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1. 发明专利

JPH05298961A 失效
公开(公告)号：JPH05298961A
公开(公告)日：1993-11-12
申请号：JP10150092
申请日：1992-04-22
申请人： HITACHI LTD
发明人： MAKINO SATOSHI , KOIKE JUNICHI
IPC分类号： H01H13/70 , H01L23/36 , H01L23/40 , H05K7/20
摘要： PURPOSE:To improve the heat radiation efficiency of a portable electronic computer. CONSTITUTION:The portable electronic computer is constructed so that heat generated at a semiconductor integrated circuit housed in the equipment body 2b in a note-type personal computer 1a may eascape from the key top 4a and the key base of a key input 4. A fin 4a1 is formed at the side of the key top 4a, and also the key top 4a and the key base 4b are made up of metal whose coefficient of thermal conductivity is high.

2. 发明专利

JPH11121643A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11121643A
公开(公告)日：1999-04-30
申请号：JP27688997
申请日：1997-10-09
申请人： HITACHI LTD
发明人： MAKINO SATOSHI
IPC分类号： H01L23/12 , H01L23/36 , H05K1/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To efficiently radiate heat from a semiconductor chip, without increase in cost. SOLUTION: This device comprises a package board 2 having a ground plate 10 as an inner conductive layer, a semiconductor base 3 which is mounted faceup on the surface of the board 2 and sealed with a patting resin 9, and solder bumps 4 formed on the back side of the board 2, including thermal bumps 4b for removing the heat generated from the base 3 to a mounting circuit board, through thermal through-holes 13 connected to the ground plane 10 through an inner layer of the board 2, thus removing part of the heat generated from the base 3 to the circuit board via the plane 10, through-holes 12 and input/ output bumps 4a.

3. 发明专利

JPH08330351A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH08330351A
公开(公告)日：1996-12-13
申请号：JP13041095
申请日：1995-05-29
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MAKINO SATOSHI , YOSHIDA NOBUO , SHIRAI MASAYUKI , OKINAGA TAKAYUKI , KIKUCHI YOSHIFUMI
IPC分类号： H01L21/60
摘要： PURPOSE: To completely prevent the wires, which connects the bonding pad of a semiconductor chip and the inner lead of a lead frame, from coming into contact with each other in a multipin LSI package by a method wherein the bonding pads on the inner circumferential side and the bonding pads on the outer circumferential side are arranged in zigzags. CONSTITUTION: Bonding pads 7 are connected to buffer circuits 8 respectively through wirings 10. The bonding pads 7 are arranged in zigzags, and wires 6, with which the bonding pads 7 on the inner circumferential side and leads 5 are connected, pass through almost middle of the two bonding pads 7 on the outer circumferential side neighboring to the bonding pads 7 on the inner circumferential side of the wires 6. Besides, the extended part of the wires 6, which connect the outer circumferential side bonding pads 7 and the leads 5, are arranged in such a manner that they pass through almost middle of the two bonding pads 7 on the inner circumferential side adjacent to the bonding pads 7 on the circumferential side.

4. 发明专利

JPH07147367A LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING IT 失效
公开(公告)号：JPH07147367A
公开(公告)日：1995-06-06
申请号：JP29323893
申请日：1993-11-24
申请人： HITACHI LTD
发明人： MAKINO SATOSHI , YOSHIDA NOBUO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To increase the strength of dam bars so as to prevent the deformation of the outer lead section of a lead frame at the molding time or carrying time of the lead frame by making the width of the dam bars twice or more as broad as that of the outer lead section. CONSTITUTION:The width A of a dam bar 5 integrally formed at the middle section of a lead 4 is made twice or more as broad as the width B of the outer lead section 4b of the lead 4. As a result, the deterioration of the strength of the dame bar 5 can be prevented even when the width B or pitch of the outer lead section 4b is reduced. Therefore, the deformation of the outer lead section 4b integrally formed with the dam bar 5 can be prevented, because the deformation of the dam bar 5 is prevented even when the pressure of a molten resin injected into a metallic mold becomes uneven and a high pressure is applied to part of the dam bar 5 at the time of sealing part of a lead frame 1 with a resin. Since the leads 4 are hardly deformed even during the carrying time of the lead frame 1 also, the manufacturing yield of a QFP can be improved.

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