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1. 发明专利

DE19601372B4 未知
公开(公告)号：DE19601372B4
公开(公告)日：2004-02-12
申请号：DE19601372
申请日：1996-01-16
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： INOUE HIROKAZU , SAITO RYUICHI , MORI MUTSUHIRO , KURIHARA YASUTOSHI , ONUKI JIN , KIMURA SHIN , SHIMADA SATOSHI , SUZUKI KAZUHIRO , KAMITA YUKIO , KOBAYASHI ISAO , YAMADA KAZUJI , MOMMA NAOHIRO
IPC分类号： H01L23/28 , H01L23/34 , H01L23/538 , H01L25/07 , H01L25/18
摘要： A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.

2. 发明专利

DE19601372A1 Semiconductor module for power semiconductor 未知
公开(公告)号：DE19601372A1
公开(公告)日：1996-07-18
申请号：DE19601372
申请日：1996-01-16
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： INOUE HIROKAZU , SAITO RYUICHI , MORI MUTSUHIRO , KURIHARA YASUTOSHI , ONUKI JIN , KIMURA SHIN , SHIMADA SATOSHI , SUZUKI KAZUHIRO , KAMITA YUKIO , KOBAYASHI ISAO , YAMADA KAZUJI , MOMMA NAOHIRO
IPC分类号： H01L23/28 , H01L23/34 , H01L23/538 , H01L25/07 , H01L25/18 , H01L23/52
摘要： The module includes power semiconductor components (101,102) which are wired by a metal film (103) deposited on a substrate (106). These components form asymmetric unit arrangements contg. semiconductor components. Each unit is located on the substrate in the same direction. One unit is coupled to electrode terminals (108,110), which are coupled to coupling terminals. The electrode terminals are fitted in given spacing intervals. Pref. the asymmetric unit arrangement is of left-right and/or top-bottom asymmetric direction type.

3. 发明专利

JPH11145380A SEMICONDUCTOR STACK 失效
公开(公告)号：JPH11145380A
公开(公告)日：1999-05-28
申请号：JP30406997
申请日：1997-11-06
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： KOBAYASHI ISAO , ONDA KENICHI , TOBIYO MASAHIRO
IPC分类号： H01L23/40 , H01L25/10 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To suppress the increase in the tightening torque given to a push bolt for pressurizing to a minimum, even if the specified press-contacting force of a laminate formed by alternately piling semiconductor elements and cooling members upon another increases. SOLUTION: A laminate is positioned between two press plates 10, which are faced to each other with a fixed space in between and a bracket 6, and a steel ball 7 are positioned between one end section of the laminated body and one keep plate 10. A press-contact force is applied to the laminated body by pressing a push bolt 8 for pressurizing being screwed in the keep plate 10 against the laminate via the steel ball 7 and bracket 6. In the front end section of the bolt 8, a conical hole is formed, so that part of the steel ball 7 in the hole and the apex angle of the hole is set at on angle of 100 deg.-170 deg.. When the apex angle is set at 100 deg.-170 deg., the friction torque between the bolt 8 and the steel ball 7 becomes small, and the tightening torque of the bolt 8 becomes smaller.

4. 发明专利

JPH10308495A FLAT SEMICONDUCTOR STACK FOR USE IN POWER CONVERTER 失效
公开(公告)号：JPH10308495A
公开(公告)日：1998-11-17
申请号：JP11576097
申请日：1997-05-06
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： KOBAYASHI ISAO , ONDA KENICHI , TOBIYO MASAHIRO
IPC分类号： H01L25/11
摘要： PROBLEM TO BE SOLVED: To provide a flat semiconductor stack wherein the pressure of a compression spring can be easily and accurately set regardless of the level of skill of a worker etc. SOLUTION: This stack comprises a plurality of flat semiconductor devices 1 and a cooling member 2 which are laminated together, two pressing plates 9, 10 disposed at both ends thereof to restrict the movement thereof in the lamination direction, a pressing push-bolt 8 disposed on the pressing plate 10 side, a compression spring guide 5 loosely fits in a pass-through part 9a provided in the pressing plate 9, and a compression spring 4 provided between the pressing plate 9 and the compression spring guide 5. The position of the end surface R of the compression spring guide 5 passing through the pass-through part 9a coincides with the end surface S of the pressing plate 9 in a state wherein semiconductors 1 and the cooling member 2 are clamped by a prescribed press- welding force.

5. 发明专利

SG38886A1 Supporting mechanism of disk unit in magnetic disk apparatus 未知
公开(公告)号：SG38886A1
公开(公告)日：1997-04-17
申请号：SG1995001882
申请日：1995-11-21
申请人： HITACHI LTD
发明人： KOBAYASHI ISAO , KANEKO JIRO , UEFUNE KOUKI , SUZUKI TOMIO , TAKAHASHI TSUYOSHI
IPC分类号： G11B25/04 , G11B33/08 , G11B33/12 , G11B33/00
摘要： A magnetic disk apparatus includes a link mechanism constructed by at least a flexible portion and a hard member and one end of the link mechanism is attached to a fixing unit (6) and the other end is attached to a hard disk assembly (1) so that the flexible portion of the link mechanism is located on a straight line which passes through the center of gravity of the hard disk assembly, thereby having a sufficient rigidity for a disturbance in the straight line direction which acts on the HDA (Hard Disk Assembly) (1) and reducing a natural frequency of the HDA for the disturbance in the rotating direction of the HDA.

6. 发明专利

AT125830T 未知
公开(公告)号：AT125830T
公开(公告)日：1995-08-15
申请号：AT90124559
申请日：1990-12-18
申请人： HITACHI LTD
发明人： KUROISHI KAZUYOSHI , NAKA REISHI , KOBAYASHI ISAO , TANAKA KOUSUKE , GOTOO KATUHIKO
IPC分类号： F25D23/08 , C08G18/00 , C08G18/48 , C08G18/50 , C08G18/72 , C08G18/80 , C08G101/00 , C08J9/02 , C08J9/14 , C08G18/76
摘要： A rigid polyurethane foam obtained by foaming a special polyol component and an isocyanate component in the presence of a blowing agent comprising water and at least one member selected from the group consisting of 1,1-dichloro-2,2,2-trifluoroethane and 2,2-dichloro-2-monofluoroethane possesses balanced excellent properties, has no surface void, and shows only slight expansion after molding. Therefore, it can be effectively used as a heat insulator, in particular, a heat insulator for refrigerators.

7. 发明专利

DE69106684D1 未知
公开(公告)号：DE69106684D1
公开(公告)日：1995-02-23
申请号：DE69106684
申请日：1991-01-14
申请人： HITACHI LTD
发明人： KUROISHI KAZUYOSHI , KOBAYASHI ISAO , NAKA REISHI
IPC分类号： C08J9/02 , C08G18/10 , C08G18/40 , C08G18/42 , C08G18/48 , C08G18/50 , C08G18/66 , C08G18/76 , C08J9/14 , C08L75/04
摘要： A rigid polyurethane foam obtained by foaming a special polyol component and an isocyanate component using only water as a blowing agent has balanced excellent properties including a remarkably low density and a low thermal conductivity and is suitable for use as a heat insulator, particularly in a refrigerator.

8. 发明专利

DE3369522D1 PROCESS FOR PRODUCING RIGID POLYURETHANE FOAMS 未知
公开(公告)号：DE3369522D1
公开(公告)日：1987-03-05
申请号：DE3369522
申请日：1983-04-13
申请人： HITACHI LTD
发明人： NAKA REISHI , SHIBATA KATSUO , KOBAYASHI ISAO
IPC分类号： C08G18/00 , C08G18/48 , C08G18/50 , C08G18/14
摘要： A rigid polyurethane foam can be obtained in one-shot method by reacting a polyol mixture comprising a tetrafunctional tolylenediamine type polyol, a difunctional propylene type polyol, an octafunctional sucrose type polyol and a trifunctional diethanolamine type polyol with an isocyanate component in the presence of a reaction catalyst, a blowing agent and a foam stabilizer. The thus obtained rigid polyurethane foams have improved fluidity, dimensional stability, friability and thermal conductivity and shortened demolding time.

9. 发明专利

DE69535775D1 未知
公开(公告)号：DE69535775D1
公开(公告)日：2008-08-07
申请号：DE69535775
申请日：1995-10-04
申请人： HITACHI LTD , HITACHI HARAMACHI ELECTRONICS
发明人： YAMADA KAZUJI , TANAKA AKIRA , SAITO RYUICHI , KURIHARA YASUTOSHI , KUSHIMA TADAO , HARAMAKI TAKASHI , KOIKE YOSHIHIKO , HOSOKAWA TAKASHI , SAWAHATA MAMORU , KOIZUMI MASAHIRO , ONUKI JIN , SUZUKI KAZUHIRO , KOBAYASHI ISAO , SHIMIZU HIDEO , HIGASHIMURA YUTAKA , SEKINE SHIGEKI , KOIKE NOBUYA , KOKUBUN HIDEYA
IPC分类号： H01L25/07 , H01L23/049 , H01L23/373 , H01L23/495 , H01L25/065 , H02M7/00
摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes (15a,15b,17,18,19) of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base (13), the upper surface of the heat dissipating base being covered with a member (12) for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

10. 发明专利

DE69525818T2 未知
公开(公告)号：DE69525818T2
公开(公告)日：2002-11-28
申请号：DE69525818
申请日：1995-11-27
申请人： HITACHI LTD
发明人： KOBAYASHI ISAO , KANEKO JIRO , UEFUNE KOUKI , SUZUKI TOMIO , TAKAHASHI TSUYOSHI
IPC分类号： G11B25/04 , G11B33/08 , G11B33/12
摘要： A magnetic disk apparatus includes a link mechanism constructed by at least a flexible portion and a hard member and one end of the link mechanism is attached to a fixing unit (6) and the other end is attached to a hard disk assembly (1) so that the flexible portion of the link mechanism is located on a straight line which passes through the center of gravity of the hard disk assembly, thereby having a sufficient rigidity for a disturbance in the straight line direction which acts on the HDA (Hard Disk Assembly) (1) and reducing a natural frequency of the HDA for the disturbance in the rotating direction of the HDA.

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