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1. 发明专利

HK1027215A1 Broad for mounting semiconductor element, method for manufacturing the same, and semiconductor device 未知
公开(公告)号：HK1027215A1
公开(公告)日：2001-01-05
申请号：HK00106137
申请日：2000-09-27
申请人： HITACHI CHEMICAL CO LTD
发明人： FUKUTOMI NAOKI , WAKASHIMA YOSHIAKI , NAOYUKI SUSUMU , KIDA AKINARI
IPC分类号： H01L20060101 , H01L21/48 , H01L21/60 , H01L23/13 , H01L23/24 , H01L23/31 , H01L23/36 , H01L23/498 , H01L29/06 , H05K3/00
摘要： A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The cavity portion capable of mounting the semiconductor chip (1) at the center portion of the substrate is formed by press forming with a projected portion (13a) of a die (13) while adhering a press shapeable wiring body comprising a copper wiring (12) which becomes wiring material, a barrier layer (11) such as nickel alloy or the like, and a copper foil (10) which is a carrier layer, to a plastic substrate (14,15), so as to have wiring (2) buried into a surface of the substrate and to form a ramp between an inner connection terminal portion connecting to the semiconductor chip (1) and an external connection terminal portion connecting to an external connection terminals (5), the internal and external connection terminal portions being two edge portions of the wiring (2).

2. 发明专利

DE4320316C1 Printed circuit board, multilayer printed circuit board inner layer and multilayer printed circuit board as well as a method for producing the same 未知
公开(公告)号：DE4320316C1
公开(公告)日：1995-01-26
申请号：DE4320316
申请日：1993-06-18
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKASO AKISHI , TSUYAMA KOUICHI , KIDA AKINARI , HATAKEYAMA SHUICHI , URASAKI NAOYUKI
IPC分类号： H05K1/09 , H05K1/11 , H05K3/46 , H05K3/00 , H05K3/06 , H05K3/40 , H05K3/42 , H05K1/02
摘要： In summary, the invention provides a circuit board or printed circuit board comprising one or more inner layer or intermediate layer circuit substrates and outer circuit layers which are constructed from metal foil layers on both sides of the inner layer or intermediate layer circuit substrates via prepregs, the inner layer or intermediate layer circuit substrate comprising an insulating layer and metal foil layers which are constructed on both sides of the insulating layer, and preferably form one or more circuits in each case, at least one inner layer or intermediate layer circuit substrate or the outer circuit layers or both having hollow regions in the metal foil layer which are filled, in particular completely filled, with an electrically conductive substance, the circuit board or printed circuit board furthermore having one or more through holes at least in the hollow regions and filled with the electrically conductive substance; this circuit board or printed circuit board has high reliability and a high conductor or circuit density.

3. 发明专利

AU7082798A Board for mounting semiconductor element, method for manufacturing the same, andsemiconductor device 未知
公开(公告)号：AU7082798A
公开(公告)日：1998-11-24
申请号：AU7082798
申请日：1998-04-30
申请人： HITACHI CHEMICAL CO LTD
发明人： FUKUTOMI NAOKI , WAKASHIMA YOSHIAKI , NAOYUKI SUSUMU , KIDA AKINARI
IPC分类号： H01L21/48 , H01L21/60 , H01L23/13 , H01L23/24 , H01L23/31 , H01L23/36 , H01L23/498 , H01L29/06 , H05K3/00 , H01L23/12
摘要： A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The cavity portion capable of mounting the semiconductor chip (1) at the center portion of the substrate is formed by press forming with a projected portion (13a) of a die (13) while adhering a press shapeable wiring body comprising a copper wiring (12) which becomes wiring material, a barrier layer (11) such as nickel alloy or the like, and a copper foil (10) which is a carrier layer, to a plastic substrate (14,15), so as to have wiring (2) buried into a surface of the substrate and to form a ramp between an inner connection terminal portion connecting to the semiconductor chip (1) and an external connection terminal portion connecting to an external connection terminals (5), the internal and external connection terminal portions being two edge portions of the wiring (2).

4. 发明专利

SG46967A1 Process for producing multilayer printed circuit board 未知
公开(公告)号：SG46967A1
公开(公告)日：1998-03-20
申请号：SG1995002262
申请日：1995-12-21
申请人： HITACHI CHEMICAL CO LTD
发明人： KIDA AKINARI , NAKASO AKISHI , TAKAHASHI ATSUSHI , OTSUKA KAZUHISA , YAMAMOTO KAZUNORI , ARIKE SHIGEHARU , INADA TEIICHI , TSURU YOSHIYUKI
IPC分类号： H05K3/00 , H05K3/02 , H05K3/38 , H05K3/46

5. 发明公开

EP0980096A4 BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE 失效
标题翻译： MONTAGEPLATTEFÜRHALBLEITER ELEMENT HERSTELLUNGS VERFAHREN UND HALBLEITERANORDUNG
公开(公告)号：EP0980096A4
公开(公告)日：2005-03-09
申请号：EP98917736
申请日：1998-04-30
申请人： HITACHI CHEMICAL CO LTD
发明人： FUKUTOMI NAOKI , WAKASHIMA YOSHIAKI , NAOYUKI SUSUMU , KIDA AKINARI
IPC分类号： H01L21/48 , H01L21/60 , H01L23/13 , H01L23/24 , H01L23/31 , H01L23/36 , H01L23/498 , H01L29/06 , H05K3/00 , H01L23/12
CPC分类号： H01L24/85 , H01L21/4803 , H01L23/13 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L29/0657 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/131 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48799 , H01L2224/48824 , H01L2224/48847 , H01L2224/73265 , H01L2224/85 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H05K3/0014 , H01L2224/78 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/01004
摘要： A highly reliable semiconductor device capable of miniaturization and reduction in manufacturing cost with a board having a recessed portion for mounting a semiconductor element. A wiring material capable of draw machining which is constituted of a copper wiring (12) to be a wiring member, a barrier layer (11) comprising a nickel alloy or the like, and a copper foil (10) to be a carrier layer is adhered to a resin board (14, 15) and at the same time pressed by a protrusion (13a) of a mold (13) to form a wiring (2) buried in the surface of the board. Also, by providing a step between an inner connection terminal portion to be connected to a semiconductor element (1) and an outer connection terminal portion to be connected to an outer connection terminal (5), which constitute both ends of the wiring (2), a recessed portion which can house the semiconductor element (1) is formed at a center part of the board.
摘要翻译：提供包括具有用于安装半导体芯片的空腔部分的基板的半导体器件以实现高可靠性并且减小尺寸和制造成本。能够将半导体芯片（1）安装在基板的中心部分的空腔部分通过在模具（13）的突出部分（13a）的压制成型的同时，同时粘附包括铜布线（12）的压制成形布线体），诸如镍合金等的阻挡层（11）和作为载体层的铜箔（10）连接到塑料基板（14,15）上，从而具有布线（2））埋入基板的表面，并且在连接到半导体芯片（1）的内部连接端子部分和连接到外部连接端子（5）的外部连接端子部分之间形成斜坡，内部和外部连接端子部分是布线（2）的两个边缘部分。

6. 发明专利

JP2001127207A SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001127207A
公开(公告)日：2001-05-11
申请号：JP2000288905
申请日：2000-09-22
申请人： HITACHI CHEMICAL CO LTD
发明人： FUKUTOMI NAOKI , WAKASHIMA YOSHIAKI , NAOYUKI SUSUMU , KIDA AKINARI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, which is high in reliability, can be miniaturized, can be reduced in its manufacturing cost and has substrates which are respectively provided with a recessed part for mounting a semiconductor element. SOLUTION: A drawable wiring body, which is constituted of copper wirings 12 which are used as wiring members, a barrier layer 11, such as a nickel alloy layer, and a copper foil 10, which is used as a carrier layer, is bonded to resin substrates 14 and 15 and at the same time, the wiring body is subjected to press processing by the projection part 13a of a metal mold 13, whereby with wirings 2 buried in the surfaces of the substrates formed, steps are provided between semiconductor elements 1 constituting both end parts of the wirings 2 and inner connection terminal parts, which are connected with the elements 1, and between external connection terminals 5 and external connection terminal parts, which are connected with the terminals 5, whereby recessed parts capable of housing the elements 1 are formed in the central parts of the said substrates.

7. 发明专利

JPH0837381A MANUFACTURE OF MULTILAYERED WIRING BOARD WITH TERMINAL 失效
公开(公告)号：JPH0837381A
公开(公告)日：1996-02-06
申请号：JP16954094
申请日：1994-07-21
申请人： HITACHI CHEMICAL CO LTD
发明人： OGINO HARUO , TSUYAMA KOICHI , NAKASO AKISHI , OTSUKA KAZUHISA , KIDA AKINARI , TAMURA YOSHIHIRO
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46 , H01R9/09
摘要： PURPOSE:To manufacture a multilayered wiring board with terminal with high workability and efficiency by cutting off the unnecessary part of an inner-layer wiring forming material from the line of a non-adhesive mold releasing film after the material and adhesive metallic foil are piled up upon another and stuck to each other with the inner-layer wiring material and mold releasing film in between. CONSTITUTION:Adhesive metallic foil which is formed by sticking metallic foil to an adhesive resin layer and through which a hole is formed is put on an inner-layer wiring forming material with a non-adhesive mold releasing film in between (Fig. a). Then the inner-layer wiring forming material and metallic foil are stuck to each other with the inner-layer wiring forming material and metallic foil in between (Fig. b) and wiring is formed in the laminated body (Figs. c-e). Then the end sections of the inner-layer wiring forming material are cut off along the external size of a multilayered wiring board (Fig. g). Therefore, the connection between wiring boards and between wiring boards and electronic parts can be easily made through fewer processes without using any expensive material.

8. 发明专利

JPH06125175A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH06125175A
公开(公告)日：1994-05-06
申请号：JP27422592
申请日：1992-10-13
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKASO AKISHI , TSUYAMA KOICHI , KIDA AKINARI , URASAKI NAOYUKI
IPC分类号： H05K3/46
摘要： PURPOSE:To efficiently manufacture a high-density multilayerd printed wiring board by preventing the flow out of a resin by blocking a hole with copper foil and forming necessary connection with inner layers by plating before forming a laminated layer. CONSTITUTION:After forming a bonding agent layer of an epoxy resin on the surface of the insulating material of a laminated board having the insulating material on at least on surface, the bonding agent layer is dried and a hole is bored in the laminated board through the material with a drilling machine. Then copper foil is stuck to the surface of the laminated body with the bonding agent. Thereafter, electroless copper plating and electroplating are successively performed on the internal surface of the hole. Since the hole is only formed at a location to be connected and the flowing out of a resin is prevented by the copper foil, a high-density multilayer printed wiring board can be efficiently manufactured.

9. 发明专利

JPH05243735A 失效
公开(公告)号：JPH05243735A
公开(公告)日：1993-09-21
申请号：JP4555292
申请日：1992-03-03
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKASO AKISHI , TSUYAMA KOICHI , KIDA AKINARI , HATAKEYAMA SHUICHI , URASAKI NAOYUKI
IPC分类号： H05K3/46 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/40
摘要： PURPOSE:To manufacture the multilayer wiring board by piling-up method, which is high in the dimensional accuracy of a via hole and high in adhesive strength of wiring, by including a process of interposing an unhardened organic film, which does not contain inorganic fiber reinforcing material, between an already wired board and a copper foil where a copper oxide is made at the surface, and uniting them. CONSTITUTION:A copper oxide is made on the surface of a copper foil. Next, an insulating layer 2, which has adhesive property and does not contain inorganic fiber reinforcing material, is made on one side of the copper foil 1. Next, an already wired substrate 4 and thus made laminate are united, being pressurized and heated and laminated. Next, the copper foil at the surface is removed by etching. Next, using excimer layer, a via hole 5 is opened. Next, plating is performed to the via hole 5 and the surface of the substrate by giving a plating catalyst. Next, wiring is made by forming a desired pattern of etching resist, and etching off the plating at the needless part. Next, wirings are piled up, repeating these processes, thus a multilayer wiring board is manufactured.

10. 发明专利

JPH05235519A 失效
公开(公告)号：JPH05235519A
公开(公告)日：1993-09-10
申请号：JP3935192
申请日：1992-02-26
申请人： HITACHI CHEMICAL CO LTD
发明人： URASAKI NAOYUKI , KIDA AKINARI , HATAKEYAMA SHUICHI , NAKASO AKISHI , OTSUKA KAZUHISA
IPC分类号： H05K3/24 , H05K3/42
摘要： PURPOSE:To improve adhesion between nickel plating and gold plating, by a method wherein, after a copper circuit formed on an insulative board is plated with nickel, further nickel plating is performed, and continuously gold plating is performed. CONSTITUTION:After copper oxide 2 is formed on the single surface of a copper foil 1, a plurality of polyimide prepregs containing glass are arranged on the surface, and a lamination body structure is formed by heating and pressing. After a through hole 4 is formed in a desired position, the copper foil l and the copper oxide 2 are eliminated. After the substrate surface of a lamination board 3 is plated with nickel 5, and plating resist 6 is formed on the part except a circuit, plating copper 7 is continuously formed. After the plating resist is exfoliated after electroless plating, the nickel which is unnecessary to conformation with the circuit is eliminated. A nickel-plated layer 5 is formed on the copper wiring side wall and the upper surface of a wiring board, and solder resist 9 is printed. After that, a nickel-plated layer is formed on an exposed part by using electroless nickel plating solution, and continuously electroless gold-plating is performed. After that, thick gold plating 8 is stuck by electroplating, and a wiring board is formed.

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