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1. 发明专利

JPH01187841A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01187841A
公开(公告)日：1989-07-27
申请号：JP1073388
申请日：1988-01-22
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD , HITACHI MICROCUMPUTER ENG
发明人： OBATA KAZUHIKO , NISHI KUNIHIKO , NISHIDA TAKAFUMI , TANAKA AKIRA , KIMOTO RYOSUKE
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To reduce cracks at a resin sealing part by so forming the shape of a tab as to improve the adhesive properties of the tab with the boundary of a resin and to alleviate a stress concentration at the time of allowing the solder of a lead to reflow or temperature cycle. CONSTITUTION:The tab 1 of the lead frame of a resin-sealed semiconductor device is formed in a-shaped metal thin plate structure. Thus, since the lower face of a pellet 1 placed on the tap 1 is almost exposed, a boundary between the pellet and the resin 5 is also formed on the lower face of the pellet 2, the area of an effective tab 1 is reduced, thereby alleviating a generated stress. Accordingly, the adhesive properties of both can be improved, and a stress concentration at the time of allowing the solder of an outer lead 3B to flow or temperature cycle can be moderated. Thus, a gap at the boundary between the pellet 2 and the resin 5 can be reduced. As a result, since the cracks of the sealing part of the resin 5 can be reduced, the reliability of a resin-sealed semiconductor device can be improved.

2. 发明专利

JPH02198148A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH02198148A
公开(公告)日：1990-08-06
申请号：JP1614989
申请日：1989-01-27
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD , HITACHI DEVICE ENG
发明人： KANNO TOSHIO , NAGAOKA KOJI , TSUKUI SEIICHIRO , WAKASHIMA YOSHIAKI , TANIMOTO MICHIO , WATANABE MASAYUKI , SAKAGUCHI MASARU , NISHI KUNIHIKO , KANEDA AIZO , SERIZAWA KOJI , HONDA MICHIHARU , YOSHIDA TORU , KOMARU TAKESHI , NAKAMURA ATSUSHI
IPC分类号： H01L25/18 , H01L21/60 , H01L25/10 , H01L25/11 , H05K1/18 , H05K3/34
摘要： PURPOSE:To obtain a semiconductor device with a higher mounting density by a method wherein a connector on which a wiring pattern is formed is provided at the position of an outer lead formed by a tape automated bonding(TAB) method and a plurality of semiconductor chips are piled. CONSTITUTION:The connector 9a of a semiconductor chip 15a with a connector on a lowest stage is formed on a substrate 20 made of glass epoxy and having a rear pattern 11a and electrically connected to a wiring pattern 19 formed by Cu-Sn plating or the like with solder through a third connection layer 18. A semiconductor chip 15 with a connector on a second lowest stage is electrically connected to the semiconductor chip 15a with the connector with solder or the like through a second connection layer 14b. By piling and mounting a plurality of film-carriered semiconductor chips like this, a memory capacity which is a result of multiplying the capacity of each chip by the number of chips can be easily obtained with the conventional mounting area. With this constitution, a high density mounting type package can be obtained.

3. 发明专利

JPH04269854A SEMICONDUCTOR DEVICE; ITS MANUFACTURE; MOLDING APPARATUS USED FOR IT 失效
公开(公告)号：JPH04269854A
公开(公告)日：1992-09-25
申请号：JP5330091
申请日：1991-02-25
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： YAMADA TOMIO , NAKAMURA ATSUSHI , NISHI KUNIHIKO , YAMAZAKI KAZUO , OKA HIROTAKE , KOIZUMI KOJI , SAEKI JUNICHI
IPC分类号： H01L21/56 , H01L23/28
摘要： PURPOSE:To provide a molding technique which can prevent a bonding wire from flowing by a resin. CONSTITUTION:A gate 38 is formed in such a way that it is directed in a direction toward the radial center of wires 26; an air vent 42 is opened in a position farthest the gate 38 at a cavity 40. Thereby, a resin 47 which has been pressed into the cavity 40 from the gate 38 is set to a state that it flows in the radial direction along the wires 26. As a result, at the group of the wires 26 situated at four corners of a pellet 24, it is possible to prevent a phenomenon that the wires 26 flow to the transverse direction (a wire arch collapses transversely) due to the flow of the resin 47, and it is possible to prevent a short circuit defect by wires at the group of the wires 26 situated at the four corners of the pellet 24.

4. 发明专利

JPH01270254A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01270254A
公开(公告)日：1989-10-27
申请号：JP9813288
申请日：1988-04-22
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： YASUHARA TOSHIHIRO , MASUDA MASACHIKA , MURAKAMI HAJIME , NISHI KUNIHIKO , SAKIMOTO MASAKAZU , SHIMIZU KAZUO , NAGAMINE TORU , OKADA SUMIO , HOSHI AKIRO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To reduce separation of resin sealing part from a tab part rear face and prevent generation of cracks in the resin sealing part by providing an opening in the central part of the tab part. CONSTITUTION:At the central part of a tab part 11 of a resin sealed type semiconductor device is provided an opening 11a to check cutting of resin and separation of resin from the rear face of a tab part 11, and at the surface of the tab part 11 where the opening 11A is provided is provided a groove part 11C to check flow-out of adhesive 1 from the surface of the tab part 11. Also, at the central part of the long side of the tab part 11 are provided tab suspending leads 14A-14F to check cutting of the resin and separation of the resin from the rear face of the tab part 11. Hereby, separation of a resin sealing part 4 from the rear face of the tab part 11 is reduced and generation of cracks is prevented.

5. 发明专利

JPS6328616A MOLDING EQUIPMENT 失效
公开(公告)号：JPS6328616A
公开(公告)日：1988-02-06
申请号：JP17167086
申请日：1986-07-23
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： KAMEOKA AKIHIKO , ITO FUJIO , NISHI KUNIHIKO , TABATA KATSUTADA
IPC分类号： H01L21/56 , B29C45/02 , B29C45/14 , B29C45/26 , B29L31/34
摘要： PURPOSE:To uniformize the quality of molded products by uniformize the pressure of resin sent under pressure from pots to respective cavities by a method wherein a plurality of pots are connected to one another by communicating passages. CONSTITUTION:The cylinders 6, 6... of a plurality of pots 4, 4... are connected to one another by communicating passages 10. Resin tablets R are charged in the pots 4, 4... and respective plungers 7, 7... are simultaneously driven by a driving mechanism 8. The resin tablet R in each pot 4 is pressed by the plunger 7 and sent under pressure through a runner 5 to each cavity 3. In this time, because the interiors of the cylinders 6, 6... of a plurality of the pots 4, 4... are connected to one another by the communicating passage 10, the resins in the respective pots 4 uniformly flow through the communicating passages 10, even if the weights of the respective resin tablets R and the pressing force applied to the tablets differ from one another, resulting in uniformizing the resin in the respective cavities 3 and consequently obtaining molded products having uniform quality.

6. 发明专利

JPS6082316A MOLDING APPARATUS 失效
公开(公告)号：JPS6082316A
公开(公告)日：1985-05-10
申请号：JP19077283
申请日：1983-10-14
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： ITOU FUJIO , WAKASHIMA YOSHIAKI , KOIZUMI KOUJI , NISHI KUNIHIKO
IPC分类号： H01L21/56 , B29C45/02 , B29C45/03 , B29C45/46
摘要： PURPOSE:To facilitate the loading of a resin tablet into a pot, and to make a plunger mechanism simple and small-sized, by loading a resin tablet into the pot via a passage that is formed in one side of the pot and is open to a loading port. CONSTITUTION:A plunger 19 in a pot 17 is moved to the uppermost position in the pot and an air source 22 is actuated. A resin tablet 16A located in the lowest position is delivered by the air pressure from the air source 22 into a passage 21, and is loaded into the pot 17 via a loading port 20 formed in the pot 17. Therefore, every time the resin tablet 26 is loaded, it is not required that the plunger 19 is withdrawn over the pot 17, accordingly the amount of stroke of the plunger 19 can be reduced, the operation and mechanism of the plunger can be simplified, and the loading efficiency of the resin tablet can be improved.

7. 发明专利

JPH02250336A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02250336A
公开(公告)日：1990-10-08
申请号：JP7066289
申请日：1989-03-24
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： NAKAMURA ATSUSHI , NISHI KUNIHIKO , HOSHINO KEIKO
IPC分类号： H01L21/56
摘要： PURPOSE:To enhance a quality without making a thermal curing time long and without a foaming trace of a liquid sealing material by a method wherein, when the liquid sealing material of a semiconductor chip is hardened thermally, this liquid sealing material is heated from the rear side of the semiconductor chip. CONSTITUTION:The surface and side faces of a semiconductor chip 4 of a so-called TAB by which the semiconductor chip 4 is bonded to inner leads 2 extended from a tape 1 via bumps 3 are coated with a liquid sealing material (resin) 5. The liquid sealing material 5 is heated from the rear side of the semiconductor chip 4. Accordingly, even when a temperature of a heat source 16 is set to a hardening temperature from the beginning, the surface 5a on the side of the semiconductor chip 4 of the liquid sealing material 5 does not reach the hardening temperature immediately; by this action, a foaming operation is completed from the surface 5a while the surface 5a on the side of the semiconductor chip 4 of the liquid sealing material 5 is soft. Thereby, a foaming trace of the liquid sealing material 5 can be eliminated without making a thermal hardening time long; a quality can be enhanced.

8. 发明专利

JPS61290016A METAL MOLD 失效
公开(公告)号：JPS61290016A
公开(公告)日：1986-12-20
申请号：JP13182285
申请日：1985-06-19
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD , AKITA DENSHI KK
发明人： ITO FUJIO , KUSANAGI YOSHITOMO , YASUHARA TOSHIHIRO , WAKASHIMA YOSHIAKI , NISHI KUNIHIKO
IPC分类号： H01L21/56 , B29C45/02 , B29C45/14 , B29C45/53 , B29C45/58 , B29K101/10 , B29L31/34 , H01L21/02
摘要： PURPOSE:To prevent the occurrence of voids in molding resin, by making the diameter of the top part of a plunger used for pressing a resin smaller than the diameter of the plunger main body. CONSTITUTION:A plunger 1 is cylindrical and a chamfering part 3 is formed on the periphery of its top part. A metal mold consists of a top force 4 and a bottom force 5, and a cavity 6 and a runner 7 for molding are formed between them. A pot 8 for supplying a resin for molding is formed in the top force. Resin tablets are filled in the pot 8 and when the resin are pressed by the plunger 1, the contact of the plunger with the resin tablets does not occur at the surroundings of the top part of the plunger because the top part is smaller than the diameter of the plunger 1 main body. The whole uppermost surfaces of the tablets are softened as the surroundings of the tablets are not therefore directly heated by the plunger 1. It is avoided that the softened resin blocks the outlet port of the air located in between tables and the wall of the pot.

9. 发明专利

JPH0485837A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0485837A
公开(公告)日：1992-03-18
申请号：JP19846290
申请日：1990-07-26
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TSUBOSAKI KUNIHIRO , TANIMOTO MICHIO , NISHI KUNIHIKO , ICHITANI MASAHIRO , KOIKE SHUNJI , SUZUKI KAZUNARI , KIMOTO RYOSUKE
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To obtain an ultra-thin package which can contain a large semiconductor chip by a constitution in which a lead is secured onto the circuit forming face of a semiconductor through an insulating adhesive layer and extented to the rear surface of the semiconductor chip to be secured in place through an insulating adhesive layer. CONSTITUTION:A lead frame provided with an insulating adhesive film 2 is mounted on the circuit forming face of a semiconductor chip 1 having a solder bump electrode 4 and press bonded by means of a heating block thus adhering the insulating adhesive film 2 onto the circuit forming face of the semiconductor chip 1 and bonding the inner lead 3A of a lead 3 to the bump electrode 4 of the semiconductor chip 1. The outer lead 3B of the lead 3 is then bent at the tip thereof and further bent in parallel with the side of the semiconductor chip 1 by means of a roller or the like thus thermocompressing an insulating adhesive film 7 to the rear surface of the semiconductor chip 1. A resin block member 5 is then formed on the circuit forming face of the semiconductor chip 1, liquid resin is dripped and cured, thus completing a package. According to the constitution, the package can be fabricated with dimensions substantially same as those of the semiconductor chip.

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