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1. 发明专利

JPH03110183A THERMAL TRANSFER RECORDER 失效
公开(公告)号：JPH03110183A
公开(公告)日：1991-05-10
申请号：JP24630789
申请日：1989-09-25
申请人： HITACHI LTD
发明人： AOYANAGI MASAHISA , WATANABE MICHIHIRO , SAKASHITA YASUYUKI
IPC分类号： B41J2/325 , B41J17/30
摘要： PURPOSE:To prevent generation of wrinkles on an ink-film by providing spiral screw threads around the surface of a guide roller. CONSTITUTION:A guide roller 7a is made of ferrous metal in order to provide rigidity, and spiral protruding screw threads 7c are formed around the surface. An auxiliary guide roller 7b is made of ferrous metal and its surface is covered with a rubber layer 7d in order to provide a good contact between the auxiliary guide roller 7b and the guide roller 7a. The guide roller 7a and the auxiliary guide roller 7b are pressed so that they come in contact with each other and are free to rotate. An ink-film 1 sent out from an ink-film feeder 2 is sent to a group of heating elements 3 under conditions that a uniform tensile force is exerted by the rotation of the guide roller 7a on the ink-film 1 in directions perpendicular to the transfer direction of the ink-film 1. As a result, generation of wrinkles on the ink-film 1 is prevented and omission of recording due to generation of wrinkles can be prevented.

2. 发明专利

JPS63315261A THERMAL RECORDING HEAD 失效
公开(公告)号：JPS63315261A
公开(公告)日：1988-12-22
申请号：JP15112087
申请日：1987-06-19
申请人： HITACHI LTD
发明人： MEGO KAZUYOSHI , SAKASHITA YASUYUKI
IPC分类号： B41J2/335 , B41J2/345 , H05K1/11 , H05K3/36
摘要： PURPOSE:To achieve improvement of connection reliability of a soldering part, by a method wherein dummy terminals other than soldering terminals are provided between a flexible print plate (FPC) and a substrate of a different coefficient of thermal expansion to be soldered thereto, and a solder height after connection is controlled. CONSTITUTION:A soldered connection terminal 4 which is circuit formed by a thin film process and a dummy terminal 6 which is formed by a thick film process are provided between FPC1 and a head substrate 3 which are different in coefficient of thermal expansion. Then, after registering of the soldered FPC1 side terminal to a connection terminal 4 formed on the head substrate 3 side, soldering connection is performed by thermal pressure contact with a hot ram. In that case, since a dummy terminal 6 for regulation of height formed by a thick film is provided between the substrate 3 and the FPC1, a solder height of a connection part after solder fusion can be controlled by a film thickness of the dummy terminal 6 served doubly as a spacer. Therefore, high connection reliability can be obtained by a columnar solder 5 formed between a connection terminal 2 and the connection terminal 4.

3. 发明专利

JPS63307796A THERMAL CONTACT BONDING DEVICE 失效
公开(公告)号：JPS63307796A
公开(公告)日：1988-12-15
申请号：JP14308787
申请日：1987-06-10
申请人： HITACHI LTD
发明人： SAKASHITA YASUYUKI
IPC分类号： B41J2/335 , B23K3/02 , H05K3/34 , H05K3/36
摘要： PURPOSE:To prevent the disconnection of an FPC pattern at the time of pressing while thickening the joint solder of the edge section of a substrate, and to improve the reliability of a connecting section by forming the pressure edge section of a head section shaped in s heating and pressing-able manner in a thermocompression bonding device to a curved surface shape. CONSTITUTION:A thermocompression bonding device solder-joins a flexible printed board (FPC) 8, to which a fine pattern is shaped, with a ceramic substrate or a glass plate 7, to which a pattern is formed, by a heating and pressing head section 6, and the pressure edge section 6A of the head section 6 is formed to a curved surface shape. That is, the substrate side pattern and the FPC side pattern are aligned, the head section heated is lowered onto FPC and pressed, and the solder of a connecting section is heated and melted and the connecting section is soldered. The pressure edge section of the head section is formed to the curved surface shape at that time, thus preventing breaking near the edge section of the substrate of the FPC pattern on pressure while increasing the wall thickness of solder near the edge section of said substrate.

4. 发明专利

JPS6298797A SOLDERING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT 失效
公开(公告)号：JPS6298797A
公开(公告)日：1987-05-08
申请号：JP23763885
申请日：1985-10-25
申请人： HITACHI LTD
发明人： SAKASHITA YASUYUKI
IPC分类号： H05K3/34 , H05K3/36

5. 发明专利

JPH02286373A HEAT SENSITIVE TRANSFER RECORDER 失效
公开(公告)号：JPH02286373A
公开(公告)日：1990-11-26
申请号：JP10764889
申请日：1989-04-28
申请人： HITACHI LTD
发明人： AOYANAGI MASAHISA , WATANABE MICHIHIRO , SAKASHITA YASUYUKI
IPC分类号： B41J17/30
摘要： PURPOSE:To prevent faulty printing due to the creases of an ink film by a method wherein the title device is so structured that the ink film is transferred to a heat sensitive head through a transfer passage different from another transfer passage, through which a recording paper is transferred to the heat sensitive head. CONSTITUTION:A roller 2 is provided with a tension force providing mechanism for preventing the generation of drooping or creases of an ink film 1 until the film arrives at a heat sensitive recording head 5 while another roller 2b is provided with another tension providing mechanism for separating a recording paper 6 from the ink film 1 and reeling them. Further, the title device is provided with a mechanism for rotating a platen roller 7 whereby the ink film 1 and the recording paper 6 are transferred. In this case, the ink film 1 will never be connected with the recording paper 6 until they arrive at the heat sensitive head 5 and, therefore, the ink film 1 will never receive any force from the recording paper 6. As a result, creases will never be generated on the ink film 1 and normal printing may be effected.

6. 发明专利

JPS63236376A LED PRINTER HEAD 失效
公开(公告)号：JPS63236376A
公开(公告)日：1988-10-03
申请号：JP6883987
申请日：1987-03-25
申请人： HITACHI LTD
发明人： SAKASHITA YASUYUKI , MEGO KAZUYOSHI
IPC分类号： B41J2/44 , B41J2/45 , B41J2/455 , H01L33/08 , H01L33/62
摘要： PURPOSE:To simplify a manufacturing process, facilitate the replacement of defective portions, and improve on the yield by a method wherein a metal film is attached to the rear side of a LED chip and the LED chip is installed to a substrate with solder. CONSTITUTION:A solder paste 5 is applied to a location for an LED chip 3 on a substrate 1 and the LED chip 3 is provisionally attached to said location. A solder bump 4 is pasted at a location for a driver chip 2 and the driver chip 2 is provisionally attached to said location. The entirety is heated in a continuous furnace, whereby the driver chip 2 and LED chip 3 are soldered to the substrate for the establishment of connection. During this process, the solder bump 4 and solder paste 5 prevent the driver chip 2 and LED chip 3, respectively, from moving from the prescribed locations. After the connection of the driver chip 2 and LED chip 3 to the substrate 1 with solder, the LED chip 3 and a wiring pattern 1a belonging in the substrate 1 are connected by a gold wire 6. This greatly reduces the manhours demanded in the manufacturing process.

7. 发明专利

JPS57159670A ADHERING METHOD 失效
公开(公告)号：JPS57159670A
公开(公告)日：1982-10-01
申请号：JP4388181
申请日：1981-03-27
申请人： HITACHI LTD
发明人： SAKASHITA YASUYUKI
IPC分类号： B29C65/00 , B29C55/00 , B29C65/48 , B29C65/78 , B41J2/335 , C09J5/00
摘要： PURPOSE:To reduce the rate of occurrence of defective products by making smaller the difference in height to be generated at the butted portions of parts by using such a method wherein the edge of a part is fastened to a holder plate by screws with a piece of rubber placed inbetween and a basic material and the part are adhered to each other by causing an adhesive to harden and then the piece of rubber and the holder plate are removed. CONSTITUTION:Screw holes 5 are caused to penetrate through a basic material 1 and parts 3A, 3B are held and fixed between the basic material 1 and a holder plate 4, and cylindrical rubber pieces 6A, 6B are inserted and screws 7A, 7B are tightened with a fixed torque applied. The edge portions of parts 3A, 3B are pressed against the holder plate 4 by pushing the rubber pieces 6A, 6B and after an adhesive 2 is hardened and the basic material and parts 3A, 3B are adhered to each other, screws 7A, 7B, rubber pieces 6A, 6B and the holder plate 4 are removed.

8. 发明专利

JPS56126180A FORMING METHOD FOR SUBSTRATE FOR HEAT-SENSITIVE RECORDING HEAD 失效
公开(公告)号：JPS56126180A
公开(公告)日：1981-10-02
申请号：JP2806980
申请日：1980-03-07
申请人： HITACHI LTD
发明人： MAEDA HIROTO , HARADA YOSHIAKI , SAKASHITA YASUYUKI
IPC分类号： B41J2/335
摘要： PURPOSE:To enable forming of a subject substrate which has a flat surface even if there is a difference in the thickness of the base plates, by a method wherein, after elastic substances are inserted between a base and each base board, the lamination is pressed through the medium of an adhesive agent. CONSTITUTION:Recesses 8A, 8B, and 8C are formed in a part of an upper surface of a base 3, and O-links or other elastic substances 6A, 6B, and 6C are inserted into the recesses 8A-8C respectively. Base boards 1 and 2 are then placed through the medium of an adhesive agent 4, and the outer layers of the base boards 1 and 2 are pressed downward by means of a jig 7. The elastic substances 6A-6C are contracted (D1-D3) corresponding to the thickness of the base boards 1 and 2, and a desired base board having no stage between printing surfaces 5A and 5B is formed.

9. 发明专利

JPH0367843A FILM TENSION CONTROL MECHANISM 失效
公开(公告)号：JPH0367843A
公开(公告)日：1991-03-22
申请号：JP20098789
申请日：1989-08-02
申请人： HITACHI LTD
发明人： MATSUMOTO SHOGO , WATANABE MICHIHIRO , SAKASHITA YASUYUKI
IPC分类号： B65H23/182 , B65H23/195
摘要： PURPOSE:To easily set initial rotating torque by providing a torque limiter in a film tension control mechanism in order to change frictional force according to a diameter of a film roll so as to control film tension to be kept almost constant. CONSTITUTION:A torque limiter 30 is provided on a film tension giving device 40 arranged side by side on either a feeding film roll 1 or a winding film roll. The torque limiter 30 controls rotation torque of the feeding film roll 1 by means of frictional force for keeping film tension almost constant according to the change of the diameter of either the feeding film roll 1 or the winding film roll. In this constitution, the torque limiter 30 can be assembled from one side of a shaft, and can be connected to a film carrying device as a set.

10. 发明专利

JPH0130628B2 失效
公开(公告)号：JPH0130628B2
公开(公告)日：1989-06-21
申请号：JP4388181
申请日：1981-03-27
申请人： HITACHI LTD
发明人： SAKASHITA YASUYUKI
IPC分类号： B29C65/00 , B29C55/00 , B29C65/48 , B29C65/78 , B41J2/335 , C09J5/00

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