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1. 发明专利

JPH08288319A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08288319A
公开(公告)日：1996-11-01
申请号：JP11356295
申请日：1995-04-14
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： OKA HIROTAKE , KAGII HIDEMASA , MIKAMI AKIO , TOGAWA MITSUO , NAGAMINE TORU , SATO HITOHISA
IPC分类号： H01L21/52
摘要： PURPOSE: To form a solder layer for bonding a pellet with uniform thickness while eliminating void therefrom. CONSTITUTION: When a collet 14 containing a vacuum sucked pellet 12 is mounted on the header 10 of a lead frame 1, a gap 18 is formed between the pellet 12 and the header 10. Molten solder 17 is then fed into the gap 18 through an injection tube 19 coupled with an opening made through the side wall of the collet 14. The air in the gap 18 is pushed out by the molten solder 17 through an air vent 20 made through the side wall of the collet 14. Since the gap is sustained constant by the collet at the time of feeding the molten solder, a solder layer having uniform and constant thickness can be formed. Furthermore, void can be eliminated from the solder layer, because the air in the gap is pushed out by the molten solder.

2. 发明专利

JPH07161912A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE AND LEAD FRAME USED FOR THE MANUFACTURE 失效
公开(公告)号：JPH07161912A
公开(公告)日：1995-06-23
申请号：JP34153593
申请日：1993-12-10
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD , AKITA DENSHI KK
发明人： DANNO TADATOSHI , KAGII HIDEMASA , FUNATSU KATSUHIKO , NAMITA TOSHIYUKI , HATORI KAZUO , OGASAWARA JUNYA , SATO HITOHISA
IPC分类号： H01L21/60 , H01L21/52 , H01L23/50
摘要： PURPOSE:To prevent the cracking of a resin-sealed body by bringing the bonding wire of a semiconductor pellet and a main surface on the opposite side in contact with entirely the resin of a sealing body and pressing a holding member in two places which are opposite to each other in the side surface of the semiconductor pellet. CONSTITUTION:A resin-sealed package 26 is formed of a resin-sealed body 24 and a plurality of outer leads 20. A pellet 21, four holding members 18 and an inner lead 19 are resin-sealed with the resin-sealed body. A bonding wire 22 in the pellet 21 and a main surface on the opposite side 11 are in contact with entirely the resin of the resin-sealed body 24 and each holding member 18 is pressed against the four sides of the pellet 21 by elastic force. Thereby, the generation of a crack in the resin-sealed body can be avoided before it happens.

3. 发明专利

JP2000223634A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000223634A
公开(公告)日：2000-08-11
申请号：JP1943199
申请日：1999-01-28
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： KAJIWARA RYOICHI , KOIZUMI MASAHIRO , MORITA TOSHIAKI , TAKAHASHI KAZUYA , KISHIMOTO MUNEHISA , ISHII SHIGERU , HIRASHIMA TOSHINORI , TAKAHASHI YASUSHI , NAMITA TOSHIYUKI , SATO HITOHISA , OKAWA KEIICHI
IPC分类号： H01L23/36 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a package structure capable of reducing the mounting resistance. SOLUTION: First metal members (lead terminals 5, 6) are connected to a first electrode (a source electrode 2) of a semiconductor element (a semiconductor chip 1) via first metal bodies (Au bumps 8) including a noble metal, and a second metal member (a die terminal 7) is connected to a second electrode (a rear electrode 4) via second metal bodies (plated with noble metal 14 and Ag 15). Thereby, a drastic decrease in the mounting resistance such as 1 mΩ or lower can be achieved.

4. 发明专利

JPH08124976A WIRE BONDING TOOL AND WIRE BONDING EQUIPMENT 失效
公开(公告)号：JPH08124976A
公开(公告)日：1996-05-17
申请号：JP28263294
申请日：1994-10-21
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO HITOHISA , NAKAJIMA MAKOTO
IPC分类号： H01L21/60 , H01L21/607
摘要： PURPOSE: To prevent a wire material from being welded to the surface of a bonding tool at wire bonding. CONSTITUTION: A recessed groove 13 and a wire insertion hole 14 which reaches to the side of a wedge 12 extending obliquely upwards from the recessed groove 13 are provided to the lower end of the wedge 12. All the surface of the wedge 12 is coated with a welding-resistant coating 15 where the aluminum material of a wire 3 is hardly welded through an ion plating method. The welding- resistant coating 15 is formed of amorphous carbon film of Vickers hardness 3000 to 5000. Therefore, the recessed groove 13 serving as the pressing surface of the wedge 12 is also coated with the amorphous carbon film 15, so that the aluminum material of the wire 3 is hardly welded to the surface of the recessed groove 13 at bonding.

5. 发明专利

JPH07142642A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH07142642A
公开(公告)日：1995-06-02
申请号：JP28803993
申请日：1993-11-17
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： OKA HIROTAKE , NAGAMINE TORU , SATO YUKIHIRO , TAKEUCHI TAKAYASU , SAITO MASAHIRO , SATO HITOHISA , AOKI HISAYO , FUNATSU KATSUHIKO , TSUCHIYA JUNICHI
IPC分类号： H01L23/28 , H01L23/12 , H05K1/02 , H05K3/34
摘要： PURPOSE:To enhance heat radiation by providing a heat-conductive material which is connected to the back side facing to the pellet-fixed surface of a tab, exposed from one surface of a resin sealed body and having the heat conductivity higher than that of a sealed body. CONSTITUTION:A heat conducting material 6 is arranged on the back side opposing to the fixed surface of the pellet of a tab C. The heat conducting material 6 is coupled to the back side of the tab 4C, and it is exposed from the mounting surface 2A of a resin-sealed body 2. The heat conducting material 6 is formed by the Pb-Sn alloy solder maternal having the thermal conductivity of 826X10 cal/cm.sec. deg.C or thereabout. The solder material has high adhesive strength with the tab 4C, and low adhesive strength with the semi-sealed body 2. Accordingly, the thermal resistance between the back side of the tab 4C and the mounting surface 2A, which is one surface of the resin-sealed body 2, can be decreased. As the heat generated by the function of the circuit system, which is mounted on a semiconductor pellet 3, can be discharged to the outside of the semi-sealed body 2 through the heat conducting material 6, and heat radiating efficiency can be enhanced.

6. 发明专利

JPH04107941A WIRE-BONDING APPARATUS 失效
公开(公告)号：JPH04107941A
公开(公告)日：1992-04-09
申请号：JP22505990
申请日：1990-08-29
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO HITOHISA , ARAKI ISAO
IPC分类号： H01L21/603 , H01L21/60
摘要： PURPOSE:To avoid the fusion of a solder film on the outer part of a lead frame by constituting the lead frame so that the outer part is relatively cooled with respect to the inner part of the lead frame. CONSTITUTION:Heating of a lead 9 by a heat block 22 is set to a temperature, where a satisfactory bondability can be ensured, so that the intermediate part of a wire material 38 is connected onto the inner part 9b of the material with a sufficient bonding strength. On the other hand, because the outer part 9b of a lead frame 9 is provided via an escape recess 48 and heat insulator layer 49, it is thermally separated from the heat block 22 and its temperature is lower than that of the inner part 9a of the lead frame 9. Further, a low- temperature reducing gas 53 blown from a blow-off port 50 is blown against the outer part 9b of the lead frame 9 so that the outer part of the lead frame 9 is cooled forcibly.

7. 发明专利

JPH08111494A SURFACE MOUNTING TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08111494A
公开(公告)日：1996-04-30
申请号：JP24547494
申请日：1994-10-11
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： TSUCHIYA JUNICHI , NAGAMINE TORU , SAITO MASAHIRO , SATO HITOHISA , SATO YUKIHIRO , AOKI SUMIYO , HOSHI AKIRO
IPC分类号： H01L23/04 , H01L23/50
摘要： PURPOSE: To prevent peeling off of each of a plurality of outer leads that are arranged on one side of a packaged body after the leads are mounted on the mounting surface of a substrate. CONSTITUTION: The title device is provided with a plurality of outer leads 3B whose connection part 3B1 is fixed on the surface of a connecting terminal 9 arranged on the mounting surface 8A of a mounting substrate 8 by using a soldering material 10, on one side of a packaged body 5. In such a device, each of the leads 3B is formed of metallic film prepared on the surface of a flexible film 2, and the parts 3B1 of the leads 3B are respectively supported to the mounting face 5C of the body 5 facing the surface 8A of the substrate 8 by using the film 2.

8. 发明专利

JPH0697210A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0697210A
公开(公告)日：1994-04-08
申请号：JP24451392
申请日：1992-09-14
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO HITOHISA
IPC分类号： H01L21/52
摘要： PURPOSE:To prevent solder fatigue and to improve solder wettability by using a tin-antimony-silver-nickel-phosphorus soldering material. CONSTITUTION:A semiconductor pellet 2 is connected to the die-pad 3 on a metal frame 1, which is formed by punching from a copper or copper alloy plate, through the intermediary of a solder layer 7. As the soldering material, antimony of 1.0 to 10wt.%, silver of 1.0 to 25wt.%, nickel of 0.1 to 0.5wt.%, and phosphorus of 0.001 to 0.5at.% are used and the remaining part is composed of tin. The above-mentioned solder layer is formed in the thickness of about 10mum or heavier. The solder wettability can be improved by adding silver to tin-antimony-nickel-phosphorus solder which is effective to solder fatigue and thermal resistance can also be reduced. As a result, the efficiency of a power semiconductor device can be improved, and its reliability can also be enhanced.

9. 发明专利

JPH0637122A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0637122A
公开(公告)日：1994-02-10
申请号：JP18786392
申请日：1992-07-15
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO HITOHISA
IPC分类号： H01L21/52 , H01L23/50
摘要： PURPOSE:To reduce the shearing strain of solder at the outer peripheral section of a pellet without increasing the heat resistance so as to reduce the fatigue of the solder by forming a groove or level difference on the surface of a frame immediately below the periphery of the pellet so that the thickness of a solder layer can become thicker. CONSTITUTION:A semiconductor pellet 2 is connected to part of a metallic frame 1 through a solder brazing material 5. A groove 8 or recessing and projecting level difference is formed along the peripheral margin of a pellet fitting section on the surface of the frame 1 so that the thickness of the material 5 can become thicker at the section immediately below the periphery or corner of the pellet 2 or at the section immediately bellow the central section of the pellet 2. For example, the pellet 2 is fitted so that the solder 5 immediately below the pellet 2 can reach the groove 8 of a header. As a result, the thickness of the solder 6 at the outer peripheral section of the pellet 2 becomes thicker by the depth of the groove 8 and the amount of the solder at the other sections can be reduced. Therefore, the thickness of the solder 5 can be made thinner and uniform at the central part of the pellet 2.

10. 发明专利

JPH01280326A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01280326A
公开(公告)日：1989-11-10
申请号：JP11009188
申请日：1988-05-06
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： ARAI KATSUO , ARAKI ISAO , FURUI TAKAFUMI , SATO HITOHISA
IPC分类号： H01L21/60 , H01L23/28
摘要： PURPOSE:To eliminate a pellet bonding process as well as to avoid shortcircuit defects caused by contacts of wires with one another, by using insulating coating covered wires and by holding a semiconductor pellet inside a package by the wires. CONSTITUTION:A semiconductor device 70 is provided with a semiconductor pellet 8, a plural number of leads 7 arranged around the semiconductor pellet 8, bridged wires 9 with both ends bonded to electrodes 8a of the semiconductor pellet 8 and each lead 7 and a package 10 for plastic seal of the semiconductor pellet 8, a part of the leads 7 and the wires 9. In this device, the wires 9 should be coated with insulating coating 9b and the pellet 8 should be held inside the package 10 by the coated wires 9. For example, the coated wires 9a are formed so as to have a rigidity to resist the resin flow at the time of formation of the plastic seal package 10. And, the insulating coating 9b is made of resin having insulation.

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