专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

AU9031401A Resin-sealed semiconductor device, and die bonding material and sealing materialfor use therein 未知
公开(公告)号：AU9031401A
公开(公告)日：2002-04-08
申请号：AU9031401
申请日：2001-09-28
申请人： HITACHI CHEMICAL CO LTD
发明人： KURAFUCHI KAZUHIKO , SUZUKI NAOYA , YASUDA MASAAKI , KAWATA TATSUO , SAKAI HIROYUKI , KAWASUMI MASAO
IPC分类号： C08G59/30 , C08L63/00 , H01L23/29 , H01L23/31 , H01L21/58 , H01L23/28 , C08L63/02 , C08K3/00
摘要： A resin-sealed semiconductor device which comprises a lead frame having a die bond pad and an inner lead, a semiconductor chip installed on the die bond pad via a die bonding material and a sealing material for sealing the semiconductor chip and the lead frame, wherein properties of the die bonding material and the sealing material after curing satisfies the following formulae: sigmae =2.0x10 xsigmaei formula (2) Ud>=4.69x10 xed formula (3) wherein sigmab (MPa)represents the flexural strength at break of the sealing material at 25°, Ui (N.m) and Ud (N.m) represent shear strain energies of the sealing material at a soldering temperature for the inner lead and the die bonding pad, respectively, at a peak temperature during soldering, where sigmae=(1/log(kd1))xEe1x(alpham-alphae1)xDeltaT1 formula (4), sigmaei=Ee2x(alphae2-alpham)xDeltaT2 formula (5), sigmaed=log(kd2)xEe2x(alphae2-alpham)xDeltaT2 Formula (6), kd1: a ratio of the flexural elastic modulus Ed1 (MPa) of the die bonding material at 25° to 1 MPa of elastic modulus (Ed1>1 MPa), kd2: a ratio of the flexural elastic modulus Ed2 (MPa) of the die bonding material at the peak temperature during the soldering to 1 MPa of elastic modulus (Ed2>1 MPa), Ee1: a flexural modulus (MPa) of the sealing material at 25°, Ee2: a flexural modulus (MPa) of the sealing material at the peak temperature during soldering, alphae1: an average thermal expansion coefficient (1/° C.) of the sealing material from forming temperature for the semiconductor to room temperature (25° C.), alphae2: an average thermal expansion coefficient (1/° C.) of the sealing material from the forming temperature for the semiconductor to a peak temperature during soldering, alpham: a thermal expansion coefficient (1/° C.) of the lead frame, DeltaT1: the difference (° C.) between the forming temperature for the semiconductor and the low temperature side temperature in the temperature cycle, and DeltaT2: the difference (° C.) between the forming temperature for the semiconductor and the peak temperature during soldering.

2. 发明专利

SG11201906411TA COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG11201906411TA
公开(公告)日：2019-08-27
申请号：SG11201906411T
申请日：2017-01-11
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKAKO HIDEO , KURAFUCHI KAZUHIKO , EJIRI YOSHINORI , ISHIKAWA DAI , SUGAMA CHIE , KAWANA YUKI
IPC分类号： B22F1/00 , B22F7/08 , H01B1/00 , H01B1/02 , H01B1/22
摘要： FP0961-00 A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles 5 having a volume average particle diameter of greater than or equal to 0.01 pm and less than or equal to 0.8 p.m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 p.m and less than or equal to 50 In, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 10 300°C, and a content of the solvent having a boiling point of higher than or equal to 300°C is greater than or equal to 2 mass% on the basis of a total mass of the copper paste for pressureless bonding. 60

3. 发明专利

MY184948A COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 未知
公开(公告)号：MY184948A
公开(公告)日：2021-04-30
申请号：MYPI2018700888
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWANA YUKI , KURAFUCHI KAZUHIKO , EJIRI YOSHINORI , NAKAKO HIDEO , SUGAMA CHIE , ISHIKAWA DAI
IPC分类号： C04B37/00 , B22F1/00 , B22F7/08
摘要： Provided is copper paste for joining (1) including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles (11) having a volume- average particle size of 0.12 ?m to 0.8 ?m, and micro copper particles (10) having a volume- average particle size of 2 ?m to 50 ?m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.

4. 发明专利

MY184905A ASSEMBLY AND SEMICONDUCTOR DEVICE 未知
公开(公告)号：MY184905A
公开(公告)日：2021-04-30
申请号：MYPI2018700894
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWANA YUKI , KURAFUCHI KAZUHIKO , SUGAMA CHIE , ISHIKAWA DAI , NAKAKO HIDEO , EJIRI YOSHINORI
摘要： Provided is a joined body (100) including: a first member (5); a 5 second member (6); and a sintered metal layer (4) that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles (2) which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer. Figure 2

5. 发明专利

SG11201801844XA COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG11201801844XA
公开(公告)日：2018-04-27
申请号：SG11201801844X
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： ISHIKAWA DAI , KAWANA YUKI , SUGAMA CHIE , NAKAKO HIDEO , EJIRI YOSHINORI , KURAFUCHI KAZUHIKO
IPC分类号： B22F7/08 , B22F1/00 , C04B37/02 , H01B1/00 , H01B1/22 , H01L21/52
摘要： Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 µm to 0.8 µm, and flake-shaped micro copper particles having a maximum particle size of 1 µm to 20 µm, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 µm to 20 µm and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.

6. 发明专利

SG10201913440TA COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG10201913440TA
公开(公告)日：2020-03-30
申请号：SG10201913440T
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： ISHIKAWA DAI , KAWANA YUKI , SUGAMA CHIE , NAKAKO HIDEO , EJIRI YOSHINORI , KURAFUCHI KAZUHIKO
摘要： Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 µm to 0.8 µm, and flake-shaped micro copper particles having a maximum particle size of 1 µm to 20 µm, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 µm to 20 µm and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.

7. 发明专利

SG11201808579TA COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG11201808579TA
公开(公告)日：2018-11-29
申请号：SG11201808579T
申请日：2017-04-20
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWANA YUKI , NAKAKO HIDEO , ISHIKAWA DAI , SUGAMA CHIE , KURAFUCHI KAZUHIKO , EJIRI YOSHINORI
IPC分类号： B22F1/00 , B22F7/08 , B22F9/00 , H01L21/52
摘要： FP0191-00 86 Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 5 0.12 m m or more and 0.8 m m or less and micro copper particles having a volume-average particle diameter of 2 m m or more and 50 m m or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the 10 submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles. 15

8. 发明专利

SG10201913445WA ASSEMBLY AND SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG10201913445WA
公开(公告)日：2020-02-27
申请号：SG10201913445W
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKAKO HIDEO , KURAFUCHI KAZUHIKO , EJIRI YOSHINORI , ISHIKAWA DAI , SUGAMA CHIE , KAWANA YUKI
摘要： Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.

9. 发明专利

SG11201801847SA COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG11201801847SA
公开(公告)日：2018-04-27
申请号：SG11201801847S
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWANA YUKI , KURAFUCHI KAZUHIKO , EJIRI YOSHINORI , NAKAKO HIDEO , SUGAMA CHIE , ISHIKAWA DAI
IPC分类号： B22F7/08 , B22F1/00 , C04B37/00 , H01L21/52
摘要： Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 µm to 0.8 µm, and micro copper particles having a volume-average particle size of 2 µm to 50 µm, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.

10. 发明专利

SG11201801845WA ASSEMBLY AND SEMICONDUCTOR DEVICE 未知
公开(公告)号：SG11201801845WA
公开(公告)日：2018-04-27
申请号：SG11201801845W
申请日：2016-09-07
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKAKO HIDEO , KURAFUCHI KAZUHIKO , EJIRI YOSHINORI , ISHIKAWA DAI , SUGAMA CHIE , KAWANA YUKI
IPC分类号： B22F1/00 , B22F7/08 , C09J1/00 , H01L21/52
摘要： Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式