专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2001042527A PHOTOSENSITIVE POLYMER COMPOSITION, PRODUCTION OF PATTERN AND ELECTRONIC PARTS 失效
公开(公告)号：JP2001042527A
公开(公告)日：2001-02-16
申请号：JP21547599
申请日：1999-07-29
申请人： HITACHI CHEMICAL CO LTD , HITACHI LTD
发明人： NUNOMURA MASATAKA , OE TADAYUKI , YAMAZAKI NORIYUKI , ANZAI TAKANORI , FUJIEDA NAGATOSHI , OKABE YOSHIAKI
IPC分类号： H01L21/027 , C08G59/50 , C08G73/10 , C08K5/03 , C08K5/13 , C08K5/19 , C08K5/21 , C08K5/28 , C08K5/3492 , C08L79/08 , G03F7/004 , G03F7/022 , G03F7/037 , G03F7/40
摘要： PROBLEM TO BE SOLVED: To obtain a positive type heat resistant photosensitive polymer composition having high sensitivity and forming a pattern which is hardly deformed by heating after development, to produce a pattern having high resolution and a good shape and to obtain high reliability electronic parts by using the pattern. SOLUTION: The photosensitive polymer composition contains (a) a polyimide soluble in an aqueous alkali solution or its precursor, (b) a compound which generates an acid under light, (c) a compound having a phenolic hydroxyl group and (d) a compound which causes a crosslinking reaction with the component (a) under heat. The photosensitive polymer composition is applied on a substrate, dried, exposed, developed and heated to produce the objective pattern. Each of the electronic parts has the pattern as a surface protecting film or an interlayer insulating film.

2. 发明专利

JPH11174679A POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF RELIEF PATTERN 失效
公开(公告)号：JPH11174679A
公开(公告)日：1999-07-02
申请号：JP33981797
申请日：1997-12-10
申请人： HITACHI CHEMICAL CO LTD
发明人： SASAKI MAMORU , NUNOMURA MASATAKA , OE TADAYUKI , ANZAI TAKANORI , UCHIMURA SHUNICHIRO
IPC分类号： G03F7/027 , G03F1/68 , G03F1/80 , G03F7/028 , G03F7/039 , H01L21/027 , G03F1/08
摘要： PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition extremely high in sensitivity to active light such as i-line and capable of forming a satisfactory pattern by using an alkaline water solution, and a manufacturing method enabling a satisfactory relief pattern to be formed by exposure of active light such as i-line and by development using the alkaline developer. SOLUTION: In a positive photosensitive resin composition including (A) a polyimide precursor having a carboxyl radical or a phenolic hydroxyl radical, and (B) a compound producing an acid by light, the (A) constituent is a mixture of two kinds of polyimide precursors a ratio of whose dissolving speeds is 5 or more in an alkaline water solution, and, in a manufacturing method for a relief pattern, this positive photosensitive resin composition is spread over a substrate, dried, thereafter irradiated with active light, developed by the alkaline water solution, and heated.

3. 发明专利

JP2008257263A Photosensitive polymer composition, method for producing pattern and electronic component 有权
标题翻译：光敏聚合物组合物，生产图案和电子元件的方法
公开(公告)号：JP2008257263A
公开(公告)日：2008-10-23
申请号：JP2008131151
申请日：2008-05-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： NUNOMURA MASATAKA , OE TADAYUKI , YAMAZAKI NORIYUKI , ANZAI TAKANORI , FUJIEDA NAGATOSHI , OKABE YOSHIAKI
IPC分类号： G03F7/004 , C08G73/10 , G03F7/023 , G03F7/40
摘要： PROBLEM TO BE SOLVED: To provide a positive-type heat-stable photosensitive polymer composition which has high sensitivity and ensures small deformation of a pattern by heat treatment after development, a method for producing a pattern by which a high-resolution pattern of proper profile is obtained, and high-reliability electronic components.
SOLUTION: The photosensitive polymer composition comprises (a) a polyimide precursor or polyimide, having a carboxyl group or a phenolic hydroxyl group and being soluble in an aqueous alkali solution; (b) an o-quinonediazide compound capable of generating acid under light; (c) a compound having a phenolic hydroxyl group; and (d) a compound which causes a crosslinking reaction with the component (a) under heat, wherein the component (c) contains a compound represented by general formula (II). The photosensitive polymer composition is used as a photosensitive polymer composition for forming surface protective films or interlayer insulation films of electronic components.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种具有高灵敏度并且通过显影后的热处理确保图案的小变形的正型热稳定性光敏聚合物组合物，提供了一种用于制造高分辨率图案的图案的方法获得正确的型材，以及高可靠性的电子元器件。光敏聚合物组合物包含（a）具有羧基或酚羟基并可溶于碱水溶液的聚酰亚胺前体或聚酰亚胺; （b）能够在光下产生酸的邻醌二叠氮化合物; （c）具有酚羟基的化合物; 和（d）在加热下与组分（a）发生交联反应的化合物，其中组分（c）含有由通式（II）表示的化合物。光敏聚合物组合物用作用于形成电子部件的表面保护膜或层间绝缘膜的光敏聚合物组合物。版权所有（C）2009，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式