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    • 3. 发明专利
    • MOLDING METHOD AND MOLDING MACHINE
    • JPS6097817A
    • 1985-05-31
    • JP20479383
    • 1983-11-02
    • HITACHI LTD
    • KOIZUMI KOUJI
    • B29C45/02B29C45/00B29C45/14B29C45/26B29C45/40B29L31/34
    • PURPOSE:To balance flows of molding material and consequently prevent void and the like from developing within a molded part by a method wherein members to control the flows of molding material in a cavity are protruded at the early stage of pouring of the molding material. CONSTITUTION:Ejector pins 10 are protruded in a cavity 3 at the early stage of pouring of high viscous molding material into the cavity 3. As a result, the flow passage resistance is increased by the ejector pin 10 near the spouting port of a gate 4, resulting in reducing the flow speed and lowering the pressure and the like of the molding material flowed from the gate 4 in the lower space of the cavity 3. Because the flows of the molding material are controlled as mentioned above, the flow of the molding material in the lower space balances with that in the upper space of the cavity 3. Accordingly, the development of void and the deformation of a lead frame and the like, all of which are caused by the unbalance between the flows of molding material, are prevented from occurring.
    • 6. 发明专利
    • Molding apparatus
    • 成型设备
    • JPS60189227A
    • 1985-09-26
    • JP4402084
    • 1984-03-09
    • Hitachi Ltd
    • TABATA KATSUHIROKOIZUMI KOUJI
    • B29C39/02B29C45/14B29C45/34H01L21/56
    • B29C45/34B29C45/14655H01L2224/48091H01L2224/48247H01L2924/00014
    • PURPOSE:To control internal pressure resistance against flow of molding material into each cavity and to prevent over filling or under filling owing to variation of distance between each cavity and a pot, by causing each cross-sectional area of air vents of the cavities to differ from one another. CONSTITUTION:After semiconductor devices 11 to be packaged are set, melting resin 6 is transferred into a runner 8 by lowering a plunger 5. The resin is flowed into each cavity 3 through each gate 9 and air in each cavity 3 is pushed out of each cavity 3 through each air vent 10. Each depth Da-Dc of the air vents 10a-10c of the cavities 3a-3c which is spaced away from the pot gradually, is made so as to become Da
    • 目的:为了控制内部压力阻力,防止模制材料流入每个空腔,并且由于每个腔体和罐之间的距离的变化而防止过度填充或填充,通过使空腔的通风口的每个横截面积不同 从彼此。 构成:在要封装的半导体装置11之后,通过降低柱塞5将熔融树脂6转移到流道8中。树脂通过每个浇口9流入每个空腔3,并且每个空腔3中的空气被推出每个 空腔3通过每个排气口10.逐渐地与锅间隔开的空腔3a-3c的通气孔10a-10c的每个深度Da-Dc被制成为Da
    • 7. 发明专利
    • Heating device
    • 加热装置
    • JPS59187808A
    • 1984-10-25
    • JP6211983
    • 1983-04-11
    • Hitachi LtdHitachi Micro Comput Eng Ltd
    • ITOU FUJIOSUZUKI AKIRAKOIZUMI KOUJI
    • B29C35/12B29B9/00B29B13/00B29B13/02B29B13/08B29C45/02B29L31/34H01L21/56
    • B29B13/02
    • PURPOSE:To obtain a heating device capable of discharging air effectively from a tablet in a pot by making field intensity larger in the middle of the tablet than at both ends thereof and heating the middle of the tablet at a higher temperature than both ends thereof. CONSTITUTION:The upper electrode 26 is arranged above and nearly in parallel to the lower electrode 11 and the projection of an auxiliary electrode 28 is maximized in the middle 28a and reduced gradually toward both ends 28b, 28b. Rollers 12, 13 are rotated by a motor 22 to revolve the tablets 23, 24, high frequency power is applied between the upper and the lower electrode 26, 11 and the middle part of the tablets united 23, 24 in the longitudinal direction is heated at a higher temperature than both ends. When the tablets 23, 24 are compressed in the pot 8, they change their shape from the middle part and the air around the tablets is discharged and prevented from being sealed into resin.
    • 目的:获得一种加热装置,其能够通过使片剂中部的场强比两端的场强更大地从片中的锅中排出空气,并且在比其两端高的温度下加热片剂的中部。 构成:上电极26布置在下电极11的上方并且几乎平行于其中,辅助电极28的突起在中间28a处最大化并且朝向两端28b,28b逐渐减小。 辊12,13通过电动机22旋转以使药片23,24旋转,高频电力施加在上电极26和下电极11之间,并且在长度方向上联合的药片23,24的中间部分被加热 在比两端更高的温度下。 当片剂23,24在罐8中被压缩时,它们从中间部分改变其形状,并且片剂周围的空气被排出并防止被密封到树脂中。
    • 8. 发明专利
    • MOLD APPARATUS
    • JPS5559918A
    • 1980-05-06
    • JP13163278
    • 1978-10-27
    • HITACHI LTD
    • KOIZUMI KOUJI
    • B29C33/00B29B7/00B29C39/00B29C39/26B29C39/36
    • PURPOSE:To provide an apparatus which allows positive withdrawal of moldings without breakage of molded oprtion by operating an ejector pin to temporarily thrust into the cavity between the upper and lower molds with a cylinder mechanism. CONSTITUTION:Vertical travelling of the upper and lower packing plates 16 and 17 are performed by a hydraulic cylinder mechanism while the rise and fall speed of the rods 29 and 25 are controlled by adjusting hydraulic pressure or flowrate. Upper and lower ejector pins 15 and 10 are each fixed on the rods 29 and 25 through the upper and lower packing plates 16 and 17 and thus, can run at a desired speed. With such an arrangement, the upper and lower ejector pins 15 and 10 can eject gently moldings in the upper and lower mold cavities 19 and 11 with a sufficient force. This allows positive withdrawal of the moldings from the cavities 19 and 11 without any large impact thereon, while crack won't be caused in the molded portion.
    • 9. 发明专利
    • Molding machine
    • 成型机
    • JPS60189244A
    • 1985-09-26
    • JP4402184
    • 1984-03-09
    • Hitachi Ltd
    • TABATA KATSUHIROOZAWA MASAKAZUKOIZUMI KOUJI
    • H01L23/50H01L21/48
    • H01L21/4842
    • PURPOSE:To press down an article to be molded with the desired force irrelevant to the transfer of a bending punch, to check damage and free play of the article to be molded, and to enhance quality and reliability of molding at a molding machine by a method wherein the article to be molded is pressed against a die for bending with the prescribed force according to a press piece. CONSTITUTION:When a die plate 7 is descended according to a press device, etc., a press piece 10 comes in contact with the root parts of the outer leads 5 of an IC4 on a die 2 for bending, and a piston 12 is ascended relatively in a cylinder 11 through a rod 13. When inside pressure of the cylinder 11 is enhanced to be the set value or more, a relief valve 16 is opened to hold inside pressure of the cylinder 11 to the set value. Pressing force of the press piece 10 against the outer leads 5 is held to a constant in spite of the descent of the die plate 7. Bending rollers 9 are rotated attending on the descent of the die plate 7 to bend the outer leads 5 as to pressing the leads against the pressure contact surfaces 3b of the bending parts 3. Deformation of the article to be molded and free play during processing to be generated according to a variation of pressing force can be checked.
    • 目的:以与弯曲冲头的传送无关的所需力压下成型件,以检查待模制品的损坏和自由游隙,并通过一个成型机提高成型机的成型质量和可靠性 方法,其中待模制的制品根据压片以规定的力压在模具上以弯曲。 构成:当模板7根据压装装置等下降时,压片10与模具2上的IC4的外引线5的根部接触以进行弯曲,活塞12上升 通过杆13相对地在气缸11中。当气缸11的内部压力增加到设定值以上时,开启安全阀16以将气缸11的内部压力保持在设定值。 压片10抵靠外引线5的压力尽管模板7的下降而保持恒定。弯曲辊9在模板7的下降下旋转,以使外引线5弯曲至 将引线压靠在弯曲部件3的压力接触表面3b上。可以检查根据压力的变化产生的待加工制品的变形和处理期间的自由游隙。