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    • 6. 发明专利
    • SEMICONDUCTOR MEMORY DEVICE
    • JPS62197998A
    • 1987-09-01
    • JP3920486
    • 1986-02-26
    • HITACHI VLSI ENGHITACHI LTD
    • TERASAWA MASAAKISATO NOBUYUKIUJIIE KAZUAKINABEYA SHINJI
    • G11C17/00G11C16/06
    • PURPOSE:To reduce a current consumption, and to suppress a noise to an another circuit, etc., by increasing a current supplying capacity in the start up time of a voltage generation circuit, and decreasing the current supplying capacity when an output voltage arrives at a prescribed voltage level. CONSTITUTION:When the voltage of a power source voltage Vpp is below than +25V, the output signal LVH of a level detection circuit LVC goes to a low level, therefore, the output of an inverter circuit N1 goes to a high level, and the output signal of frequency F in a ring oscillator circuit OSC is inputted to a voltage generation circuit VPG. At the voltage generation circuit VPG, the power source voltage Vpp having a comparatively large current consumption can be obtained. Meanwhile, when the voltage of the power source voltage Vpp arrives at +25V, the output signal LVH of the level detection circuit LVC goes to the high level, and the oscillation signal of frequency F/4 is inputted to the voltage generation circuit VPG. In this way, at the voltage generation circuit VPG, the power source voltage Vpp having a comparatively small current consumption can be obtained.
    • 9. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH01100788A
    • 1989-04-19
    • JP25787787
    • 1987-10-13
    • HITACHI LTDHITACHI VLSI ENG
    • UJIIE KAZUAKINABEYA SHINJI
    • G11C11/14G11C5/14G11C16/12G11C16/30G11C17/18
    • PURPOSE:To enable a test by a write voltage lower (higher) than an ordinary voltage to be performed even after sealing a package by connecting a power source voltage terminal and an external terminal to a terminal on which the reference voltage of a limit circuit is applied via two switches. CONSTITUTION:The two switches Q1 and Q2 are connected to the terminal on the reference voltage supplying side of the limit circuit D1 which keeps a booster voltage constant for the voltage set as reference, and the switch Q1 on one side is connected to an internal power source voltage terminal, and also, the switch Q2 on the other side is connected to the external terminal T1 of a chip. In other words, by turning on either the two switches Q1 and Q2 selectively provided at the limit circuit D1, it is possible to perform write by the booster voltage setting an external voltage applied on the external terminal T1 as reference other than the ordinary write by the booster voltage setting the internal power source voltage as reference. In such a way, it is possible to perform the measurement of a margin, a withstand voltage test, and an acceleration test even after sealing the package.
    • 10. 发明专利
    • Insulated-gate type field-effect semiconductor device
    • 绝缘栅型场效应半导体器件
    • JPS5749271A
    • 1982-03-23
    • JP12452080
    • 1980-09-10
    • Hitachi Denshi LtdHitachi Ltd
    • UJIIE KAZUAKIYAMAGUCHI KEN
    • H01L29/417H01L29/78
    • H01L29/42368H01L29/78
    • PURPOSE:To substantially increase the distance between drain and gate electrodes in order to prevent destruction of a gate oxide film resulting from concentration of field, by gradually increasing the thickness of the gate oxide film from the source to the drain. CONSTITUTION:On a p type Si substrate 10, an SiO2 film 11 and an Si3N4 film 12 are piled up, and an opening 13 is provided in the drain region in order to form an n layer 14. Then, carrying out a thermal oxidation with the Si3N4 12 as a mask permits SiO2 having a gradient film thickness to be obtained. A portion of each of the Si3N4 film 12 and the SiO2 film 11 is removed, the source region is opened in order to provide an n layer 16, and a gate electrode 17 is formed on the gate oxide film 15 between the layers 16 and 14. In this case, the thickness of the gate oxide film 15 is made smaller than the length of the gate between the drain 14 and the source 16. By said constitution, it is possible to ease the concentration of field in the vicinity of the drain junction surface, so that destruction of the gate oxide film.
    • 目的:为了大大增加漏极和栅电极之间的距离,以便通过逐渐增加栅极氧化膜从源极到漏极的厚度来防止由场强集中引起的栅极氧化膜的破坏。 构成:在ap型Si衬底10上堆积SiO 2膜11和Si 3 N 4膜12,在漏极区域设置开口13,以形成n层14.然后,进行热氧化 作为掩模的Si 3 N 4 12可以获得具有梯度膜厚度的SiO 2。 除去Si 3 N 4膜12和SiO 2膜11中的每一个的一部分,为了提供n层16而打开源极区,并且在层16和14之间的栅极氧化膜15上形成栅电极17 在这种情况下,使栅极氧化膜15的厚度小于漏极14与源极16之间的栅极的长度。通过上述结构,能够使漏极附近的场强集中化 接合面,从而破坏栅极氧化膜。