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    • 8. 发明专利
    • SAFETY DEVICE
    • JPS5824876A
    • 1983-02-14
    • JP12444882
    • 1982-07-19
    • HITACHI LTD
    • SHIMADA JIYUICHIFUKUZAWA TADASHIMORIOKA MAKOTOKUMADA AKIOKURATA KAZUHIROKOGA YASUSHISEKO TAKESHI
    • B60R21/00B60W30/00G01S17/88G01S17/93
    • PURPOSE:To achieve a highly sensitive detection by arranging a light transmitter with a light emitting diode as light source and a light receiver with a sensitivity to light emitted therefrom to receive light with the receiver as reflected from a target after it is irradiated thereto with a specified directivity by the transmitter. CONSTITUTION:An infrared light emitting diode 81 projects light in the direction determined by a projector once focused with a lens 82 as modulated light under a repeated pulse modulation of a 10% duty, 1musec, with a pulse oscillator 83 and a pulse amplifier 85. The light thus projected is reflected from a vehicle ahead and as the reflected light 86, it is converted into an electrical signal with an Si photodetector 89 via a condensor 88. Noise light components are removed from this electrical signal with a tuning circuit 90 adapted to only tune in the infrared light projected. Then, after amplified with an amplifier 91, it is converted into direct current with a rectifier circuit 92 and taken into a microcomputer 94 as digital signal through a digital-analog converter 93. Depending on CH1 and CH2 signals, an operation circuit 95 of an alarm is actuated as required to give a warning to an alarm 96.
    • 9. 发明专利
    • PHOTO SEMICONDUCTOR DEVICE
    • JPS5857760A
    • 1983-04-06
    • JP15628281
    • 1981-10-02
    • HITACHI LTD
    • OOUCHI HIROBUMIMATSUDA HIROSHIMORIOKA MAKOTOKAWADA MASAHIKOKURATA KAZUHIROKOGA YASUSHI
    • H01L31/107H01L31/10
    • PURPOSE:To improve dark current, junction capacitance and photo-electric conversion efficiency by laminating semiconductor layer considering the forbidden energy band width and impurity concentration thickness. CONSTITUTION:The n-InP 12 in the thickness of 1.5mum and the In1-xGaxAsyPy-1 14 with the thickness of 1.3mum and narrow forbidden energy band width which will becomes the active region are stacked on the n -InP substrate 11. Here, it is intended to increase light sensitivity by selecting x and y in such a relation that 0.47>=x>=0.25, y=x(0.48043+0.00327x) . Moreover, as the window layer, the n- InP 14 with wide forbidden energy band width and thickness of 1.8mum and the n-In1-xGaxAsyP1-y 15 of 0.2mum are stacked, the surface is covered with the SiO2 and an aperture is opened to the layer 15, and the Cd is diffused to the layer 14, thereby the p layer 16 in the depth of 0.7mum, reflection preventing film 17', surface protection film 17 and electrodes 18, 19 are formed. According to this structure, the characteristic of layer interface is stabilized and a dark current is decreased. A high performance photo semiconductor device can be obtained by setting the impurity concentrations of layers 13 and 14 as follow, N14>=N13, N cm .