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    • 4. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH0480966A
    • 1992-03-13
    • JP19577890
    • 1990-07-23
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • TAMURA YASUO
    • H01L21/336H01L29/78
    • PURPOSE:To prevent a MISFET where an LDD structure is adopted from deteriorating in electrical properties by a method wherein a point where impurity concentration becomes maximal is set in a first semiconductor region at a depth substantially identical to the junction depth a second semiconductor region or below, and a third semiconductor region whose conductivity type is identical to those of the first and the second semiconductor region and which is higher than the second semiconductor region in impurity concentration is provided between the first semiconductor region and wiring. CONSTITUTION:A point where impurity concentration becomes maximal is set in an N-type semiconductor region 8 of a MISFET where an LDD structure is adopted at a depth substantially identical to the junction depth of an N-type semiconductor region 6 or below. A carrier transfer path in the N-type semiconductor region 8 near to a channel forming region side is provided deep in the depthwise direction of the N-type semiconductor region 8, whereby the electrical field effect of a gate electrode on the transfer path can be lessened, so that hot carriers which are induced near the N-type semiconductor region 8 and trapped in a gate insulating film 3 can be lessened, a threshold voltage is lessened in fluctuation, and thus a MISFET where an LDD structure is adopted can be improved in electrical properties.