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1. 发明专利

JPH04280696A HIGH INTEGRATED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04280696A
公开(公告)日：1992-10-06
申请号：JP4389091
申请日：1991-03-08
申请人： HITACHI LTD
发明人： ENDO TSUNEO , DOBASHI YOSHIO
IPC分类号： H01L25/18 , H01L25/10 , H01L25/11 , H05K1/14 , H05K1/18 , H05K3/34
摘要： PURPOSE:To enable a semiconductor module to be prevented from increasing in two-dimensional size even if chips are enhanced in number by a method- wherein wiring boards mounted with semiconductor chips are laminated to constitute a laminated structure, the laminated structure is mounted on one side or both the sides of a mother board provided with a through-hole, and the lead wires of the wiring boards are connected penetrating the through-hole of the mother board. CONSTITUTION:Wiring boards 2 mounted with semiconductor chips 1 are arranged nearly in parallel overlapping each other at a prescribed space to constitute laminated structures 100A and 100B, and the laminated structures 100A and 100B are mounted on the side or both the sides of a mother board 10 provided with a through-hole 4. The wiring boards 2 are electrically connected together with at least a single lead wire 7 which penetrates the through-hole 4 of the mother board. The front and the rear of each wiring board 2 are electrically connected together through the through-hole 4, and the through-holes 4 provided to the wiring boards 2 and the mother board 10 are so positioned as to be arranged in a line when the laminated structures 100A and 100B are mounted on the mother board 10.

2. 发明专利

JPS61268391A APPARATUS FOR MAKING PURE WATER 失效
公开(公告)号：JPS61268391A
公开(公告)日：1986-11-27
申请号：JP11034985
申请日：1985-05-24
申请人： HITACHI LTD
发明人： SAKAMOTO MINORU , DOBASHI YOSHIO
IPC分类号： C02F1/00 , H01L21/304
摘要： PURPOSE:To enhance washing efficiency, by connecting a carbon dioxide supply part to a pure water supply route reaching a pure water using part from a pure water supply source. CONSTITUTION:In a carbon dioxide supply part 13, carbon dioxide sent out from a carbon dioxide source 6 is brought to predetermined pressure by a regulator 7 and reaches a filter 10 through a flowmeter 8 and a solenoid valve 9 to remove impurities therein and met with pure water flowing through supply piping 4 through a reverse flow preventing valve 11 and an opened valve 12 to be dissolved therein. The specific resistance value of pure water having carbon dioxide dissolved therein and lowered in the specific resistance value is detected by a specific resistance meter 14. The opening degree of the solenoid valve 9 is adjusted on the basis of the detected resistance value and the amount of carbon dioxide is controlled and the specific resistance value of pure water is sent to a precdetermined value. By this method, workability is enhanced and productivity is improved.

3. 发明专利

JPH08213418A MANUFACTURE OF SEMICONDUCTOR DEVICE AND MOLD USED FOR THE MANUFACTURE THEREOF 失效
公开(公告)号：JPH08213418A
公开(公告)日：1996-08-20
申请号：JP1562295
申请日：1995-02-02
申请人： HITACHI LTD
发明人： DOBASHI YOSHIO , ARAI NORINAGA
IPC分类号： B29C45/26 , B29C45/02 , B29L31/34 , H01L21/56
摘要： PURPOSE: To provide technology for preventing the warpage of a printed board in the case of manufacturing a semiconductor device in which a sealer made of resin is formed on one surface of the board. CONSTITUTION: A method for manufacturing a semiconductor device in which a sealer 3 made of resin 34 is formed on one surface of a printed board 2 comprises the steps of previously setting a protruding pedestal 35 substantially corresponding to a sealing unit for forming the sealer at the mold surface in direct contact with the board in a mold 25 used at the time of forming the sealer, and forming the sealer in the state that the board is inverted upside down at the time of clamping the mold 25. Even if the board is deformed due to the curing shrinkage of the resin after sealing, the board is molded in the state that the board is previously reversely warped, and hence the board becomes substantially flat due to the warpage by the shrinkage.

4. 发明专利

JPH07176675A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH07176675A
公开(公告)日：1995-07-14
申请号：JP6678994
申请日：1994-03-09
申请人： HITACHI LTD
发明人： DOBASHI YOSHIO , ENDO TSUNEO
IPC分类号： H01L23/12 , H01L21/52 , H01L23/50 , H01L25/04 , H01L25/18 , H05K1/14 , H05K3/28 , H05K3/34
摘要： PURPOSE:To form a joint of solder material in a resin sealed body while preventing insufficient joint, swelling of resin sealed body or cracking after reflow soldering work. CONSTITUTION:A hybrid IC 36 comprises an inner board and a body 34 for resin sealing the entirety wherein a passive element 26 is connected electrically and mechanically to the inner board at a soldering part 27 in the resin sealed body 34. The outer lead 19b of the hybrid IC 36 is connected with a printed wiring board 60 at a reflow soldering part 63. An inner soldering part 27 is formed of a solder material having a melting point higher than that of solder material at the reflow soldering part 63. At the time of reflow soldering of the outer lead 19b to the printed wiring board 60, the high melting point soldering part 27 in the resin sealed body 34 is not fused and thereby the joint 27 is not open-circuited nor short-circuited. Furthermore, since the solder material is not fused in the resin sealed body, the resin sealed body 34 is not swollen nor cracked.

5. 发明专利

JPH09199667A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09199667A
公开(公告)日：1997-07-31
申请号：JP804296
申请日：1996-01-22
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , MATSUMOTO KUNIO , TSUNODA SHIGEHARU , ENDO TSUNEO , DOBASHI YOSHIO
IPC分类号： H01L25/18 , H01L25/04
摘要： PROBLEM TO BE SOLVED: To reduce the move of wire at resin sealing and to increase mounting density by mounting semiconductors with center pads on a multilayer wiring board. SOLUTION: A multilayer wiring board 1 and a multilayer wiring board 2 are electrically connected and mounted on a tab 3, and a semiconductor element 4a to which circumference pads are arranged is mounted. A semiconductor element 4b with the pads arranged around the centerline of it is mounted between the multilayer wiring board 1 and the multilayer wiring board 2 and sealed with molding resin 5. Outer leads 6 and inner leads 7 for the connection to an external printed board are provided and between the semiconductor element 4a and the multilayer wiring board 1, between semiconductor elements 4b and the multilayer wiring board 1 and between the multilayer wiring board 1 and the inner leads 7 are connected by wire 8. With this, the bending of wire at resin sealing is reduced.

6. 发明专利

JPH08139218A HYBRID INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH08139218A
公开(公告)日：1996-05-31
申请号：JP27320294
申请日：1994-11-08
申请人： HITACHI LTD
发明人： DOBASHI YOSHIO , MAEJIMA NOBUYOSHI , ENDO TSUNEO
IPC分类号： H01L23/28 , H01L21/56 , H01L23/02 , H01L23/13 , H01L23/50
摘要： PURPOSE: To prevent a resin flash from sticking to the exposed surface of a radiating plate in a hybrid integrated circuit device, by performing its transfer molding while clamping up and down through ejecting elements the supporting plate for supporting its ceramic board in the case of its transfer molding. CONSTITUTION: A lead frame 4 is clamped between lower and upper forms 33, 34 of a molding form 32, and a cavity 35, a runner 36, a gate 37 and the like are formed. In the lower and upper forms 33, 34, electing elements 33a, 33b made of an elastic substance are provided in the opposite parts to each other, and a supporting plate 5 is sandwiched between them. Therefore, the rear surface of a radiating plate 15 fastened to a ceramic board 9 is adhered tightly to the bottom of the cavity 35, and thereby, resin is prevented from flowing into the clearance between the bottom of the cavity 35 and a radiating surface 16 of the radiating plate 15. Also, in the cavity 35, the supporting plate 5 and the ceramic board 9 are prevented from vibrating up and down. Therefore, after the transfer molding of a hybrid integrated circuit device, resin flash is prevented from being generated on the radiating surface 16 of the radiating plate 15.

7. 发明专利

JPH04329659A HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04329659A
公开(公告)日：1992-11-18
申请号：JP10009391
申请日：1991-05-01
申请人： HITACHI LTD
发明人： DOBASHI YOSHIO , ENDO TSUNEO
IPC分类号： H01L23/50 , H05K1/00
摘要： PURPOSE:To provide a hybrid integrated circuit device using a lead frame having excellent mass productivity and a low production cost. CONSTITUTION:Seats 7, 10 made of semispherical recesses in which parts of solder semispheres (metal balls 6) are contained, are provided at an electrode terminal 9 of a circuit board 5 disposed at inner ends of leads on front and rear surfaces of the inner ends 4 of the leads. In order to connect the inner ends of the leads to the board, the terminal is inserted between the seat 7 of the inner end of the lead and the seat of the terminal, the ball is melted by reflowing to connect the inner end of the lead to the board. The inner end of the lead is accurately secured to the board by an effect of the seats. A connecting cost is reduced by using the inexpensive solder sphere. Electronic components are placed on the front and rear surfaces of the board to be enhanced in density and highly integrated.

8. 发明专利

JPH04171847A HYBRID INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH04171847A
公开(公告)日：1992-06-19
申请号：JP29942390
申请日：1990-11-05
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： DOBASHI YOSHIO , ENDO TSUNEO , AKAZAWA IKUO
IPC分类号： H05K1/11 , H01L23/12 , H01L25/00
摘要： PURPOSE:To contrive an increase in the use efficiency of a wiring board as well as to contrive an increase in the density of a hybrid integrated circuit device and a miniaturization of the device by a method wherein wiring and a through hole part are provided in the region of a part of the wiring board, on which an electronic component is mounted. CONSTITUTION:A wiring 17 and a through hole part 16 constituting one part of the wiring 17 are provided at a chip mounting region 26 for mounting a semiconductor chip 24. Wire bonding pads 13 are arranged in a row on the periphery of the region 26. In such a way, a wirable region is increased by providing the wiring 17 and the hole part 16 at the region 26, where has not utilized hitherto and is wide in area, and the degree of freedom of the design of wiring is increased. Moreover, an unused wiring region in a region, on where an electronic component is not mounted, of a wiring board is widened by using the region 26 for the use of the wiring, the mounting of the electronic component and the formation of the wiring become possible and an increase in the function of a hybrid integrated circuit device and an increase in the integration of the device become possible. In the case the unused wiring region is not used, the wiring board 4 can be made small by the amount of the unused wiring region and a miniaturization of the device becomes possible.

9. 发明专利

JPH04155856A HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04155856A
公开(公告)日：1992-05-28
申请号：JP28148790
申请日：1990-10-18
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： DOBASHI YOSHIO , ENDO TSUNEO , AKAZAWA IKUO
IPC分类号： H05K1/14 , H01L21/52 , H01L25/00 , H05K1/18
摘要： PURPOSE:To enable a hybrid integrated circuit device to be enhanced in density by a method wherein a wiring board is fixed to each of the front and the rear side of a support, and electronic components are fixed to these wiring boards. CONSTITUTION:A hybrid integrated circuit device is composed of a package 1 and leads 2 extending outward from the peripheral surface. A tab 3 of a lead frame is provided inside the package 1. Wiring boards 4 and 5 are fixed to the front and the rear side of the tab 3 through the intermediary of bonding materials 6 and 7. On other hand, a chip resistor 13, a chip capacitor 14, and a semiconductor chip 12 are mounted on the front sides of the boards 4 and 5, where the electrodes of the semiconductor chip 12 are wire-bonded to wire bonding pads 16 with wires 17 of excellent conductivity. Thin electronic components such as a chip resistor 13, a chip capacitor 14, and the like which are not required to be wire-bonded are mounted on the other sides of the wiring boards 4 and 5.

10. 发明专利

JPH08213531A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08213531A
公开(公告)日：1996-08-20
申请号：JP1568195
申请日：1995-02-02
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , SAEKI JUNICHI , TSUNODA SHIGEHARU , ENDO TSUNEO , DOBASHI YOSHIO
IPC分类号： H01L25/18 , H01L23/50 , H01L25/04
摘要： PURPOSE: To provide a semiconductor device which is improved in heat dissipating properties to dissipate out heat released from a semiconductor element. CONSTITUTION: A board 1 is mounted on a frame-shaped tab 2, and a semiconductor element 3 is mounted on the board 1 and sealed up with a molding resin 4, heat dissipating leads 8 are provided to the frame-shaped tab 2 extending towards the ends of the outline sides of the resin 4, and the parts of the heat dissipating leads 8 protruding from the resin 4 are formed identical in the shape to outer leads 6.

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