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    • 7. 发明专利
    • MAGNETIC HEAD
    • JPH08106616A
    • 1996-04-23
    • JP24364894
    • 1994-10-07
    • HITACHI LTD
    • AONO HIDEKIKUDO KAZUEKAWABE TAKASHIAIHARA MAKOTO
    • G11B5/49G11B5/60G11B21/21
    • PURPOSE: To simply manufacture a magnetic head at a low cost without using adhesives for fixing and soldering, etc., for electric conduction when a magnetic head element is mounted on wiring incorporated type suspension. CONSTITUTION: This magnetic head is constituted of the magnetic head element 1 coming into contact with a recording medium and the wiring incorporated type suspension 2 provided with a magnetic head holding hole 5 having projection parts 4a, 4b, 4c inside of the suspensions. By inserting the magnetic head element 1 into the magnetic head hold hole 5, the magnetic head element 1 is fixed and supported to the wiring incorporated type suspension 2 by the projection parts 4a, 4b, 4c, and the electric conduction is also obtained by bringing into contact between connection terminals 1b, 3a. Further, supporting points where the magnetic head element are fixed and supported to the wiring incorporated type suspension 2 become close to a magnetic recording medium, not shown in figure, compared with a usual method.
    • 9. 发明专利
    • METHOD AND DEVICE FOR EVALUATING RELIABILITY OF WIRING
    • JPH06273479A
    • 1994-09-30
    • JP5839093
    • 1993-03-18
    • HITACHI LTD
    • FUKADA SHINICHIKUDO KAZUEMINEMURA TETSUO
    • G01R31/02G01R31/26H01L21/3205H01L21/66H01L23/52H05K10/00
    • PURPOSE:To evaluate conduction life without depending on wiring length by completing the measurement, of a sample wiring length at a point when the shortest conduction life is obtained out of the conduction life of a plurality of samples. CONSTITUTION:A sample 21 and Si substrate 21 are placed inside a constant- temperature bath 30. A constant current is applied from current terminals 23 and 24 through a power supply 31. At the same time, the voltage among voltage terminals 25-29 which are spaced equally is measured 32 and then the resistance between the voltage terminals is calculated according to the relationship between current and voltage. The distance between the voltage terminals is changed from 100 to 100mum for evaluation. The point when wiring resistance increases by 20 % in reference to the point where the resistance becomes stable and reaches a constant value is set as the conduction life of the sample. As the wiring length is reduced, the distribution of the conduction life is increased but the conduction life cannot be reduced without any limitation and a shortest value Lt0 exists. Namely, the conduction life is longer than Lt0 regardless of the wiring length. By estimating the wiring life with Lt0, a highly reliable evaluation can be obtained. Also, it is sufficient if a life which is approximately 20% of the entire part is made known and evaluation can be made quickly.
    • 10. 发明专利
    • THERMOSENSITIVE HEAD
    • JPH02160560A
    • 1990-06-20
    • JP31389588
    • 1988-12-14
    • HITACHI LTD
    • KUDO KAZUEKOIZUMI MASAHIROSUZUKI HITOSHIONUKI HITOSHI
    • B41J2/345
    • PURPOSE:To increase the reliability of a junction on a bonded wire by forming only the peripheral area of a thermal resistor on a ceramic substrate, minimizing the area of the ceramic substrate and connecting a conductor and a drive IC to the thermal resistor on a wired substrate where the drive IC is mounted by wire bonding technique. CONSTITUTION:A ceramic substrate 2 where a thermal resistor 1 is formed and a wired substrate 6 where a drive IC 5 is mounted, are fixed in an adjacent position to each other. A conductor 7 connected to the thermal resistor continues to the surface of the wired substrate 6, and is electrically connected to the drive IC with a bonded wire 4 on the substrate. The conductor is formed upto the side of the substrate by an electric connection between the two substrates. Then the two substrates are electrically bonded together by a mutual adhesion method in which the conductor is formed upto the side of the substrate. As an alterative method, the substrates are electrically connected with conductive resins such as soldering paste 8 applied to an area between the conductors after formation of the conductor on each substrate.