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1. 发明专利

JPH06236874A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06236874A
公开(公告)日：1994-08-23
申请号：JP2238593
申请日：1993-02-10
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： SAITO MASAYOSHI , SAKAMA ISAO , TAKAHASHI TOSHIKAZU , MURAI FUMIO
IPC分类号： H01L21/3205 , H01L21/3213
摘要： PURPOSE:To provide a method of manufacturing a semiconductor device of multilayer wiring structure, wherein a semiconductor device high in reliability can be manufactured, and an integrated circuit is kept high in productive efficiency. CONSTITUTION:A conductor 5 is filled into an interlayer connection hole through a selective CVD method, a mask 7 is formed on the interlayer connection hole so as to prevent the conductor 5 from being removed off, and conductors 6 abnormally grown on an interlayer insulating film 4 are removed by etching. Thereafter, an upper wiring is formed.

2. 发明专利

JPH01189119A ELECTRON BEAM LITHOGRAPHY METHOD 失效
公开(公告)号：JPH01189119A
公开(公告)日：1989-07-28
申请号：JP1253588
申请日：1988-01-25
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： SAKAMA ISAO , TAKEDA YUTAKA , MURAI FUMIO
IPC分类号： H01L21/027 , H01L21/30
摘要： PURPOSE:To improve working size accuracy for a lithography figure size by dividing the lithography figure by a base state of a lithography region. CONSTITUTION:A groove formed by lithography figure 2 having 1.0mum of width, 10.0mum of length and 4.0mum of depth for reducing reflected electron quantity is formed in lithography figures 1, 1' having 0.3mum of width and 5.0mum of length on an Si substrate. Further, protrusion step difference of 0.4mum for increasing the reflected electron quantity with 0.5mum of width and 10.0mum of length is formed by a lithography figure 3 in the figure 1. The superposed part of the figure data of the figures 1, 2 is identified. Thus, the figures 1, 1' are divided into dividing lithography figures 4, 4', 5, 5', 6, 6'. Then, when the superposed parts of the figure data of the figures 4-6 with the figure 3 are identified, the figure 6 is divided into dividing lithography figures 7-9. Optimum electron beam radiation amounts are applied separately to the divided lithography figures, thereby improving the working accuracy for the lithography figure size.

3. 发明专利

DE602005020391D1 未知
公开(公告)号：DE602005020391D1
公开(公告)日：2010-05-20
申请号：DE602005020391
申请日：2005-02-09
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： G06K19/077 , H01Q1/22 , H01Q7/00 , H01Q9/28 , H01Q19/00
摘要： A radio frequency IC tag and a manufacturing method of the same includes an IC chip on which information is stored, and an antenna for transmitting the information that is stored on the IC chip. In the antenna, a power-feeding part on which the IC chip is mounted extends along a direction in which an electric current flows. Radiation parts are formed so that the width of the radiation parts becomes wider than that of the power-feeding part with respect to the longitudinal axis of the power-feeding part. The radiation parts extend from the power-feeding part, at both sides thereof, along the direction in which the electric current flows.

4. 发明专利

DE602005019339D1 未知
公开(公告)号：DE602005019339D1
公开(公告)日：2010-03-25
申请号：DE602005019339
申请日：2005-12-16
申请人： HITACHI LTD
发明人： SAKAMA ISAO , WATANABE KEIZO , ASHIZAWA MINORU
IPC分类号： G06K19/077 , H01Q1/22 , H01Q1/40 , H01Q9/28
摘要： A wireless IC tag (1) includes an IC chip (11) with a response circuit for receiving a signal sent from an interrogator and transmitting a response signal in response to the received signal, a rectangular antenna (91) connected to the response circuit, a first protective material (14) hard in nature for covering the IC chip (11), and a second protective material (15), softer than the first protective material (14), for covering at least a part of the antenna (91), and the antenna (91) is formed in a laminated structure of a plurality of flat members different in toughness so as not to fracture even when the antenna (91) is bent by external forces.

5. 发明专利

AU2005248925A1 Radio frequency identification tag with improved directivity and coverage distance stability 未知
公开(公告)号：AU2005248925A1
公开(公告)日：2006-11-16
申请号：AU2005248925
申请日：2005-12-23
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： H01Q23/00 , H01Q25/00
摘要： A radio frequency IC tag has wide directivity and is rich in flexibility. A radiation conductor (2) is formed on the entire surface of a dielectric (1) formed of synthetic resin foam and a back conductor (4) is formed on the entire back surface of the dielectric (1). An IC chip (3) is mounted to the radiation conductor (2) on the front side. An L-shaped slit (3a) is formed at the portion of the radiation conductor (2) at which the IC chip (3) is mounted. The radiation conductor (2) and the back conductor (4) have the same size or the size of the back conductor (4) is not greater than twice the size of the radiation conductor (2).

6. 发明专利

AU2005248925B2 Radio frequency identification tag with improved directivity and coverage distance stability 未知
公开(公告)号：AU2005248925B2
公开(公告)日：2007-09-13
申请号：AU2005248925
申请日：2005-12-23
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： H01Q23/00 , H01Q25/00
摘要： A radio frequency IC tag has wide directivity and is rich in flexibility. A radiation conductor (2) is formed on the entire surface of a dielectric (1) formed of synthetic resin foam and a back conductor (4) is formed on the entire back surface of the dielectric (1). An IC chip (3) is mounted to the radiation conductor (2) on the front side. An L-shaped slit (3a) is formed at the portion of the radiation conductor (2) at which the IC chip (3) is mounted. The radiation conductor (2) and the back conductor (4) have the same size or the size of the back conductor (4) is not greater than twice the size of the radiation conductor (2).

7. 发明专利

NO20055985L 未知
公开(公告)号：NO20055985L
公开(公告)日：2006-10-30
申请号：NO20055985
申请日：2005-12-16
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： H04B1/59 , H04B1/03
摘要： The present invention provides a radio frequency IC tag which is excellent in weatherability, dustproofness waterproofness, static protection and the like and capable of making a communication distance long even though each antenna section is made small in configuration. A first antenna equipped with an IC chip is formed on an upper surface of a first spacer. A second antenna is formed on a lower surface of a top cover. A second spacer is shaped in hollow form. The first spacer and the top cover are disposed on both sides of the second spacer with the first antenna and the second antenna being opposite to each other. Each of the first spacer, the second spacer and the top cover is formed of a synthetic resin. Thus, the IC chip and each antenna section are not exposed to the outside and hence weatherability or the like is enhanced. A weak radio wave radiated from the first antenna can be transmitted with being amplified by amplifying action of the second antenna.

8. 发明专利

HK1081726A1 RADIO FREQUENCY IC TAG AND METHOD FOR MANUFACTURING THE SAME 未知
公开(公告)号：HK1081726A1
公开(公告)日：2006-05-19
申请号：HK06101641
申请日：2006-02-08
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： G06K19/077 , H01Q20100101 , H01Q1/22 , H01Q7/00 , H01Q9/28 , H01Q19/00
摘要： A radio frequency IC tag and a manufacturing method of the same includes an IC chip on which information is stored, and an antenna for transmitting the information that is stored on the IC chip. In the antenna, a power-feeding part on which the IC chip is mounted extends along a direction in which an electric current flows. Radiation parts are formed so that the width of the radiation parts becomes wider than that of the power-feeding part with respect to the longitudinal axis of the power-feeding part. The radiation parts extend from the power-feeding part, at both sides thereof, along the direction in which the electric current flows.

9. 发明专利

DE602004031937D1 RF Transponder und Zapfen mit einem RF Transponder 未知
公开(公告)号：DE602004031937D1
公开(公告)日：2011-05-05
申请号：DE602004031937
申请日：2004-12-15
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： G06K19/077

10. 发明专利

DE602006010970D1 未知
公开(公告)号：DE602006010970D1
公开(公告)日：2010-01-21
申请号：DE602006010970
申请日：2006-02-09
申请人： HITACHI LTD
发明人： SAKAMA ISAO , ASHIZAWA MINORU
IPC分类号： G06K19/077 , G06K7/08 , G06K7/10 , G06K17/00

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