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1. 发明专利

JPH0837374A MULTILAYERED COMPOSITE WIRING BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH0837374A
公开(公告)日：1996-02-06
申请号：JP16953694
申请日：1994-07-21
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUYAMA KOICHI , NAKASO AKISHI , OTSUKA KAZUYOSHI , OGINO HARUO , KIDA AKINARI , TAMURA YOSHIHIRO
IPC分类号： H05K1/02 , H05K1/14 , H05K3/00 , H05K3/36 , H05K3/46
摘要： PURPOSE:To provide an inexpensive high-density multilayered composite wiring board by constituting the wiring board in such a way that part of a substrate housing multilayered wiring is branched at flexible wiring layers and the part of the substrate. CONSTITUTION:As shown in the figure, part of a substrate housing multilayered wiring is branched at flexible wiring layers and the part of the substrate. A base material composed of glass fabric and a thermosetting resin is used for the part of the substrate except the extended part of the flexible wiring layers. It is possible to form an interlayer connecting hole through the base material so as to electrically connect the wiring which is flush with the flexible wiring layer to wiring immediately below the wiring layer. Therefore, a multilayered wiring board can be constituted in such a way that the interlayer connecting hole for IVH connection useful for increasing the wiring density can be easily formed. In addition, the flexible wiring layer part can be easily connected to another wiring board or electric parts.

2. 发明专利

JPH09135076A FABRICATION OF MULTILAYER PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH09135076A
公开(公告)日：1997-05-20
申请号：JP29264095
申请日：1995-11-10
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKASO AKISHI , ARIGA SHIGEHARU , OTSUKA KAZUYOSHI , TSURU YOSHIYUKI , YAMAMOTO KAZUNORI , TAKAHASHI ATSUSHI , INADA TEIICHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of fabricating a multilayer printed circuit board not using glass cloth and simultaneously satisfying the interlayer connection reliability and surface smoothness. SOLUTION: A hole is bored to the predetermined position of a material film having formed an insulated bonding layer at one surface of a copper foil, a hole is also bored to a stop plate at the same position as the film type material, the stop plate and material film having formed the hole are stacked on an internal layer circuit board, a water-soluble cushion material is further stacked and heated and then pressed to form an integrated plate, the stop plate is removed and the water soluble cushion material is dissolved into the water to remove it, a circuit on the internal layer circuit board is electrically connected to copper foil of the material film and the copper foil of material film is processed to form a circuit.

3. 发明专利

JPH0837373A FILM BRIDGING MULTILAYERED WIRING BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH0837373A
公开(公告)日：1996-02-06
申请号：JP16953594
申请日：1994-07-21
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUYAMA KOICHI , NAKASO AKISHI , OTSUKA KAZUYOSHI , OGINO HARUO , KIDA AKINARI , TAMURA YOSHIHIRO
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
摘要： PURPOSE:To obtain a film bridging multilayered wiring board on which wires can be wired at a high density by constituting the wiring board of a plurality of substrates and bridging sections and reinforcing the resin layers of the bridging sections by respectively sticking movable reinforcing layers to one surfaces of the resin layers at least within the extents of the bridging sections. CONSTITUTION:A film bridging multilayered wiring board is provided with a plurality of substrates 1 housing wiring and flexible bridging sections 2 which connect the substrates 1 to each other. Each bridging section 2 is constituted of wiring and a resin layer 4 which is composed mainly of an epoxy resin or phenol resin. In addition, the layer 4 is reinforced by sticking a flexible reinforcing layer to one surface of the layer 4 at least within the extent of the bridging section 2. The substrates 1 housing multilayered wiring have through holes 7, etc., for electrically connecting wiring layers to each other through the substrates 1. Therefore, IVH connection becomes possible and this multilayered wiring board can be applied to such a use that requires high- density wiring.

4. 发明专利

JPH0837378A MANUFACTURE OF MULTILAYERED WIRING BOARD WITH CAVITY 失效
公开(公告)号：JPH0837378A
公开(公告)日：1996-02-06
申请号：JP16953794
申请日：1994-07-21
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUYAMA KOICHI , NAKASO AKISHI , OTSUKA KAZUYOSHI , OGINO HARUO , KIDA AKINARI , TAMURA YOSHIHIRO
IPC分类号： H05K1/18 , H01L23/12 , H05K3/46
摘要： PURPOSE:To reduce the size and thickness of a multilayered wiring board with cavity and, at the same time, to form recessed hole with high accuracy by forming wiring on the bottom of a cavity on the opposite side of a semiconductor chip mounting surface and insulating the wiring from a semiconductor chip with an insulating layer. CONSTITUTION:A cavity for mounting a semiconductor chip 12 is provided in the inner-layer wiring forming material of a substrate and wiring is formed on the bottom of the cavity on the opposite side of a semiconductor chip 12 mounting surface. The wiring is insulated from the chip 12 with an insulating resin layer. In addition, interlayer connecting holes 3 are provided through the bottom of the cavity for electrically connecting the wiring which is flush with the wring layer in the cavity section to wiring immediately below the wiring. At the time of alternately laminating and sticking layers of the inner- layer wiring forming material and adhesive metallic foil 1 upon another and to each other, at least a mold releasing layer which does not stick to the inner wiring forming material is interposed between each layer of the material and foil 1 in a specific section. Therefore, a wiring board with cavity having a small size and thin thickness can be easily manufactured.

5. 发明专利

JPH088537A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH088537A
公开(公告)日：1996-01-12
申请号：JP14002894
申请日：1994-06-22
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKASO AKISHI , TSUYAMA KOICHI , OTSUKA KAZUYOSHI , OGINO HARUO , TAMURA YOSHIHIRO
IPC分类号： H05K3/40 , H05K3/46
摘要： PURPOSE:To improve a plating layer in adhesion to the inner wall of a through- hole by a method wherein the surface of an insulating adhesive agent layer that flows into the through-hole in a thermocompression laminating process is roughened, and the inner wall of the through-hole is plated or conductive paste is filled into the through-hole. CONSTITUTION:A through-hole 3 is bored in an adhesive layer-attached copper foil 1. Then, an inner wiring layer is formed of a copper foil-plated laminated board. The inner wiring board 4 is laminated on the adhesive layer-attached copper foil 1 provided with through-hole 3 and formed into one piece by thermopression. A state that a part of the adhesive layer is melted to flow off is shown in the cross-sectional view of the through-hole 3 outflow part 5). Then, the laminate is dipped into a roughening liquid to roughen the surface of the part 5 where the adhesive, layer flowed off. Then, a conventional electroless plating for underlying layer is carried out, and then a wiring 7 is formed by copper electroplating.

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