专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

MY120334A BUMP FORMATION METHOD 未知
公开(公告)号：MY120334A
公开(公告)日：2005-10-31
申请号：MYPI9803154
申请日：1998-07-10
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS , HITACHI ULSI SYS CO LTD
发明人： YONEDA TATSUYA , KIMOTO RYOSUKE , SUZUKI JUNICHI , INOUE KOSUKE , SUZUKI TAKAMICHI
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/60 , H01L21/68 , H05K3/34
摘要： A METHOD FOR FORMING BUMPS IN AN LSI PACKAGE IN WHICH: SEMICONDUCTOR CHIPS ARE MOUNTED ONTO A FLEXIBLE PRINTED CIRCUIT BOARD; ELECTRICALLY CONDUCTIVE BALLS ARE TEMPORARILY FIXED BY USING ELECTRICALLY CONDUCTIVE PASTE SELECTED FROM FLUX, SOLDER PASTE AND A FIXING LIQUID CONTAINING AN ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, ONTO PADS WHICH ARE PROVIDED ON THE FLEXIBLE PRINTED CIRCUIT BOARD SO AS TO BE ELECTRICALLY CONNECTED TO THE SEMI- CONDUCTOR CHIPS; THE FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE ELECTRICALLY CONDUCTIVE BALLS TEMPORARILY FIXED THERETO IS WOUND UP ONTO A REEL; THE FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE ELECTRICALLY CONDUCTIVE BALLS TEMPORARILY FIXED THERETO IS FED OUT FROM THE REEL AND HEATED TO THEREBY FORM BUMPS THEREON; AND THE FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE BUMPS FORMED THEREON IS WOUND UP ONTO ANOTHER REEL; AND THE FLEXIBLE PRINTED CIRCUIT BOARD IS CLEANSED AND TRIMMED TO THEREBY FORM LSI PACKAGES. (FIGURE 1)

2. 发明专利

SG76549A1 Bump formation method 未知
公开(公告)号：SG76549A1
公开(公告)日：2000-11-21
申请号：SG1998001750
申请日：1998-07-10
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS , HITACHI ULSI SYS CO LTD
发明人： INOUE KOSUKE , YONEDA TATSUYA , SUZUKI TAKAMICHI , KIMOTO RYOSUKE , SUZUKI JUNICHI
IPC分类号： H01L21/60 , H01L21/68 , H05K3/34 , H05K3/30
摘要： An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arranged consecutively on a first tape; and the aggregate also includes a second tape, which is a spacer tape, having spacers (protrusions), provided between adjacent windings of the first tape on the reel, providing spaces for the semiconductor packages. The semiconductor packages can be provided with bumps, e.g., on the side of the first tape opposite the side of the first tape having the semiconductor packages thereon, and the first tape can be a flexible printed circuit board.

3. 发明专利

JPH06142903A SOLDERING DEVICE 失效
公开(公告)号：JPH06142903A
公开(公告)日：1994-05-24
申请号：JP29480492
申请日：1992-11-04
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： SUZUKI JUNICHI
IPC分类号： B23K1/08 , H01L23/50
摘要： PURPOSE:To reduce the generation of the short circuit or the like of a lead and to improve the yield of product by providing a means for interrupting the contact of at least a portion which is not used for solder dip of a molten solder ejected from an ejection hole with the air. CONSTITUTION:Solder coating is executed by bringing the outer lead of a semiconductor device 7 into contact with a molten solder which is ejected from the ejecting hole 6 of an ejecting part 5. A cover 10 for interrupting the contact of at least the portion which is not used for solder dip of the molten solder with the air is provided. An inert gas is introduced into a solder dip part. When the semiconductor device is not provided, a driving mechanism for moving the cover 10 so as to cover the entire area of the upper part of the ejection hole is provided. The cover 10 is made of such a material of titanium, tungsten, or molybdenum. Thus, the generation of oxide due to the reaction between solder and oxygen is reduced and the generation of the short circuit or the like of the lead is prevented.

4. 发明专利

JPH11330107A METHOD AND DEVICE FOR WET-TREATING LONG MATERIAL 失效
公开(公告)号：JPH11330107A
公开(公告)日：1999-11-30
申请号：JP15355898
申请日：1998-05-18
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： TOYOOKA MORIO , SUZUKI JUNICHI , ISHIOKA MASATO
IPC分类号： H01L21/304 , H01L21/50 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To improve the efficiency of cleaning work for a TCP.IC carrier. SOLUTION: A supply reel 27 for a carrier 1 is arranged on the outside of a detergenet cleaning tank 21, a take-up reel 28 for the cleaned carrier 1 is arranged on the outside of a water cleaning tank 25, and drive rollers 29 are arranged around respective reels 27, 28 and respective tanks 21, 25. Guide rollers 30 are arranged in the tanks 21, 25 and supported by a lifting driver 31 so as to be arbitrarily rotatable. The driver 31 is controlled so that the moving speed of the carrier 1 following the lift of the rollers 30 corresponds to the passing speed of the carrier 1 through the tanks 21, 25. Since the guide rollers 30 are arranged on the upper parts of the tanks 21, 25 and the carrier 1 is wound around the drive rollers 29 and the guide rollers 30, the new/old substitution work time of the supply reel 27 fan be shortened. Since the carrier 1 is cleaned also at the lifting of the guide rollers 30, working time can be shortened.

5. 发明专利

JPH05136282A LASER MARKING METHOD AND DEVICE 失效
公开(公告)号：JPH05136282A
公开(公告)日：1993-06-01
申请号：JP32520491
申请日：1991-11-13
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： SUZUKI JUNICHI
IPC分类号： H01L23/00
摘要： PURPOSE:To automatically inspect appearance of an actual mark which is actually marked by laser based on an image by preparing the image of a mark which is actually marked by laser. CONSTITUTION:When a package 2 is irradiated with laser, a TV camera 28 for photographing a laser irradiation part in the package is provided and an image processing device 29 is provided which prepares an image 33 of a mark 32 which is actually marked by laser based on a photographing signal of the TV camera 28. The image 33 of the mark 32 which is actually marked by laser can be thereby prepared based on a photographing signal of light emission of a laser irradiation part in the package 2; therefore, it is possible to automatically inspect appearance of the mark 32 which is marked by laser based on the mark image 33.

6. 发明专利

JPH11330106A CLEANING DEVICE AND CLEANING METHOD USING THE SAME 失效
公开(公告)号：JPH11330106A
公开(公告)日：1999-11-30
申请号：JP15355798
申请日：1998-05-18
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： TOYOOKA MORIO , SUZUKI JUNICHI
IPC分类号： H01L21/304 , H01L21/50
摘要： PROBLEM TO BE SOLVED: To reusing of a cleaning solution by circulating and reproducing it by simple structure and operation management. SOLUTION: The cleaning device is provided with a water cleaning tank 21 storing pure water 22 for cleaning a TCP.IC carrier 1, a pump 32 for pumping out the pure water 22 from the tank 21, an evaporation tank 34 for storing and evaporating the pure water 22 pumped out from the pump 32, a condensate pump 40 for storing and condenstating vapor 27 from the tank 34, an ejector pump 42 for pumping up condensated water 28 in the tank 40 by reducing pressure, and a vacuum tank 52 for storing pumped-up condensed water and supplying the water to the tank 21. A steam forced exhausing route 54 is connected between the tank 52 and the discharge route 33 of the pump 32. Consequently, pure water is cleaned by steam, returned to the tank 21 and circulatingly reused. When the pressure of the evaporation tank 34 is reduced, a boiling point is lowered, and energy efficiency is improved. Reduction in pump efficiency can be prevented by supplying pure water to the vacuum tank 52 and discharing steam.

7. 发明专利

JPH0872088A MOLDING MACHINE AND REPLACING METHOD FOR CHASE BLOCK USED THEREFOR 失效
公开(公告)号：JPH0872088A
公开(公告)日：1996-03-19
申请号：JP21438994
申请日：1994-09-08
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： SUZUKI JUNICHI , NAMIKI KATSUSHIGE , IIZUKA KATSUHIRO
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29L31/34 , H01L21/56
摘要： PURPOSE: To increase the clearance between a chase block and a movable block at the time of replacing and to facilitate the replacement by moving on a die set at the time of replacing the chase block and moving the movable block for pressing to the reference surface of a center block to be fixed at the time of fixing by moving means. CONSTITUTION: At the time of replacing a chase block, a movable block 7 which presses a chase block 4 by an air cylinder 8 is moved in a direction for separating from the block 4. Since the block 7 is installed in the state that a fixed block 7a mounted at the chase block installing surface 3a of a die set 3 is held, the block 7 is smoothly moved on the surface 3a, and a clearance between the block 4 and the block 7 is increased, and hence the chase block can be easily taken out. At the time of mounting a new chase block 4, the block 4 is pressed to a stopper block and the reference surface 5b of a center block 5.

8. 发明专利

JPH0813198A ELECTRODE FOR CONTACT CONDUCTION AND APPARATUS FOR PRODUCING SEMICONDUCTOR USING THE SAME 失效
公开(公告)号：JPH0813198A
公开(公告)日：1996-01-16
申请号：JP15214594
申请日：1994-07-04
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： NASU SHIGENORI , SUZUKI JUNICHI
IPC分类号： C25D17/08 , C25D17/10 , H01L21/306 , H01L23/50
摘要： PURPOSE:To provide a technique capable of eliminating the influence of a working environment, such as plating adhesion on the electrode parts of an electroplating device, on the electrodes. CONSTITUTION:Covers 5 having tight contact parts 5c which come into tight contact with objects 4 and elastic parts 5b which energize these objects at the time of pressing these tight contact parts 5c to the electrodes are mounted at the electrodes 1 for contact conduction which are pressed to the objects 4 and have contact points 3 for electrically conducting the objects 4. These contact points 3 are housed within the spaces formed by these covers 5. The contact parts 5c are energized and adhere to the surface of objects 4 by deformation of the elastic parts 5b at the time of contacting with the electrode. AS a result, the contact points 3 are enclosed by the covers 5 and the objects 4 and do not come into contact with the working environment. The influence of the working environment on the electrodes is thereby eliminated. The adhesion of the electrodeposits on the electrode parts at the time of, for example, electroplating, is prevented and the maintenance frequencies of the electrodes are decreased.

9. 发明专利

JPH07241888A GATE BREAK 失效
公开(公告)号：JPH07241888A
公开(公告)日：1995-09-19
申请号：JP3550794
申请日：1994-03-07
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS , M TEX MATSUMURA KK
发明人： SUZUKI JUNICHI , IKEDA NOBUYOSHI , KUDO KAZUHITO
IPC分类号： B29C45/02 , B29C45/38 , H01L21/56
摘要： PURPOSE:To reduce inferior resin seal elements in gate break by bending the resin seal element against a gate runner resin, and forming cracking between one side of the resin seal element and the gate runner resin. CONSTITUTION:A conveying member 6 is lowered, a cull 1 is fixed onto a cull receiving base 7, and a resin seal element 4 is brought into contact with a pre-crack member 8. The contact surface with the pre-crack member 8 is formed into a smoothly curved shape (semicylindrical shape) toward the cull 1, so the resin seal element 4 is bent against a gate runner resin 2, and cracking occurs between one side 3 of the resin seal element 4 and the gate runner resin 2. Bending of the resin seal element 4 is carried out within the elastic limit of a lead frame 5. Next, a frame receiving base 9 is raise, and the lead frame 5 is supported by the frame receiving base 9. The frame receiving base 9 is raised further, and the gate runner resin 2 is gate-broken from one side 3 of the resin seal element 4 to be removed.

10. 发明专利

JPH053261A LASER MARKING APPARATUS 失效
公开(公告)号：JPH053261A
公开(公告)日：1993-01-08
申请号：JP18039091
申请日：1991-06-25
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS , EMUTETSUKUSU MATSUMURA KK
发明人： SUZUKI JUNICHI , TAKAHASHI TOSHIHIKO
IPC分类号： H01L23/00
摘要： PURPOSE:To prevent a mark deviation or a marking miss in a title apparatus. CONSTITUTION:A structure is such that drive of a multiple lead frame l as the work is executed by a pulse motor 14, and radiation timing of a laser beam 21 by the number of pulse signals from the pulse motor 14. Feed operation of the multiple lead frame and radiation timing of the laser beam 21 can be synchronized accurately, so that a resin sealed package 2 as the marking work on the multiple lead frame 1 can be marked with the laser beam 21 accurately with neither miss nor positional deviation.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式