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1. 发明专利

DE4217288C2 未知
公开(公告)号：DE4217288C2
公开(公告)日：1998-08-27
申请号：DE4217288
申请日：1992-05-25
申请人： HITACHI LTD
发明人： KOYAMA TOHRU , TAKASAKI HIROKAZU , SUZUKI HIROSHI , AMAGI SHIGEO , MUKOH AKIO , KANO IKUSHI
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/42 , C08K3/34 , C08K3/36 , C08K5/00 , C08L63/00 , H01B3/00 , H01B3/40 , H01B17/60 , H01F27/32 , H02K15/12 , H01F27/28 , H01F41/12
摘要： A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition. The composition of the present invention contains 60%-85% by weight, based on the total weight of the composition, of a silica type filler which is an admixture (A) a spherical silica having an average particle diameter of 0.1-0.9 mu m and (B) a ground silica having an average particle diameter of 3-9 mu , the ratio A/(A+B) being 1%-7% by weight. Products as molded coils and panels prepared by using the composition have good resistance to cracking and resistance to moisture.

2. 发明专利

GB2220945A Resin-molded composition for coils 未知
公开(公告)号：GB2220945A
公开(公告)日：1990-01-24
申请号：GB8915945
申请日：1989-07-12
申请人： HITACHI LTD
发明人： KUBO HIROFUMI , FUJIMORI TOSHIYUKI , KOYAMA TOORU , TAKASAKI HIROKAZU
IPC分类号： H01B3/40 , H01F27/32 , H01F41/12
摘要： A resin-molded coil is made up of a winding, inner and outer circumferential insulation layers formed inside and outside said winding, and end insulation layers formed on the ends in the axial direction of said winding, wherein at least one of said inner and outer circumferential insulation layers, said end insulation layer, and the inside of said winding is a resin layer formed by filling a thermosetting resin composition under atmospheric pressure, followed by curing, said thermosetting resin composition being composed of a polyfunctional epoxy compound, filler, and a silane coupling agent and a titanate coupling agent in a specific ratio for the amount of said filler.

3. 发明专利

DE4244961C2 Crack resistant heat-hardenable resin compsns. for coil insulation etc. 未知
公开(公告)号：DE4244961C2
公开(公告)日：2001-09-06
申请号：DE4244961
申请日：1992-05-25
申请人： HITACHI LTD
发明人： KOYAMA TOHRU , TAKASAKI HIROKAZU , SUZUKI HIROSHI , AMAGI SHIGEO , MUKOH AKIO , KANO IKUSHI
IPC分类号： C08K3/36 , H01B3/40 , H01F27/32 , H02K15/12 , C08L63/00 , C08K7/18 , H01F41/12
摘要： Filler compsns. comprise; (A) spherical Si02 of average particle dia. 0.1-0.9 microns; and (B) coarse particle Si02 of average dia. 3-24 (pref.3-9) and pref. with max. dia. 60 microns in an amt. such that (A) forms 1-7 (esp. 2-4) pts.wt. per 100 pts.wt. (A)+(B); and opt. also (C) surfactants, pref. a titanate surfactant plus a silane surfactant or a monofunctional plus a polyfunctional surfactant. Also claimed are neat-curable resin compsns. used in casting high-voltage coils or in adhesive mfr., the coils being used in transformers etc., and the compsns. contg. 60-85 % based on total compsn. wt. of the above (A)+(B) fillers and pref., having as resin components polyfunctional epoxy resins (esp. those based on bisphenol-AF and/or bisphenol F) together with acid anhydride hardeners.

4. 发明专利

DE4217288A1 未知
公开(公告)号：DE4217288A1
公开(公告)日：1992-11-26
申请号：DE4217288
申请日：1992-05-25
申请人： HITACHI LTD
发明人： KOYAMA TOHRU , TAKASAKI HIROKAZU , SUZUKI HIROSHI , AMAGI SHIGEO , MUKOH AKIO , KANO IKUSHI
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/42 , C08K3/34 , C08K3/36 , C08K5/00 , C08L63/00 , H01B3/00 , H01B3/40 , H01B17/60 , H01F27/32 , H02K15/12
摘要： A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition. The composition of the present invention contains 60%-85% by weight, based on the total weight of the composition, of a silica type filler which is an admixture (A) a spherical silica having an average particle diameter of 0.1-0.9 mu m and (B) a ground silica having an average particle diameter of 3-9 mu , the ratio A/(A+B) being 1%-7% by weight. Products as molded coils and panels prepared by using the composition have good resistance to cracking and resistance to moisture.

5. 发明专利

GB2220945B "RESIN-MOLDED COIL" 未知
公开(公告)号：GB2220945B
公开(公告)日：1992-10-28
申请号：GB8915945
申请日：1989-07-12
申请人： HITACHI LTD
发明人： KUBO HIROFUMI , FUJIMORI TOSHIYUKI , KOYAMA TOORU , TAKASAKI HIROKAZU
IPC分类号： H01B3/40 , H01F27/32 , H01F41/12
摘要： A resin-molded coil is made up of a winding, inner and outer circumferential insulation layers formed inside and outside said winding, and end insulation layers formed on the ends in the axial direction of said winding, wherein at least one of said inner and outer circumferential insulation layers, said end insulation layer, and the inside of said winding is a resin layer formed by filling a thermosetting resin composition under atmospheric pressure, followed by curing, said thermosetting resin composition being composed of a polyfunctional epoxy compound, filler, and a silane coupling agent and a titanate coupling agent in a specific ratio for the amount of said filler.

6. 发明专利

JPH0573277B2 失效
公开(公告)号：JPH0573277B2
公开(公告)日：1993-10-14
申请号：JP29042286
申请日：1986-12-08
申请人： HITACHI LTD
发明人： SUDA KOICHI , TAKASAKI HIROKAZU , MATSUKUMA KUNIHIRO , TSUMURA NOBUTAKA
IPC分类号： H01L31/042 , H01L31/04

7. 发明专利

JPS5685806A STABILIZER FOR RESIN MOLDED FLUORESCENT LAMP 失效
公开(公告)号：JPS5685806A
公开(公告)日：1981-07-13
申请号：JP16141779
申请日：1979-12-14
申请人： HITACHI LTD , HITACHI SHOMEI KK
发明人： OGATA MASAJI , NEMOTO MASANORI , TAKASAKI HIROKAZU , NARAHARA TOSHIKAZU , AKATSUKA MITSUO
IPC分类号： C08L67/00 , C08L1/00 , C08L23/00 , C08L27/00 , C08L33/00 , C08L33/02 , C08L67/06 , C08L77/00 , C08L101/00 , H01F27/02 , H01F27/36 , H01F37/00 , H01F41/12
摘要： PURPOSE:To improve thermal stability, anti-wetness and safety by reducing noises and a temperature rise by a method wherein a transformer and metal magnetic shielding plate are integratedly molded with a flame resisting thermosetting resin molding material, and the molded material is made specific. CONSTITUTION:The transformer formed of a core 1, bobbins 2 and coils 3, the metal magnetic shiedling plate 6 and a condenser 4 are integratedly molded with the flame resisting thermosetting resin molding material and made a molded rsin layer 7. The molding material contains, on the basis of a weight of the molding material, (a) approx. 20-30wt% of unsaturated polyester resin of phthalic acid system containing approx. 10-30wt% of thermoplastic resin, (b) approx. 50-70wt% of inorganic fitter containing aluminium hydroxide of more than approx. 20wt%, (c) approx. 0.5-5wt% of red phosphorus and (d) 5-15wt% of fibrous material. Thus, the noises and temperature rise of the stabilizer for fluorescent lamp, the characteristics of anti-wetness, thermal stability and the like are made favorable and also the safety is improved.

8. 发明专利

JPS5473204A MANUFACTURE OF RESIN MOLD MOTOR 失效
公开(公告)号：JPS5473204A
公开(公告)日：1979-06-12
申请号：JP14002477
申请日：1977-11-24
申请人： HITACHI LTD
发明人： OGATA MASAJI , NEMOTO MASANORI , TAKASAKI HIROKAZU , UNNO MORIO , ISHIKAWA TETSUO
IPC分类号： H02K15/12 , H02K3/30 , H02K3/44 , H02K5/08
摘要： PURPOSE:To prevent the formation of cracks, by molding this motor by using a compositon matter, which utilizes terephthalic acid group unsaturated polyester, styrene and thermal plastic saturated polyester as essential components and is produced by blending fillers, which grain diameters differ, and short fibers. CONSTITUTION:A resin composition matter, ehich uses terephthalic acid group unsaturated polyester,styrene and thermal plastic saturated polyester as essential components and is produced by blending fillers, which grain diameters differ, and fibrous materials, is utilized as a mold material 5 for integrally molding a stator core 1 and a stator winding 3. The formation of cracks after molding can be prevented by adding styrene and thermal plastic resin to unsaturated polyester resin, which rapidly hardens and which cost is low. And the coefficient of molding contraction and the coefficient of linear expansion after hardening can be reduced keeping the fluidity of the resin composition matter and the mechanical strength of a hardened matter can be heightened by blending organic fillers, which grain diameters differ, and short fibers.

9. 发明专利

JPS51118004A INSULATION METHOD FOR THE CONDUCTORS OF ELECTRICAL EQUIPMENTS 失效
公开(公告)号：JPS51118004A
公开(公告)日：1976-10-16
申请号：JP4230175
申请日：1975-04-09
申请人： HITACHI LTD
发明人： ABE KIMIHITO , TAKASAKI HIROKAZU , FUJIOKA SHINEI
IPC分类号： H02K15/12 , H02K15/10
摘要： PURPOSE:To obtain the high quality insulated conductor about waterproof and moisturetight character and against corona phenomena.

10. 发明专利

JPH01259066A THERMOSETTING RESIN COMPOSITION 失效
公开(公告)号：JPH01259066A
公开(公告)日：1989-10-16
申请号：JP8510988
申请日：1988-04-08
申请人： HITACHI LTD
发明人： KOYAMA TORU , TAKASAKI HIROKAZU , ASANO HIDEKI , KUBO HIROBUMI , FUJIMORI TOSHIYUKI
IPC分类号： C08L63/00 , C08G59/00 , C08K3/00 , C08K5/00 , C08K9/04 , C08K13/02 , C08L83/04 , C08L101/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain the subject composition, having a low viscosity before curing and excellent in heat resistance and further crack resistance after the curing by using and blending a coupling agent capable of molecularly entangling with an organic matrix resin and chemically bonding to an inorganic filler and coupling agent chemically bondable to both the above-mentioned components in combination. CONSTITUTION:A thermosetting resin composition obtained by blending (A) an organic matrix resin consisting of a polyfunctional epoxy compound, etc., with (B) an inorganic filler and (C) a coupling agent consisting of (C1) a titanate based coupling agent expressed by formula I (n is 2 or 3; R is methyl, etc.; R' is long-chain alkyl) and (C2) a silane based coupling agent expressed by formula II (X is functional group, such as epoxy groups, reactive with the matrix resin at the terminal). The coupling agent (C1) is molecularly entangled with the component (A) in an amount of 0.05-2wt.% based on the component (B) and chemically bonded to the component (B). The coupling agent (C2) is chemically bonded to the component (A) in an amount of 0.05-2wt.% based on the component (B).

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