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    • 10. 发明专利
    • MANUFACTURE APPARATUS
    • JPS6252938A
    • 1987-03-07
    • JP19194985
    • 1985-09-02
    • HITACHI TOKYO ELECTRONICSHITACHI LTD
    • TAKASUGI NOBUHIROKYOMASU RYUICHIHIDAKA HIDEKI
    • H01L21/60
    • PURPOSE:To realize highly reliable bonding by a method wherein a limiting circuit, which limits a current supplied to a driving motor of a servomechanism which operates a bonding tool vertically, sets the limit value at about the same time as the tool lands on an object to be bonded. CONSTITUTION:A microcomputer 11 predetermines a bonding tool load suitable for wire-bonding of a semiconductor structure 6 in accordance with the type of an object to be bonded and calculates the current value applied to a voice coil motor 8 so as not to make the tool load exceed the predetermined load. A current limiting circuit 16 is controlled synchronously with the vertical operation of a bonding arm 4 and is so programmed as to be operated at about the same time as, preferrably immediately before, a bonding tool 5 lands on the semiconductor structure 6. Immediately before the landing, the current limiting circuit 16 sets the limit value of the saturated current of an amplifier 13 to limit the maximum torque induced in the voice coil motor 8 after landing.