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    • 1. 发明专利
    • Method and apparatus for structure testing
    • DE3838032A1
    • 1989-05-24
    • DE3838032
    • 1988-11-09
    • HITACHI LTD
    • NINOMIYA TAKANORIYOSHIMURA KAZUSHINOMOTO MINEO
    • G01R31/308G06T7/00
    • In a method and an apparatus for structure testing, a determined structure is brought into binary form (302), the binary structure is expanded (303), the image size is reduced (305a), whilst maintaining the interconnection of the expanded structure, and is stored in a first store (306); furthermore, the binary structure is contracted (304), the image size is reduced (305b), whilst maintaining the interconnection of the contracted structure, and is stored in a second store (307). The expanded structure is then read out of the first store (306) and an interconnection of the structure is selected (308); the contracted structure is read out of the second store (307) and an interconnection is selected from this structure. The selected interconnections are compared with the interconnection of a normal structure, in order to determine a non-match. Corresponding to such non-matches, the structure having a short-circuit or partial short-circuit and the structure having an open or partially open electric circuit are classified and selected. Furthermore, the structure shape stored in the first store (306) is analysed in order to determine the position at which a short-circuit or partial short-circuit fault is present.