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1. 发明专利

JPH07136580A FORMATION OF COATING FILM 失效
公开(公告)号：JPH07136580A
公开(公告)日：1995-05-30
申请号：JP10514994
申请日：1994-05-19
申请人： HITACHI TOKYO ELECTRONICS , HITACHI LTD
发明人： ISHIOKA MASATO , MAKI TAKUMI , YAMAJI OSAMU
IPC分类号： G03F7/16 , B05C11/08 , B05D1/40 , H01L21/027
摘要： PURPOSE:To form an excellent coating film with a high thickness precision. CONSTITUTION:A wafer 4 to be coated is rotated at a low speed, an air current 17 is formed around the wafer 4, and a resist 15 as a coating agent is dripped on the wafer 4. The wafer 4 is then rotated at a high speed, the air current 17 is formed only at the initial stage, and then the formation of the air current 17 is stopped to form a resist coating film 16. Further, the wafer 4 is rotated at a moderate speed, the air current 17 is formed, a trimming solvent 18 is sprayed on the outer edge of the wafer 4 which is trimmed. Consequently, an excellent resist coating film 16 is formed on the wafer 4 surface with a high thickness precision.

2. 发明专利

JPS61125017A Coating apparatus 失效
标题翻译：涂装装置
公开(公告)号：JPS61125017A
公开(公告)日：1986-06-12
申请号：JP24592884
申请日：1984-11-22
申请人： Hitachi Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： KAJIWARA HISASHI , ISHIOKA MASATO , SAKURAI TOSHIHIKO
IPC分类号： B05C11/08 , G03F7/16 , H01L21/027 , H01L21/30
CPC分类号： H01L21/30
摘要： PURPOSE:To improve uniformity of thickness of a coated film, by providing a solution supplying section with a temperature keeping means, and by keeping at a constant temperature the solution supplied to a member to be coated. CONSTITUTION:A wafer 4 being fixed on the spinner 2 is rotated at a given revolution while the coating cup 1 is exhausted through a exhausting nozzle 12. Next, a predetermined quantity of photo resist 10 is dripped on the upper central section of the wafer 4 from a dripping nozzle 11, and the photo resist 10 is dispersed over the entire face of the wafer 4 by the centrifugal force. In this case, the photo resist 10 becomes the same temperature as that of fluid in the liquid jacket while the photo resist 10 is flowed through the pipe 8, and is kept at the uniform temperature. Accordingly, rate of organic solvent volatilizing from the photo resist 10 on the wafer 4 becomes constant, viscosity of the photo resist 10 is made uniform, and therefore dispersion of the photo resist 10 on the wafer 4 becomes uniform.
摘要翻译：目的：为了提高涂膜的厚度均匀性，通过向溶液供给部提供温度保持机构，并且通过将恒温保持供给到待涂布的部件。构成：将固定在旋转器2上的晶片4以给定的转速旋转，同时通过排气喷嘴12排出涂覆杯1.接下来，将预定量的光致抗蚀剂10滴在晶片4的上部中心部分上由滴液喷嘴11将光刻胶10分散在晶片4的整个表面上。在这种情况下，当光致抗蚀剂10流过管8时，光致抗蚀剂10变得与液体夹套中的流体相同，并保持在均匀的温度。因此，从晶片4上的光致抗蚀剂10挥发的有机溶剂的比例变得恒定，使光致抗蚀剂10的粘度均匀，因此光致抗蚀剂10在晶片4上的分散变得均匀。

3. 发明专利

JPS63260130A WAFER TREATMENT APPARATUS 失效
公开(公告)号：JPS63260130A
公开(公告)日：1988-10-27
申请号：JP9309287
申请日：1987-04-17
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： YAMAGAMI TAKASHI , MIYAMOTO KOICHI , ISHIOKA MASATO , HAMA SEIJI , ITO HIROAKI
IPC分类号： B05C11/08 , G03F7/16 , H01L21/027 , H01L21/30
摘要： PURPOSE:To make an apparatus compact and to improve the reliability and the yield rote of semiconductor elements, by providing a diaphragm, which covers an exhaust port and constitutes an exhausting flow path along the entire outer surface of a wafer at the lower side of the wafer, and uniformly dispersing negative pressure at the lower side of the diaphragm at the time of exhaustion. CONSTITUTION:A wafer 2 is sucked with vacuum on a spin chuck 3. Resist is dropped through a resist dropping nozzle 6. The wafer 2 is rotated at a high speed with a motor 4. The resist dropped on the wafer 2 is radially expanded uniformly along the direction of the radius of the wafer with eccentric force. At this time, gas in an applying cup 1 is exhausted through an exhaust port 1d. Negative pressure, which is yielded at the time of exhaustion, is uniformly dispersed at the lower side of the diaphragm 11. The exhaustion of the inside of the treating cup 1 is carried out through an exhaust flow path, which s formed along the entire outer surface of the wafer with the dispersed negative pressure. The exhausting speed in the treating cup is made uniform in this way, and the flow rate of exhaustion can be reduced. As a result, the apparatus is made compact and the reliability and the yield rate o+ semiconductor elements are improved.

4. 发明专利

JPS5764949A Continous processor 失效
标题翻译：连续处理器
公开(公告)号：JPS5764949A
公开(公告)日：1982-04-20
申请号：JP14045480
申请日：1980-10-09
申请人： Hitachi Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： NANKOU SUSUMU , MAEJIMA HIROSHI , NOMURA KEIZOU , ISHIOKA MASATO
IPC分类号： H01L21/30 , H01L21/00 , H01L21/027 , H01L21/677 , H01L21/68
CPC分类号： H01L21/67276 , H01L21/67259 , H01L21/68
摘要： PURPOSE:To continously perform the different processings of a processing index by providing a stocker before a stopping position temporarily and accommodating tentatively a work. CONSTITUTION:A wafer 2 is fed to a photosensitive processor 1, is then processed, and is thereafter fed to a stocker 6. Four belt conveyors 7 are sequentially moved, the wafer 2 is temporarily stopped at the end of a conveyor 5 and when a vacant is produced at a development processor 3, the wafer 2 is automatically fed to the processor 3. After the wafer is processed, it is fed to the next step. The existence or absence of the wafer is detected by a pair of light emitting unit and photodetector in each belt conveyor 7 and the conveyor 5 of the stocker, and the information is fed to a mechanism. Since this configuration has a preliminary wafer, the processor 3 is not stopped even if the processor 1 is temporarily stopped to clean and exchange the mask. Since the processor 3 is slow in the processing index but the wafer 2 is contained in the stocker 6, the processor 1 is continously operated without stoppage.
摘要翻译：目的：通过临时提供储存者暂时停止处理工作指标，并暂时适应工作，持续执行加工指标的不同处理。构成：晶片2被馈送到光敏处理器1，然后被处理，然后被供给到储料器6.四个带式输送机7依次移动，晶片2在传送带5的端部暂时停止，并且当一个在显影处理器3处产生空白，晶片2被自动馈送到处理器3.在处理晶片之后，将其馈送到下一步骤。每个带式输送机7和储料器的输送机5中的一对发光单元和光电检测器检测晶片的存在或不存在，并将信息馈送到机构。由于该配置具有初步晶片，即使处理器1暂时停止以清洁和更换掩模，处理器3也不会停止。由于处理器3处理索引较慢，而晶片2被包含在储存器6中，所以处理器1不间断地运行。

5. 发明专利

JPH11297770A CONDUCTIVE BALL LOADING DEVICE 失效
公开(公告)号：JPH11297770A
公开(公告)日：1999-10-29
申请号：JP10463198
申请日：1998-04-15
申请人： HITACHI VIA MECHANICS LTD , HITACHI TOKYO ELECTRONICS , HITACHI LTD
发明人： KITAMURA KONOSUKE , NAITO YOSHITATSU , SUZUKI HIROMITSU , TSUCHIYA AKIRA , ISHIOKA MASATO , YONEDA TATSUYA
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide the loading device of a conductive ball, the productivity of which is high without imparting more than the required pressurizing force and heat shock of to a package. SOLUTION: A loading device is formed of the tape carrier 3 of a loader-side winding out a tape 2 which supports a package 1 at a prescribed interval, the tape carrier 4 of an unloader-side winding the tape 2, after a solder ball 76 has been loaded on the package 1, a tape transfer device which intermittently transfers the tape from the tape carrier 3 to the tape carrier 4, a CCD camera 89 which detects the attitude of the package 1 positioned in a loading position, a supply box 77 of the conductive ball 76, a flux supply means 78, and a loading jig 71 which is supported by a transportation means 75 in the directions of X, Y and Z and has a mask 74, where a plurality of absorption holes are formed on a lower face in an array similar to the electrode pattern of the package 1.

6. 发明专利

JPS6378536A COATING EQUIPMENT 失效
公开(公告)号：JPS6378536A
公开(公告)日：1988-04-08
申请号：JP22186986
申请日：1986-09-22
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： AMADA HARUO , ISHIOKA MASATO , MIYAMOTO KOICHI , SATO NOBUAKI , IINO TOSHIYOSHI , SAKAMOTO YUZABURO , MURAMATSU KIMIO , YAMAJI OSAMU , KUROIWA KEIZO
IPC分类号： B08B3/02 , H01L21/304
摘要： PURPOSE:To apply a photo-resist in uniform thickness by disposing an approaching plate at a position where a coating liquid scattered by the centrifugal force of the upper section and lower section of a spin chuck, on which a wafer is placed and which is turned, does not reach and is not reflected directly. CONSTITUTION:An applicator is formed in structure in which a clean gas is sprayed forcibly from the upper section and lower section of a spin chuck 2, on which a wafer 1 to be treated is placed and which is rotated. Approaching plates 5, 6 are mounted at positions where a coating liquid scattered by centrifugal force does not reach and is not reflected directly on the upper surface and lower surface of the spin chuck 2 while the gas does not form stagnation on the surface and rear sides of the wafer 1 and is discharged as a laminar flow. The temperature of the gas 11 supplied is controlled, and an exhaust mechanism exhausts the gas 11 in a treating chamber by ejector action. Accordingly, a photo-resist film, on which no foreign matter adhere and which has uniform thickness, can be acquired.

7. 发明专利

JPH11330107A METHOD AND DEVICE FOR WET-TREATING LONG MATERIAL 失效
公开(公告)号：JPH11330107A
公开(公告)日：1999-11-30
申请号：JP15355898
申请日：1998-05-18
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： TOYOOKA MORIO , SUZUKI JUNICHI , ISHIOKA MASATO
IPC分类号： H01L21/304 , H01L21/50 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To improve the efficiency of cleaning work for a TCP.IC carrier. SOLUTION: A supply reel 27 for a carrier 1 is arranged on the outside of a detergenet cleaning tank 21, a take-up reel 28 for the cleaned carrier 1 is arranged on the outside of a water cleaning tank 25, and drive rollers 29 are arranged around respective reels 27, 28 and respective tanks 21, 25. Guide rollers 30 are arranged in the tanks 21, 25 and supported by a lifting driver 31 so as to be arbitrarily rotatable. The driver 31 is controlled so that the moving speed of the carrier 1 following the lift of the rollers 30 corresponds to the passing speed of the carrier 1 through the tanks 21, 25. Since the guide rollers 30 are arranged on the upper parts of the tanks 21, 25 and the carrier 1 is wound around the drive rollers 29 and the guide rollers 30, the new/old substitution work time of the supply reel 27 fan be shortened. Since the carrier 1 is cleaned also at the lifting of the guide rollers 30, working time can be shortened.

8. 发明专利

JPS612614A AIR-FLOAT WAFER CARRY PATH 失效
公开(公告)号：JPS612614A
公开(公告)日：1986-01-08
申请号：JP12252785
申请日：1985-06-07
申请人： HITACHI LTD , HITACHI TOKYO ELECTONICS KK
发明人： YANAGISAWA HIROSHI , HASEGAWA NOBUO , SUZUKI MICHIO , ISHIOKA MASATO , NAGATOMO HIROTO
IPC分类号： B65G49/07 , B65G51/03 , H01L21/67 , H01L21/677
摘要： PURPOSE:To reduce the spatial occupation of carry path by making air-holes for carrying in both left and right directions in the wafer carry path. CONSTITUTION:Air-holes 21, 22 for blowing out the air are made in both left and right directions then air for left or right direction carrying is fed under time sharing contol to carry Si wafer bilaterally thus to reduce the spatial occupation.

9. 发明专利

JPS6045944B2 失效
公开(公告)号：JPS6045944B2
公开(公告)日：1985-10-12
申请号：JP22684483
申请日：1983-12-02
申请人： HITACHI LTD
发明人： ISHIOKA MASATO , SHIGYO YOSHIHARU
IPC分类号： B05B7/04 , B05B7/06 , H01L21/306

10. 发明专利

JPS5258459A VERTICAL HEATING FURNACE 失效
公开(公告)号：JPS5258459A
公开(公告)日：1977-05-13
申请号：JP13405375
申请日：1975-11-10
申请人： HITACHI LTD
发明人： ISHIOKA MASATO , YAMAGUCHI SHINICHI , NANKOU SUSUMU , MAEJIMA HIROSHI
IPC分类号： H01L21/22 , H01L21/20 , H01L21/31
摘要： PURPOSE:Air flow temperature is made even and the reduction in the size of the apparatus is achieved by providing an auxiliary chamber, fan and wind plate and swirling the air current within the furnace center.

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