHI
IPC分类号： H01L23/50 , H05K3/34
摘要： PURPOSE:To differentiate lengths of leads and to accelerate multiple pins of a surface mounting type LSI package by differentiating outer lead shape of parts of multiple leads extended externally from the side of a package body from the other shape. CONSTITUTION:A semiconductor chip 3 is placed on a tab 4 made of a conductive material, many leads 5 made of the same material as tabs 4 are led from four sides of a package body 2, partial leads 5a and outer lead shape of other leads 5b are pad-led to gull wings in such a manner that the lengths of leads are set to l2, l1 so that the l1 is shorter than the l2. The leads 5a and the leads 5b are alternately disposed along the side of the body 2. Thus, while the profile size of the body remains constant, the number of pins can be increased, the multiple pins of a surface mounting type LSI package can be increased.

2. 发明专利

JPS6329960A LEAD FRAME FOR RESIN SEAL TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6329960A
公开(公告)日：1988-02-08
申请号：JP17167786
申请日：1986-07-23
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： HAGIWARA YASUHISA , KIMOTO RYOSUKE , NISHIDA TAKAFUMI , MASUDA MASACHIKA
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent interfacial peeling between a resin and a lead frame, to obviate the generation of resin cracks and to improve packaging properties by projecting a projecting section from the corner section of a tab section and forming a through-hole to the projecting section. CONSTITUTION:Projecting sections 3 projecting to the outside of a tab section 1, with which a semiconductor chip 11 is joined, are protruded to the corner sections of the tab section 1, and through-holes 4 vertically penetrating the projecting sections 3 are bored to the projecting sections 3 as required. The projecting sections 3 are also projected to the corner sections of the tab section 1 aiming at a fact that connecting sections with tab hanging leads 2 in the tab section 1 are hardly peeled generally from a resin. Accordingly, peeling from the resin is reduced, and resin cracks are difficult to be shaped even when a surface package type semiconductor package is packaged by soldering, thus elevating a packaging temperature, then improving packaging properties.

3. 发明专利

JPS63126257A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63126257A
公开(公告)日：1988-05-30
申请号：JP27184686
申请日：1986-11-17
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： HAGIWARA YASUHISA , MORITA TOSHIYA , MASUDA MASACHIKA
IPC分类号： H01L23/50 , H01L21/60
摘要： PURPOSE:To prevent short-circuit of bonding wires, by providing means for preventing short circuit of bonding wires and giving a certain degree of freedom to the positional relation between a lead frame and pads on a semiconductor chip. CONSTITUTION:A tip end of a lead 15A corresponding to a corner of a tab 13 is branched to several sections. The leads 15A and lead 15B on the opposite sides of a tab hanging lead 14 are spaced from the lead 14 by a distance D1 that is larger than a distance D2 between other lead 15 and the lead 15A or 15B. Each pad 12A on a semiconductor chip 12 can be electrically connected to an appropriate lead by means of a bonding wire 17, by selecting a lead whose tip end is located at a position closest to the tip end of the lead 15A and not contacted with the lead 14. Accordingly, short-circuit of the bonding wires 17 can be prevented completely.

4. 发明专利

JPS6298753A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6298753A
公开(公告)日：1987-05-08
申请号：JP23743485
申请日：1985-10-25
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： OKAMOTO MICHIO , MASUDA MASACHIKA , HAGIWARA YASUHISA , MATSUZAWA ASAO
IPC分类号： H01L23/28 , H01L23/31
摘要： PURPOSE:To shorten the length of the wires to be used for electrical connection by mounting a semiconductor pellet on the pellet attaching substrate whose pellet attaching surface is lower than the wiring forming surface. CONSTITUTION:A semiconductor pellet 3 is sealed in a packaging resin 1 along with a pellet attaching substrate 5 to which the pellet is being bonded through such a bonding agent 4 as a silver paste. The pellet attaching substrate 5 consists of a glass epoxy substrate, its peripheral upper surface is a wiring forming surface and a pellet attaching surface is formed at its central part at the position lower than the wiring forming surface. That is, the pellet attaching surface is formed as the bottom surface of the recessed part surrounded with the wiring forming surface in all directions. By this way, the length of wires can be shortened because a wiring layer 6 is allowed to approach the pellet 3 and moreover, as the wiring layer can be formed in a desired form, a bonding area of sufficient width can be ensured.

5. 发明专利

JPS6281738A LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAID LEAD FRAME 失效
公开(公告)号：JPS6281738A
公开(公告)日：1987-04-15
申请号：JP22183285
申请日：1985-10-07
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： HAGIWARA YASUHISA , MASUDA MASACHIKA
IPC分类号： H01L23/50 , H01L21/48 , H01L23/495
摘要： PURPOSE:To ensure bonding and to prevent short circuits of wires, by the structure of a lead frame, which is formed so that the width of an inner lead that is provided at the neighborhood of a tab suspending lead is larger than other inner leads. CONSTITUTION:A lead frame 1 has a square frame part 2, a plurality of leads, which are extended to the central direction from each side of the frame part 2, and tie bars 4, which connect the intermediate parts of the leads. At the central part of the lead frame 1, a square tab 5 is formed. The tab 5 is supported with suspending leads 6, which link the four corners of the tab 5 and the four corners of the frame part 2. Each part of the lead 3 surrounded by the tie bar 4 forms an inner lead 7. The surface of at least tip part of the inner lead 7 is plated with a gold layer and the like for excellent bonding. The width of an inner lead 7a neighboring the tab suspending lead is made broader than the width of other inner lead 7.

6. 发明专利

JPS60200535A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60200535A
公开(公告)日：1985-10-11
申请号：JP5611084
申请日：1984-03-26
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： SUZUKI AKIRA , HAGIWARA YASUHISA
IPC分类号： H01L21/60
摘要： PURPOSE:To improve the reliability of a semiconductor device by forming a bonding pad of a pellet of a mixture material of glass and metal to electrically conduct the internal wirings of the pellet and to simultaneously strongly bond with a final passivation film. CONSTITUTION:A bonding pad 4 of a pellet 3 is formed, for example, of a mixture material of glass and ultrafine shape gold. A final passivation film 10 is etched at the prescribed position to open a hole, aluminum wirings 9 are partly exposed as a bonding pad forming electrodes. Then, titanium 11a is coated as the first layer on the bonding pad forming electrode, and palladium 11b is coated as the second layer, the unnecessary portion of the metal layer is removed by etching to form a primary metal layer 11. Further, the mixture material of the glass-gold is so coated on the layer 11 as to enclose the layer 11 in the state that the end is contacted with the surface of the passivation film around the layer 11, thereby forming the pad 4.

7. 发明专利

JPH047865A LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME 失效
公开(公告)号：JPH047865A
公开(公告)日：1992-01-13
申请号：JP10924390
申请日：1990-04-25
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： HAGIWARA YASUHISA , KAWAKUBO HIROSHI , ICHIHARA SEIICHI , ONO HIROSHI , SUZUKI HIROMICHI
IPC分类号： H01L23/50
摘要： PURPOSE:To facilitate handling and testing, and realize a multipin LSI package, by arranging test pads on one surface of a guard ring. CONSTITUTION:Test pads 7 are arranged on one surface of a frame type guard ring 6 for fixing an outer lead part 3b. Hence, when selection work such as testing and screening is performed, it is not necessary to bring a prove directly into contact with the outer lead part, so that the deformation defect of lead in a selection process can be surely prevented. Further, since the handling of lead frames is facilitated, the deformation defect of lead at the time of carriage or the like can be surely prevented. Thereby, when the plate thickness of a lead frame is extremely reduced, and the width of a lead and the pitch between leads are made small, the warp and the deformation of the lead can be prevented, and handling can be surely performed. Thus a multipin LSI can be realized.

8. 发明专利

JPS6355085A TRAY FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6355085A
公开(公告)日：1988-03-09
申请号：JP19545186
申请日：1986-08-22
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： KITAMURA WAHEI , HAGIWARA YASUHISA
IPC分类号： H01L23/00 , B65D85/38 , B65D85/86 , H01L21/673 , H01L21/68

9. 发明专利

JPS61241954A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61241954A
公开(公告)日：1986-10-28
申请号：JP8248885
申请日：1985-04-19
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： HAGIWARA YASUHISA , SATO HAJIME , ANJO ICHIRO
IPC分类号： H01L23/50 , H01L23/498
摘要： PURPOSE:To obtain a leadframe having fine leads corresponding to the miniaturization of a pellet, by forming an insulating film on a metal plate, and forming a lead pattern on said film. CONSTITUTION:A leadframe 1 has an approximately square shape, which has square cut-out parts 2 at corner parts. An oxide film 4 as an insulating film is formed on a stainless steel plate 3. A specified lead pattern 5 is formed by plating on the film 4. A pellet 7 is attached to the central part of the leadframe 1 with a paste material 6 such as silver. The pellet 7 and inner leads 5a are wired with wires 8 comprising gold, copper, aluminum or the like. Thereafter, the device is packaged and sealed by a sealing material 9 such as an epoxy resin. Finally, the leadframe 1a, which is a part protruded from the package of the sealing material 9, is bent in an approximately S shape. Thus the fine lead pattern can be obtained.

10. 发明专利

JPH0422162A LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING IT 失效
公开(公告)号：JPH0422162A
公开(公告)日：1992-01-27
申请号：JP12791490
申请日：1990-05-17
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： HAGIWARA YASUHISA , ITO FUJIO , SUZUKI KAZUNARI , SUZUKI HIROMICHI
IPC分类号： H01L23/50
摘要： PURPOSE:To restrain a resin-molded package from being cracked at a test process such as a temperature cycle test, a thermal shock test or the like and at a soldering and mounting process by a method wherein a cutout part is formed and a die pad is divided by using the cutout part. CONSTITUTION:A semiconductor chip 4 is bonded to a die pad 8 via a thin bonding part composed of a silver paste; cutout parts 9 which are extended to the central direction from its outer circumference are formed in the die pad 8; and the pad 8 is divided into four parts by the parts 9. Molding resins on both the surface side and the rear surface side of the die pad 8 are bonded through the portions situated on the outer side of a chip mounting region 10 out of the parts 9; and it is possible to restrain that the molding resin on the rear surface side of the die pad 8 is contracted thanks to its bonding part. Thereby, it is possible to restrain a package crack caused by a thermal stress at a temperature cycle test, a thermal shock test and the like and a package crack caused by expansion of moisture at a soldering and mounting operation. It is possible to sharply increase the reliability and the yield of a semiconductor integrated circuit device 1.

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