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    • 1. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JP2000068587A
    • 2000-03-03
    • JP23524598
    • 1998-08-21
    • HITACHI LTD
    • SAGAWA MISUZUHIRAMOTO KIYOHISA
    • H01S5/00H01S5/30
    • PROBLEM TO BE SOLVED: To reduce a longitudinal mode hopping amount generated by an environmental temperature change and drive current change by providing at least one or more layers which become absorption to laser beam between an active layer and a board. SOLUTION: For example, in the structure of a superlattice absorption layer 2, three In(1-x)Ga(x) As compression strain quantum well layers 16 and four In(1-x)Ga(x)P(1-y) tensile strain barrier layers 17 are held between strain-free InGaAsP layers 18. Transition energy between first levels between electron of a quantum well layer constituting the superlattice absorption layer and a heavy hole is about 1.0 μm and becomes absorption to light of 0.98 μm. At least one or more layers which become absorption to laser beam are provided between an active layer and a substrate in this way. Furthermore, a semiconductor board is constituted of GaAs and a layer which becomes absorption is constituted of In(y)Ga(1-y) As and the In composition (y) is set at 0.15 or more. The layer thickness which becomes absorption is set at 50 nm or less.
    • 2. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH09307181A
    • 1997-11-28
    • JP12433396
    • 1996-05-20
    • HITACHI LTD
    • SAGAWA MISUZUHIRAMOTO KIYOHISATOYONAKA TAKASHIKIKAWA TAKESHI
    • H01S5/00H01S3/18
    • PROBLEM TO BE SOLVED: To prevent mode loss which is to be caused by mode conversion and stabilize a transverse mode, by using a structure wherein the stripe width of a region of high effective refractive index is changed in accordance with an exponential function along the resonator direction. SOLUTION: A semiconductor laser device has a stripe type region whose effective refractive index is higher than other parts, along the resonator direction. The width of the region of high effective refractive index is changed in accordance with an exponential function, along a resonator direction. That is, the width of the region of high effective refractive index is set to be smaller than or equal to 3.5μm on one end surface side of the resonator, and is set to be greater than or equal to 5μm on the other end surface side of the resonator. Since the stripe is wide in the front surface wherein high light density becomes problem, and the light spot is enlarged, light density is reduced. Since a back end surface whose light density is comparatively small is constituted as a narrow stripe, the transverse mode can be stabilized. Therefore, a high output and high reliability laser is realized.
    • 5. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPH06232500A
    • 1994-08-19
    • JP1988893
    • 1993-02-08
    • HITACHI LTD
    • NAKATSUKA SHINICHITSUJI SHINJISAGAWA MISUZUHIRAMOTO KIYOHISATSUCHIYA TOMONOBU
    • H01S5/00H01S3/18
    • PURPOSE:To enlarge a laser beam shape only in the edge plane area of a semiconductor laser and increase the light output of the semiconductor laser by providing an SiO2 film in the element central area excluding the vicinity of the semiconductor laser edge plane and permitting the element to have a structure which has thick activating layer only in the central area and thin activating layer in the vicinity of the edge plane. CONSTITUTION:An SiO2 pattern with a stripe-shaped window is provided except in an area to be the laser edge plane on an (n) type GaAs substrate, a buffer layer 4, a clad layer 5, a multi quantum well activating layer 6, a clad layer 7 and a contact layer 8 are successively crystal-grown on the pattern. Then, after etching the contact layer 8 and a part of the clad layer 7 using an SiO2 film formed by permitting the SiO2 to pass through the center of the stripe- shaped window as a mask, a block layer 11 is selectively grown in an area which has no SiO2 film. Then after removing the SiO2 film, a burying layer 12 and a cap laser 13 are formed, Au electrodes 14 are formed on the front and rear planes of the wafer and a laser chip is provided by cutting the area with not SiO2 pattern.
    • 6. 发明专利
    • SEMICONDUCTOR LASER DEVICE AND METHOD OF FABRICATING THE SAME
    • JPH09326526A
    • 1997-12-16
    • JP14396396
    • 1996-06-06
    • HITACHI LTD
    • HIRAMOTO KIYOHISASAGAWA MISUZUTOYONAKA TAKASHI
    • H01S5/00H01S3/18
    • PROBLEM TO BE SOLVED: To provide a semiconductor laser device in which a ridge is formed in an area other than around a laser end face and a quantum well structure consisting of an active layer which is not positioned around the ridge and an active layer of the laser end face is made in a mixed crystal state, thereby making the active layer of the laser end face transparent for a laser beam with excellent controllability without causing damages or rapid deterioration to the boundary face. SOLUTION: On a substrate 1, a buffer layer 2, a clad layer 3, a distortion quantum well active layer 4 constructed by a barrier layer and a strained quantum well layer, a clad layer 5, an optical waveguide and etch stop layer 6, and a clad layer 7 are sequentially formed by an MOCVD method. An SiO2 oxide layer 15 is formed on the clad layer 7, and the clad layer 7 is etched with concentration hydrochloric acid by using the layer 15 as a mask, thereby forming a ridge. Further, the optical waveguide and etch stop layer 6 is removed. After that, the substrate on which the ridge is formed is conveyed into an ion implanter and a hydrogen ion is implanted so that the quantum well structure except for a part around the ridge has the mixed crystal. The active layer of the end face can be made transparent for the laser beam.
    • 9. 发明专利
    • SURFACE EMITTING TYPE SEMICONDUCTOR LASER
    • JPH08340146A
    • 1996-12-24
    • JP14585595
    • 1995-06-13
    • HITACHI LTD
    • UOMI KAZUHISASHINODA KAZUNORIOKUNO YAESAGAWA MISUZUHIRAMOTO KIYOHISA
    • H01S5/00H01S5/042H01S5/183H01S3/18
    • PURPOSE: To provide a long-wavelength band surface emitting type semiconductor laser, which oscillates in a continuous operation in a low threshold current and has a high reliability, by a method wherein a semiconductor multilayer reflecting mirror, which is high in reflectivity and does not contain Al elements, is realized. CONSTITUTION: A long-wavelength band laminated structure, which consists of an InGaAsP layer and an InP layer and has an active layer 5 which transmits a laser beam of a wavelength in the range of a wavelength of 1.25 to 1.65μm, and a semiconductor multilayer reflecting mirror 2 consisting of a combination of an InGaP layer and a GaAs layer or a combination of an InGaAsP layer and a GaAs layer are integrally constituted by a direct bonding system. Accordingly, a surface emitting type semiconductor laser, which has the semiconductor multilayer reflecting mirror which is high in reflectivity and does not contain chemically very active Al elements, and generates a laser beam of a wavelength of 1.25 to 1.65μm can be provided. As a result, the realization of the mirror 2 has an effect to the the improvement of the reliability of the long-wavelength band surface emitting type semiconductor laser, which oscillates in a continuous operation a low threshold current.